-
公开(公告)号:US20180308821A1
公开(公告)日:2018-10-25
申请号:US15723151
申请日:2017-10-02
CPC分类号: H01L24/85 , B08B1/006 , B08B9/021 , B23K20/005 , B23K2101/40 , H01L24/45 , H01L24/78 , H01L2224/02166 , H01L2224/45144 , H01L2224/45147 , H01L2224/48506 , H01L2224/7801 , H01L2224/78301 , H01L2224/85045 , H01L2224/85205 , H01L2924/00014
摘要: A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.
-
2.
公开(公告)号:US20210146464A1
公开(公告)日:2021-05-20
申请号:US16855841
申请日:2020-04-22
发明人: Alan E. Humphrey , Jerry J. Broz , Bret A. Humphrey , Alex S. Poles , Wayne C. Smith , Janakraj Shivlal
摘要: A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.
-
公开(公告)号:US10361169B2
公开(公告)日:2019-07-23
申请号:US15723151
申请日:2017-10-02
摘要: A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.
-
4.
公开(公告)号:US11318550B2
公开(公告)日:2022-05-03
申请号:US16855841
申请日:2020-04-22
发明人: Alan E. Humphrey , Jerry J. Broz , Bret A. Humphrey , Alex S. Poles , Wayne C. Smith , Janakraj Shivlal
摘要: A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.
-
公开(公告)号:US09825000B1
公开(公告)日:2017-11-21
申请号:US15495873
申请日:2017-04-24
CPC分类号: H01L24/85 , B23K20/005 , B23K20/26 , B23K2101/40 , H01L24/78 , H01L2224/7801 , H01L2224/78101 , H01L2224/78611 , H01L2224/85075 , H01L2224/851 , H01L2224/85203
摘要: A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.
-
-
-
-