Method of forming gate oxide layer in semiconductor devices
    24.
    发明授权
    Method of forming gate oxide layer in semiconductor devices 有权
    在半导体器件中形成栅氧化层的方法

    公开(公告)号:US06878575B2

    公开(公告)日:2005-04-12

    申请号:US10727125

    申请日:2003-12-03

    CPC classification number: H01L21/28202 H01L21/3144 H01L29/513 H01L29/518

    Abstract: Methods of preparing improved semiconductor substrates having gate oxide layers formed thereon, and use of such substrates in fabricating improved semiconductor devices, are disclosed. The methods include a first step of performing a cleaning process for removing a natural oxide layer formed on a semiconductor substrate and also for removing an oxide layer generated by the removal of the natural oxide layer; a second step of executing a hydrogen annealing process to form a hydrogen passivation layer and for further reducing a surface roughness of the semiconductor substrate completed in the cleaning process; a third step of forming a gate oxide layer thereon; a fourth step of performing a nitridation process on the gate oxide layer to prevent the semiconductor substrate from a permeation of ions during a subsequent gate electrode formation step; and, a fifth step of performing a subsequent thermal process to stabilize a surface of the gate oxide layer, thereby improving a defect rate of the device caused in forming the gate oxide layer.

    Abstract translation: 公开了制备其上形成有栅氧化层的改进的半导体衬底的方法,以及这些衬底在制造改进的半导体器件中的用途。 所述方法包括进行用于去除形成在半导体衬底上的自然氧化物层的清洁工艺以及去除通过除去天然氧化物层而产生的氧化物层的第一步骤; 执行氢退火处理以形成氢钝化层并进一步降低在清洁过程中完成的半导体衬底的表面粗糙度的第二步骤; 在其上形成栅氧化层的第三步骤; 在栅极氧化层上进行氮化处理以防止半导体衬底在随后的栅电极形成步骤期间渗透离子的第四步骤; 以及进行后续热处理以稳定栅极氧化物层的表面的第五步骤,从而提高在形成栅极氧化物层时引起的器件的缺陷率。

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