公开(公告)号：US20120080691A1

公开(公告)日：2012-04-05

申请号：US13151255

申请日：2011-06-01

Applicant: TZU-CHIEN HUNG ,  CHIA-HUI SHEN

Inventor： TZU-CHIEN HUNG ,  CHIA-HUI SHEN

IPC: H01L33/08

CPC classification number: H01L27/156 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/24

Abstract: An LED includes a substrate, a first P-type semiconductor layer formed on the substrate and a plurality of LED dies arranged on the first P-type semiconductor layer. The LED dies are electrically connected to each other in series. The present invention also relates to a method for making such an LED.

Abstract translation: LED包括基板，形成在基板上的第一P型半导体层和布置在第一P型半导体层上的多个LED管芯。 LED管芯串联电连接。 本发明还涉及制造这种LED的方法。

公开(公告)号：US20120077295A1

公开(公告)日：2012-03-29

申请号：US13095728

申请日：2011-04-27

Applicant: CHIA-HUI SHEN ,  TZU-CHIEN HUNG

Inventor： CHIA-HUI SHEN ,  TZU-CHIEN HUNG

IPC: H01L21/78

CPC classification number: H01L33/0095

Abstract: A method for dicing an LED (light emitting diode) wafer into multiple LED chips includes steps: providing an LED wafer, the LED wafer comprising a substrate, a first semiconductor layer, a light-emitting layer, a second semiconductor layer, and a transparent, electrically conductive film; forming a first channel in the LED wafer extending downwardly through the transparent, electrically conductive film, the second semiconductor layer and the light-emitting layer to the first semiconductor layer, thereby exposing the first semiconductor layer; forming a second channel within the first channel, the second channel extending downwardly through the first semiconductor layer to the substrate, thereby exposing a top face of the substrate; forming a groove in the top face of the substrate within the second channel by means of laser cutting; and dicing the LED wafer along the groove.

Abstract translation: 将LED（发光二极管）晶片切割成多个LED芯片的方法包括以下步骤：提供LED晶片，所述LED晶片包括基板，第一半导体层，发光层，第二半导体层和透明 ，导电膜; 在所述LED晶片中形成向下延伸穿过所述透明导电膜，所述第二半导体层和所述发光层到所述第一半导体层的第一通道，从而暴露所述第一半导体层; 在所述第一通道内形成第二通道，所述第二通道向下延伸穿过所述第一半导体层到所述衬底，从而暴露所述衬底的顶面; 通过激光切割在第二通道内在基板的顶面形成凹槽; 并沿着凹槽切割LED晶片。

公开(公告)号：US20120056233A1

公开(公告)日：2012-03-08

申请号：US13069393

申请日：2011-03-23

Applicant: TZU-CHIEN HUNG ,  CHIA-HUI SHEN

Inventor： TZU-CHIEN HUNG ,  CHIA-HUI SHEN

IPC: H01L33/48

CPC classification number: H01L33/642 ,  H01L33/54

Abstract: An LED package includes a base, an LED chip and an encapsulation. The LED chip is mounted on the base. The encapsulation encapsulates the LED chip. A heat dissipating plate is sandwiched between the LED chip and the base. The heat dissipating plate includes a first surface and a second surface. The LED chip is mounted on the first surface of the heat dissipating plate and has an interface engaging with the first surface of the heat dissipating plate. The first surface of the heat dissipating plate has an area greater than that of the interface. The second surface of the heat dissipating plate is attached to the base.

Abstract translation: LED封装包括底座，LED芯片和封装。 LED芯片安装在基座上。 封装封装了LED芯片。 散热板夹在LED芯片和基座之间。 散热板包括第一表面和第二表面。 LED芯片安装在散热板的第一表面上，并且具有与散热板的第一表面接合的界面。 散热板的第一表面的面积大于界面的面积。 散热板的第二表面附接到基座。

公开(公告)号：US20120032192A1

公开(公告)日：2012-02-09

申请号：US13041429

申请日：2011-03-06

Applicant: CHIA-HUI SHEN ,  TZU-CHIEN HUNG ,  JIAN-SHIHN TSANG

Inventor： CHIA-HUI SHEN ,  TZU-CHIEN HUNG ,  JIAN-SHIHN TSANG

IPC: H01L31/12 ,  H01L33/50

CPC classification number: H01L27/153 ,  H01L33/08 ,  H01L33/20 ,  H01L33/50

Abstract: A light emitting diode includes a first illumination region, a second illumination region, and the third illumination, wherein a first fluorescent conversion layer and a second fluorescent conversion layer cover the first illumination region and the second illumination region, respectively. The fluorescent conversion layers can convert lights from the illumination regions to other lights with different wavelengths whereby the light emitting diode generates light with multiple wavelengths.

Abstract translation: 发光二极管包括第一照明区域，第二照明区域和第三照明，其中第一荧光转换层和第二荧光转换层分别覆盖第一照明区域和第二照明区域。 荧光转换层可以将来自照明区域的光转换成具有不同波长的其他光，由此发光二极管产生具有多个波长的光。

公开(公告)号：US20120021545A1

公开(公告)日：2012-01-26

申请号：US13028158

申请日：2011-02-15

Applicant: TZU-CHIEN HUNG ,  CHIA-HUI SHEN

Inventor： TZU-CHIEN HUNG ,  CHIA-HUI SHEN

IPC: H01L33/26

CPC classification number: H01L33/0079 ,  H01L33/22

Abstract: A method of manufacturing a vertical light emitting diode includes: providing a first substrate; forming a lapping stop layer on the first substrate, the lapping stop layer being harder than the first substrate; depositing an epitaxial layer on the lapping stop layer; bonding a second substrate on the epitaxial layer; and removing the first substrate from the lapping stop layer.

Abstract translation: 制造垂直发光二极管的方法包括：提供第一衬底; 在所述第一基板上形成研磨停止层，所述研磨停止层比所述第一基板硬; 在研磨停止层上沉积外延层; 将外延层上的第二衬底接合; 以及从研磨停止层移除第一基底。

公开(公告)号：US20110291136A1

公开(公告)日：2011-12-01

申请号：US13094750

申请日：2011-04-26

Applicant: TZU-CHIEN HUNG ,  CHIA-HUI SHEN

Inventor： TZU-CHIEN HUNG ,  CHIA-HUI SHEN

IPC: H01L33/58

CPC classification number: H01L33/22 ,  H01L33/38

Abstract: A light-emitting element includes a substrate, a light-emitting module and at least two electrodes. The light-emitting module is formed on the substrate. The at least two electrodes are formed on the light-emitting module. Exterior surfaces of the light-emitting module are separated into a first part and a second part. The first part is defined between the at least two electrodes and the light-emitting module. The second part includes exterior surfaces not contacting the at least two electrodes. The first part is smooth. At least a part of the second part is rough.

Abstract translation: 发光元件包括基板，发光模块和至少两个电极。 发光模块形成在基板上。 至少两个电极形成在发光模块上。 发光模块的外表面被分离成第一部分和第二部分。 第一部分被限定在至少两个电极和发光模块之间。 第二部分包括不接触至少两个电极的外表面。 第一部分是顺利的。 第二部分的至少一部分是粗糙的。

公开(公告)号：US20110278631A1

公开(公告)日：2011-11-17

申请号：US13031620

申请日：2011-02-22

Applicant: CHIA-HUI SHEN ,  TZU-CHIEN HUNG

Inventor： CHIA-HUI SHEN ,  TZU-CHIEN HUNG

IPC: H01L33/38

CPC classification number: H01L33/38

Abstract: A light emitting diode (LED) chip includes a first electrode and a second electrode. Each of the first and second electrodes includes several trunks with at least one branch extending from at least one of the trunk, and at least one conductive pad serially connecting the trunks. A distance between a distal end of the branch of the first electrode and the conductive pad of the second electrode is less than that between any of other portions of the branch of the first electrode and the conductive pad of the second electrode, to thereby avoid crowded electric current formed at the first electrode and the conductive pad of the second electrode to save power accordingly.

Abstract translation: 发光二极管（LED）芯片包括第一电极和第二电极。 第一和第二电极中的每一个包括几个中继线，其中至少一个分支从至少一个干线延伸，以及至少一个导电焊盘串联连接中继线。 第一电极的分支的远端和第二电极的导电焊盘之间的距离小于第一电极的分支的其他部分和第二电极的导电焊盘之间的距离，从而避免拥挤 在第一电极和第二电极的导电焊盘上形成的电流相应地节省电力。

公开(公告)号：US08054779B2

公开(公告)日：2011-11-08

申请号：US11899276

申请日：2007-09-05

Applicant: Amer A. Hassan ,  Deyun Wu ,  Hui Shen ,  Christian Huitema ,  Thomas W. Kuehnel

Inventor： Amer A. Hassan ,  Deyun Wu ,  Hui Shen ,  Christian Huitema ,  Thomas W. Kuehnel

IPC: H04W4/00

CPC classification number: H04W8/22 ,  H04W88/06

Abstract: A system and method for providing the ability to discover the capabilities of a user's computer to determine whether it is capable of supporting more than one wireless protocol simultaneously is provided. A computing device's capabilities (including, for example, hardware and/or software capabilities) is checked to determine if it supports at least two specific wireless protocols and checking a computing device's capabilities (including, for example, hardware and/or software capabilities) is checked to determine if it supports both wireless protocols simultaneously. The techniques for determining the computing device's compatibility may include comparing lists of protocol requirements to lists of system capabilities and/or generating test signals by the system according to the protocol.

Abstract translation: 提供了一种用于提供发现用户计算机的能力以确定其是否能够同时支持多于一个无线协议的能力的系统和方法。 检查计算设备的能力（包括例如硬件和/或软件能力）以确定其是否支持至少两个特定的无线协议并且检查计算设备的能力（包括例如硬件和/或软件能力）是 检查以确定它是否同时支持两个无线协议。 用于确定计算设备的兼容性的技术可以包括将协议要求的列表与根据协议的系统的系统能力的列表和/或生成测试信号进行比较。

公开(公告)号：US20110266586A1

公开(公告)日：2011-11-03

申请号：US12951084

申请日：2010-11-22

Applicant: CHIA-HUI SHEN ,  TZU-CHIEN HUNG

Inventor： CHIA-HUI SHEN ,  TZU-CHIEN HUNG

IPC: H01L33/62 ,  H01L21/50

CPC classification number: H01L33/62 ,  H01L33/48 ,  H01L2224/16

Abstract: An LED package includes a base, an LED chip, and an encapsulant. The LED chip is mounted on the base, and is enclosed by the encapsulant. The base includes a substrate and a blocking wall integrally formed with the substrate. The blocking wall divides a surface of the substrate into a first bonding area and a second bonding area. An electrically conductive layer and a solder are formed on the bonding area in sequence. The blocking wall can block the first and second solder to overflow outside the first and second bonding area at soldering respectively. A method for manufacturing the LED package is also provided.

Abstract translation: LED封装包括基底，LED芯片和密封剂。 LED芯片安装在基座上，被密封剂包围。 底座包括与衬底一体形成的衬底和阻挡壁。 阻挡壁将基板的表面分成第一接合区域和第二接合区域。 依次在接合区域上形成导电层和焊料。 阻挡壁可以阻止第一和第二焊料分别在焊接的第一和第二接合区域的外部溢出。 还提供了用于制造LED封装的方法。

公开(公告)号：US07957827B2

公开(公告)日：2011-06-07

申请号：US11965565

申请日：2007-12-27

Applicant: Hui-Shen Shih ,  Yu-Fang Chien

Inventor： Hui-Shen Shih ,  Yu-Fang Chien

IPC: H01L21/00 ,  G01B5/02 ,  G01B3/22 ,  G01B5/20 ,  G01D1/00 ,  G06F15/00 ,  G06F19/00

CPC classification number: H01L22/20 ,  G05B2219/37224 ,  G05B2219/45031 ,  H01L22/12

Abstract: A method of controlling statuses of a plurality of wafers is described. A status of a wafer among the wafers is determined. An action related to the status is taken, according to the status determined, to the wafer and/or other wafers to improve a yield or yields thereof.

Abstract translation: 描述了一种控制多个晶片的状态的方法。 确定晶片中的晶片的状态。 根据所确定的状态，将与状态相关的动作作用于晶片和/或其他晶片以提高其产量或产量。