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公开(公告)号：US20210005484A1
公开(公告)日：2021-01-07
申请号：US16794068
申请日：2020-02-18
摘要： A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
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公开(公告)号：US20190262872A1
公开(公告)日：2019-08-29
申请号：US16283613
申请日：2019-02-22
发明人： Mark M. Stark , Alan E. Humphrey
IPC分类号： B08B1/02 , B32B27/08 , B32B27/36 , B32B27/32 , B32B27/28 , B65H18/10 , B65H20/02 , C11D17/04 , C11D11/00 , C11D7/32 , C11D7/22 , C11D7/26 , C11D7/24
摘要： Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on moveable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and moveable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.
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公开(公告)号：US20190201944A1
公开(公告)日：2019-07-04
申请号：US16290789
申请日：2019-03-01
CPC分类号： B08B7/0028 , B08B1/007 , G01R3/00
摘要： A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.
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公开(公告)号：US10239099B2
公开(公告)日：2019-03-26
申请号：US15818386
申请日：2017-11-20
摘要： A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.
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公开(公告)号：US20190019694A1
公开(公告)日：2019-01-17
申请号：US16136965
申请日：2018-09-20
发明人： Alan E. Humphrey , James H. Duvall , Jerry Broz
摘要： A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
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公开(公告)号：US09833818B2
公开(公告)日：2017-12-05
申请号：US13961127
申请日：2013-08-07
发明人： Alan E. Humphrey , Jerry J. Broz , James H. Duvall
CPC分类号： B08B7/0028 , B08B1/007 , G01R3/00
摘要： A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.
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公开(公告)号：US20140338698A1
公开(公告)日：2014-11-20
申请号：US13961127
申请日：2013-08-07
IPC分类号： B08B7/00
CPC分类号： B08B7/0028 , B08B1/007 , G01R3/00
摘要： A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.
摘要翻译： 一种设计用于从半导体工艺中使用的清洁晶片的工作表面除去异物和微粒的清洁膜。 这些过程包括用于清洁探针卡针的晶圆分类测试和用于在晶片处理设备和晶片卡盘期间清洁的FEOL工具。 通过颗粒去除膜除去收集在清洁晶片工作表面上的碎屑，使碎屑和异物被丢弃。 使用清洁膜允许操作者在不使用外部供应商的情况下刷新清洁晶片，并且在清洁过程中消除湿洗和使用溶剂。
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28.发明授权公开(公告)号：US11318550B2
公开(公告)日：2022-05-03
申请号：US16855841
申请日：2020-04-22
发明人： Alan E. Humphrey , Jerry J. Broz , Bret A. Humphrey , Alex S. Poles , Wayne C. Smith , Janakraj Shivlal
摘要： A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.
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29.发明授权公开(公告)号：US11035898B1
公开(公告)日：2021-06-15
申请号：US16872292
申请日：2020-05-11
发明人： Alan E. Humphrey , Jerry J. Broz , Wayne C. Smith , Mark M. Stark
摘要： A thermally conductive material, device, and method for predictably maintaining the temperature state and condition of the contact elements and support hardware of a tester interface, such as a probe card, for a testing apparatus, such as automated test equipment (ATE), that has a predetermined configuration applicable for the particular pin contact elements, thermal conditions. The thermally conductive device also has a substrate having a predefined form factor which can be readily introduced into the testing apparatus during normal testing operations. Unlike a patterned substrate that is constrained to specific probe element layouts, the unpatterned surface of the heat conductive device facilitates use with multiple probe card designs within numerous automated test equipment (ATE) tools.
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公开(公告)号：US10896828B2
公开(公告)日：2021-01-19
申请号：US16895106
申请日：2020-06-08
发明人： Alan E. Humphrey , James H. Duvall , Jerry Broz
摘要： A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
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