Abstract:
A semiconductor device includes an isolation pattern on a substrate, the isolation pattern having a lower insulating pattern on the substrate, and a spacer to cover side surfaces of the lower insulating pattern, a vertical structure through the isolation pattern to contact the substrate, the vertical structure having a first semiconductor layer on the substrate, a lower end of the first semiconductor layer being at a lower level than a lower surface of the isolation pattern, a second semiconductor layer on the first semiconductor layer, and a third semiconductor layer on the second semiconductor layer, and a gate electrode crossing the vertical structure and extending over the isolation pattern.
Abstract:
Erosion of chalcogenides in phase change memories using ovonic threshold switch selectors can be reduced by controlling columnar morphology in electrodes used in the ovonic threshold switch. The columnar morphology may cause cracks to occur which allow etchants used to etch the ovonic threshold switch to sneak through the ovonic threshold switch and to attack chalcogenides, either in the switch or in the memory element. In one embodiment, the electrode may be split into two metal nitride layers separated by an intervening metal layer.
Abstract:
A method, device and system are provided for programming a flash memory device, the method including executing a bit line setup operation, and executing a channel pre-charge operation simultaneously with the bit line setup operation, the channel pre-charge operation including applying a channel pre-charge voltage to all word lines; and the device including a voltage generator disposed for providing each of a program voltage, a read voltage, a pass voltage, and a channel pre-charge voltage, a high-voltage switch connected to the voltage generator and disposed for switchably providing one of the program voltage, read voltage, pass voltage, or channel pre-charge voltage, and control logic connected to the high-voltage switch and disposed for simultaneously executing a bit line setup operation and a channel pre-charge operation, the channel pre-charge operation comprising controlling the high-voltage switch to apply the channel pre-charge voltage to both selected and unselected word lines of the device.
Abstract:
Subject matter disclosed herein relates to a method of manufacturing a semiconductor integrated circuit device, and more particularly to a method of fabricating a phase change memory device.