摘要:
A distribution of the concentration of initial point-defects which generate in an ion implanting process is obtained with an ion implanting simulator. As a local function of the distribution, the distribution of the intensity of absorption of point-defects is obtained. A term of absorption of point-defects obtained from the distribution of the intensity is included in a diffusion equation. With the resultant diffusion equation, the diffusion simulation is performed. Thus the simulation using the diffusion equation may be extended to two or three dimension and cope with various ion implanting conditions.
摘要:
For supply to first and second feedforward distortion compensating circuits 33(1), 33(2) connected in parallel, a two-divider 31 divides into signals of a common phase and a common amplitude an input or composite radio frequency signal supplied to an input terminal 11. The composite radio frequency signal collectively has a plurality of radio frequency signals of different frequencies. A two-combiner 35 combines component outputs of the feedforward circuits in inphase as an amplified output signal which is supplied to an output terminal 13. In general, N feedforward circuits (N being an integer not less than two) are connected in parallel and are supplied with the input radio frequency signal through an N-divider. Component outputs of the feedforward circuits are combined in inphase as the output signal by an N-combiner. Alternatively, the input radio frequency signal is divided into signals of a predetermined phase difference and of a common amplitude by the N-divider. In this case, the component outputs of the feedforward circuits are combined in a phase of cancelling the predetermined phase difference by the N-combiner.
摘要:
A device for testing an amplifier. A plurality of PN modulators are provided corresponding to a plurality of oscillators at stages preceding or following them, or fluctuation is given to division ratios at the oscillators. Since each of n carriers combined by a combiner contains phase fluctuation, the possibility that the peaks will overlap each other or that the carriers having opposite phases will negate each other is very low. The peak power in signals supplied to the amplifier to be tested is unlikely to vary, enabling accurate evaluation or testing.
摘要:
A design supporting apparatus of a semiconductor device, includes sections to perform: setting an impurity concentration with respect to a channel direction and a depth direction to node points arranged discretely in a channel region of a model transistor based on a predetermined concentration distribution rule; calculating an electric characteristic of the model transistor by using the impurity concentration; and storing the impurity concentration as a model parameter of the model transistor in a storage unit, when the calculated electric characteristic and an electric characteristic prepared previously are coincident with each other within a predetermined range. The device characteristic calculating section calculates a surface potential to each of the node points by reducing a dimension of the impurity concentration in the depth direction, corrects the surface potential based on interaction between the node points adjacent to each other, and calculates the electric characteristic by using the corrected surface potential.
摘要:
An analysis and design apparatus for semiconductor device, which utilizes a transistor model using accurate channel impurity concentration distribution are provided. The analysis and design apparatus includes a parameter setting portion that divides a channel region into a plurality of regions, and temporarily sets a plurality of impurity concentrations for the plurality of regions as a plurality of parameters. Further, the analysis and design apparatus includes an element characteristic calculation portion that values of electric characteristics of the transistor using surface potential that is calculated by solving a Poisson equation using a plurality of effective impurity concentrations. Moreover, the determination portion compares the calculated values with measured values read from a storage portion based on the structure information, and determines that the plurality of parameters for the transistor when the measured values correspond to the calculated values.
摘要:
A FET bias circuit applies a bias voltage that is not adjusted separately to an amplifying element FET of a FET amplifying circuit. In the FET bias circuit is provided a monitor element FET m having a gate connected to the gate of the amplifying element FET a and a source connected to the source of the amplifying element FET a, respectively, and having a drain current with respect to the bias voltage substantially proportional to the drain current of the amplifying element FET a. In the FET bias circuit is further provided a fixed bias circuit for applying the bias voltage so that the amplifying element FET a enters a predetermined operating class by applying a bias voltage to the monitor element FET m so that a drain current flowing to the monitor element FET m enters a predetermined operating class.
摘要翻译:FET偏置电路施加不与FET放大电路的放大元件FET单独调整的偏置电压。 在FET偏置电路中,提供了具有连接到放大元件FETa的栅极的栅极和连接到放大元件FET a的源极的源极的监视元件FET m,并且具有相对于 基本上与放大元件FET a的漏极电流成比例的偏置电压。 在FET偏置电路中还设置有用于施加偏置电压的固定偏置电路,使得放大元件FETa通过向监视元件FET m施加偏置电压而进入预定的工作等级,使得流向监视元件的漏极电流 FET m进入预定的操作类。
摘要:
A circuit simulation method for estimating electrical characteristics of a semiconductor device is provided. The circuit simulation method includes: (A) generating a device model parameter of a semiconductor device model used in a circuit simulation; and (B) executing the circuit simulation by using the semiconductor device model and the generated device model parameter. The (A) step includes: (a) generating a plurality of device model parameters with respect to a plurality of different temperatures; and (b) generating the device model parameter corresponding to a specified temperature by interpolating between the plurality of device model parameters.
摘要:
A diffusion simulating method which is capable of defining an impurity flux even if one impurity in one material region is changed into plural types of impurities in the other material region on a material interface. For simulating the diffusion of the impurities in a system which includes a first material region, a second material region and a interface disposed between the first material region and the second material region, impurity flux J(i.sub.A,j.sub.B) on the A/B interface is defined between optional impurity i.sub.A in material region A and optional impurity j.sub.B in material region B. Then, total fluxes J.sup.total (i.sub.A), J.sup.total (j.sub.B) of each type of impurity are determined and added to impurity diffusion equations, and simultaneous equations are set up by these diffusion equations and solved.