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公开(公告)号：US11756811B2
公开(公告)日：2023-09-12
申请号：US16460929
申请日：2019-07-02
IPC分类号： H01L21/67 , B65G47/91 , B08B1/02 , B08B7/00 , H01L21/683
CPC分类号： H01L21/67144 , B08B1/02 , B08B7/0028 , B65G47/91 , H01L21/6838
摘要： A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
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公开(公告)号：US20210001378A1
公开(公告)日：2021-01-07
申请号：US16460918
申请日：2019-07-02
摘要： A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
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3.发明申请公开(公告)号：US20210146464A1
公开(公告)日：2021-05-20
申请号：US16855841
申请日：2020-04-22
发明人： Alan E. Humphrey , Jerry J. Broz , Bret A. Humphrey , Alex S. Poles , Wayne C. Smith , Janakraj Shivlal
摘要： A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.
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公开(公告)号：US20210005499A1
公开(公告)日：2021-01-07
申请号：US16460877
申请日：2019-07-02
IPC分类号： H01L21/683 , B08B1/02
摘要： A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
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公开(公告)号：US10361169B2
公开(公告)日：2019-07-23
申请号：US15723151
申请日：2017-10-02
摘要： A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.
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公开(公告)号：US11211242B2
公开(公告)日：2021-12-28
申请号：US16684453
申请日：2019-11-14
摘要： A cleaning material, device, and method for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, in which the cleaning pad has a predetermined configuration appropriate for the particular pin contact elements and a substrate having a defined functionalized surface topology and geometry which can be introduced into the testing apparatus during the normal testing operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.
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公开(公告)号：US20210005484A1
公开(公告)日：2021-01-07
申请号：US16794068
申请日：2020-02-18
摘要： A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
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8.发明授权公开(公告)号：US10195648B2
公开(公告)日：2019-02-05
申请号：US14445003
申请日：2014-07-28
摘要： A cleaning material for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, has a cleaning pad layer, one or more intermediate layers having a set of predetermined characteristics and having a plurality of abrasive particles.
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公开(公告)号：US20180308821A1
公开(公告)日：2018-10-25
申请号：US15723151
申请日：2017-10-02
CPC分类号： H01L24/85 , B08B1/006 , B08B9/021 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/78 , H01L2224/02166 , H01L2224/45144 , H01L2224/45147 , H01L2224/48506 , H01L2224/7801 , H01L2224/78301 , H01L2224/85045 , H01L2224/85205 , H01L2924/00014
摘要： A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.
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10.发明授权公开(公告)号：US11318550B2
公开(公告)日：2022-05-03
申请号：US16855841
申请日：2020-04-22
发明人： Alan E. Humphrey , Jerry J. Broz , Bret A. Humphrey , Alex S. Poles , Wayne C. Smith , Janakraj Shivlal
摘要： A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.
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