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    Methods of selectively forming epitaxial semiconductor layer on single crystalline semiconductor and semiconductor devices fabricated using the same
    2.
    发明授权
    Methods of selectively forming epitaxial semiconductor layer on single crystalline semiconductor and semiconductor devices fabricated using the same 有权
    在使用其制造的单晶半导体和半导体器件上选择性地形成外延半导体层的方法

    公开(公告)号：US07611973B2

    公开(公告)日：2009-11-03

    申请号：US11154236

    申请日：2005-06-16

    申请人： Dong-Suk Shin ,  Hwa-Sung Rhee ,  Tetsuji Ueno ,  Ho Lee ,  Seung-Hwan Lee

    发明人： Dong-Suk Shin ,  Hwa-Sung Rhee ,  Tetsuji Ueno ,  Ho Lee ,  Seung-Hwan Lee

    IPC分类号： H01L21/20 ,  H01L21/36

    CPC分类号： H01L21/28044 ,  H01L21/02378 ,  H01L21/02381 ,  H01L21/02529 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02636 ,  H01L29/66628 ,  H01L29/66772

    摘要： In methods of selectively forming an epitaxial semiconductor layer on a single crystalline semiconductor and semiconductor devices fabricated using the same, a single crystalline epitaxial semiconductor layer and a non-single crystalline epitaxial semiconductor layer are formed on a single crystalline semiconductor and a non-single crystalline semiconductor pattern respectively, using a main semiconductor source gas and a main etching gas. The non-single crystalline epitaxial semiconductor layer is removed using a selective etching gas. The main gases and the selective etching gas are alternately and repeatedly supplied at least two times to selectively form an elevated single crystalline epitaxial semiconductor layer having a desired thickness only on the single crystalline semiconductor. The selective etching gas suppresses formation of an epitaxial semiconductor layer on the non-single crystalline semiconductor pattern.

    摘要翻译： 在单晶半导体上选择性地形成外延半导体层的方法和使用其制造的半导体器件的方法中，单晶外延半导体层和非单晶外延半导体层形成在单晶半导体和非单晶 半导体图案，分别使用主半导体源气体和主蚀刻气体。 使用选择性蚀刻气体去除非单晶外延半导体层。 主要气体和选择性蚀刻气体交替地和重复地供应至少两次以选择性地形成仅在单晶半导体上具有期望厚度的升高的单晶外延半导体层。 选择性蚀刻气体抑制在非单晶半导体图案上形成外延半导体层。

    Semiconductor device having analog transistor with improved operating and flicker noise characteristics and method of making same
    4.
    发明申请
    Semiconductor device having analog transistor with improved operating and flicker noise characteristics and method of making same 有权
    具有具有改善的操作和闪烁噪声特性的模拟晶体管的半导体器件及其制造方法

    公开(公告)号：US20080036006A1

    公开(公告)日：2008-02-14

    申请号：US11802281

    申请日：2007-05-22

    申请人： Tetsuji Ueno ,  Hwa-sung Rhee ,  Ho Lee

    发明人： Tetsuji Ueno ,  Hwa-sung Rhee ,  Ho Lee

    IPC分类号： H01L29/94 ,  H01L21/8238

    CPC分类号： H01L27/092 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/4933 ,  H01L29/665 ,  H01L29/7843 ,  H01L29/7848

    摘要： A semiconductor device with improved transistor operating and flicker noise characteristics includes a substrate, an analog NMOS transistor and a compressively-strained-channel analog PMOS transistor disposed on the substrate. The device also includes a first etch stop liner (ESL) and a second ESL which respectively cover the NMOS transistor and the PMOS transistor. The relative measurement of flicker noise power of the NMOS and PMOS transistors to flicker noise power of reference unstrained-channel analog NMOS and PMOS transistors at a frequency of 500 Hz is less than 1.

    摘要翻译： 具有改善的晶体管操作和闪烁噪声特性的半导体器件包括衬底，模拟NMOS晶体管和设置在衬底上的压缩应变通道模拟PMOS晶体管。 该器件还包括分别覆盖NMOS晶体管和PMOS晶体管的第一蚀刻停止衬垫（ESL）和第二ESL。 在500 Hz频率下，NMOS和PMOS晶体管的闪烁噪声功率相对于参考无约束通道模拟NMOS和PMOS晶体管的闪烁噪声功率的相对测量值小于1。

    CMOS semiconductor devices having elevated source and drain regions and methods of fabricating the same
    6.
    发明申请
    CMOS semiconductor devices having elevated source and drain regions and methods of fabricating the same 有权
    具有升高的源极和漏极区域的CMOS半导体器件及其制造方法

    公开(公告)号：US20060131656A1

    公开(公告)日：2006-06-22

    申请号：US11285978

    申请日：2005-11-23

    申请人： Dong-Suk Shin ,  Hwa-Sung Rhee ,  Tetsuji Ueno ,  Ho Lee ,  Seung-Hwan Lee

    发明人： Dong-Suk Shin ,  Hwa-Sung Rhee ,  Tetsuji Ueno ,  Ho Lee ,  Seung-Hwan Lee

    IPC分类号： H01L29/94

    CPC分类号： H01L29/7834 ,  H01L21/265 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/665 ,  H01L29/6653 ,  H01L29/6656 ,  H01L29/66628

    摘要： A Complementary Metal Oxide Semiconductor (CMOS) device is provided. The CMOS device includes an isolation layer provided in a semiconductor substrate to define first and second active regions. First and second gate patterns are disposed to cross over the first and second active regions, respectively. A first elevated source region and a first elevated drain region are disposed at both sides of the first gate pattern respectively, and a second elevated source region and a second elevated drain region are disposed at both sides of the second gate pattern respectively. The first elevated source/drain regions are provided on the first active region, and the second elevated source/drain regions are provided on the second active region. A first gate spacer is provided between the first gate pattern and the first elevated source/drain regions. A second gate spacer is provided to cover edges of the second elevated source/drain regions adjacent to the second gate pattern and an upper sidewall of the second gate pattern. Methods of fabricating the CMOS device is also provided.

    摘要翻译： 提供互补金属氧化物半导体（CMOS）器件。 CMOS器件包括设置在半导体衬底中以限定第一和第二有源区的隔离层。 第一和第二栅极图案分别设置成跨越第一和第二有源区域。 第一升高的源极区域和第一升高的漏极区域分别设置在第一栅极图案的两侧，并且第二升高的源极区域和第二升高的漏极区域分别设置在第二栅极图案的两侧。 第一升高的源极/漏极区域设置在第一有源区上，而第二升高的源极/漏极区域设置在第二有源区域上。 在第一栅极图案和第一升高的源极/漏极区域之间提供第一栅极间隔物。 设置第二栅极间隔物以覆盖与第二栅极图案相邻的第二升高的源极/漏极区域和第二栅极图案的上侧壁的边缘。 还提供了制造CMOS器件的方法。

    Methods of fabricating a semiconductor device using a selective epitaxial growth technique
    7.
    发明申请
    Methods of fabricating a semiconductor device using a selective epitaxial growth technique 有权
    使用选择性外延生长技术制造半导体器件的方法

    公开(公告)号：US20060088968A1

    公开(公告)日：2006-04-27

    申请号：US11299447

    申请日：2005-12-08

    申请人： Dong-Suk Shin ,  Hwa-Sung Rhee ,  Tetsuji Ueno ,  Ho Lee ,  Seung-Hwan Lee

    发明人： Dong-Suk Shin ,  Hwa-Sung Rhee ,  Tetsuji Ueno ,  Ho Lee ,  Seung-Hwan Lee

    IPC分类号： H01L21/336

    CPC分类号： H01L29/7848 ,  H01L29/165 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/7834

    摘要： Methods of fabricating a semiconductor device using a selective epitaxial growth technique include forming a recess in a semiconductor substrate. The substrate having the recess is loaded into a reaction chamber. A semiconductor source gas and a main etching gas are injected into the reaction chamber to selectively grow an epitaxial semiconductor layer on a sidewall and on a bottom surface of the recess. A selective etching gas is injected into the reaction chamber to selectively etch a fence of the epitaxial semiconductor layer which is adjacent to the sidewall of the recess and grown to a level that is higher than an upper surface of the semiconductor substrate.

    摘要翻译： 使用选择性外延生长技术制造半导体器件的方法包括在半导体衬底中形成凹部。 将具有凹部的基板装入反应室。 将半导体源气体和主蚀刻气体注入到反应室中，以选择性地在凹槽的侧壁和底表面上生长外延半导体层。 选择性蚀刻气体被注入到反应室中，以选择性地蚀刻外延半导体层的与凹槽的侧壁相邻的栅栏，并生长到高于半导体衬底的上表面的水平。

    Method of forming MOS transistor having fully silicided metal gate electrode
    9.
    发明申请
    Method of forming MOS transistor having fully silicided metal gate electrode 有权

    公开(公告)号：US20060008961A1

    公开(公告)日：2006-01-12

    申请号：US11158978

    申请日：2005-06-22

    申请人： Seung-Hwan Lee ,  Dong-Suk Shin ,  Hwa-Sung Rhee ,  Tetsuji Ueno ,  Ho Lee

    发明人： Seung-Hwan Lee ,  Dong-Suk Shin ,  Hwa-Sung Rhee ,  Tetsuji Ueno ,  Ho Lee

    IPC分类号： H01L21/336 ,  H01L21/8234

    CPC分类号： H01L29/4975 ,  H01L21/28097 ,  H01L21/823835 ,  H01L21/823842 ,  H01L29/665 ,  H01L29/6653 ,  H01L29/66545 ,  H01L29/6656 ,  H01L29/66628 ,  H01L29/66636

    摘要： Methods of fabricating a MOS transistor having a fully silicided metal gate electrode are provided. The method includes forming an isolation layer in a predetermined region of a semiconductor substrate to define an active region. An insulated gate pattern which crosses over the active region is formed. A spacer is formed on sidewalls of the gate pattern. A selective epitaxial growth process is applied to form semiconductor layers on the gate pattern and on the active region at both sides of the gate pattern. In this case, a poly-crystalline semiconductor layer is formed on the gate pattern while single-crystalline semiconductor layers are concurrently formed on the active region at both sides of the gate pattern. The semiconductor layers are selectively etched to form a gate-reduced pattern and elevated source and drain regions. Respective desired thicknesses of the gate-reduced pattern and the elevated source and drain regions may be obtained using an etch selectivity between the poly-crystalline semiconductor layer and the single-crystalline semiconductor layer. A silicidation process is applied to the semiconductor substrate where the gate-reduced pattern is formed to simultaneously form a fully silicided metal gate electrode and elevated source and drain silicide layers.

    Semiconductor device having analog transistor with improved operating and flicker noise characteristics and method of making same
    10.
    发明授权
    Semiconductor device having analog transistor with improved operating and flicker noise characteristics and method of making same 有权
    具有具有改善的操作和闪烁噪声特性的模拟晶体管的半导体器件及其制造方法

    公开(公告)号：US08445968B2

    公开(公告)日：2013-05-21

    申请号：US13091327

    申请日：2011-04-21

    申请人： Tetsuji Ueno ,  Hwa-sung Rhee ,  Ho Lee

    发明人： Tetsuji Ueno ,  Hwa-sung Rhee ,  Ho Lee

    IPC分类号： H01L21/70

    CPC分类号： H01L27/092 ,  H01L21/823807 ,  H01L21/823814 ,  H01L29/4933 ,  H01L29/665 ,  H01L29/7843 ,  H01L29/7848

    摘要： A semiconductor device with improved transistor operating and flicker noise characteristics includes a substrate, an analog NMOS transistor and a compressively-strained-channel analog PMOS transistor disposed on the substrate. The device also includes a first etch stop liner (ESL) and a second ESL which respectively cover the NMOS transistor and the PMOS transistor. The relative measurement of flicker noise power of the NMOS and PMOS transistors to flicker noise power of reference unstrained-channel analog NMOS and PMOS transistors at a frequency of 500 Hz is less than 1.

    摘要翻译： 具有改善的晶体管操作和闪烁噪声特性的半导体器件包括衬底，模拟NMOS晶体管和设置在衬底上的压缩应变通道模拟PMOS晶体管。 该器件还包括分别覆盖NMOS晶体管和PMOS晶体管的第一蚀刻停止衬垫（ESL）和第二ESL。 在500 Hz频率下，NMOS和PMOS晶体管的闪烁噪声功率相对于参考无约束通道模拟NMOS和PMOS晶体管的闪烁噪声功率的相对测量值小于1。