Apparatus for treating substrate
    21.
    发明申请
    Apparatus for treating substrate 有权
    用于处理基材的设备

    公开(公告)号:US20070163711A1

    公开(公告)日:2007-07-19

    申请号:US11524320

    申请日:2006-09-21

    IPC分类号: H01L21/306

    CPC分类号: H01L21/67051 H01L21/6708

    摘要: There is provided an apparatus for treating a substrate using a plurality of treatment solutions in sequence. The apparatus includes treatment liquid collecting vessels for separately collecting used treatment solutions, and an exhaust member for separately discharging pollutant gases generated during a process.

    摘要翻译: 提供了使用多个处理液依次处理基板的装置。 该设备包括用于分别收集使用的处理溶液的处理液收集容器和用于分别排出在处理过程中产生的污染气体的排气构件。

    APPARATUS AND METHOD FOR TREATING SUBSTRATE
    22.
    发明申请
    APPARATUS AND METHOD FOR TREATING SUBSTRATE 审中-公开
    用于处理基板的装置和方法

    公开(公告)号:US20130081658A1

    公开(公告)日:2013-04-04

    申请号:US13609986

    申请日:2012-09-11

    IPC分类号: B08B3/00

    摘要: Provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes a housing providing a space for performing a process, and a plurality of support members vertically arranged in the housing at predetermined intervals to support edges of substrates, respectively.

    摘要翻译: 提供了一种通过超临界方法处理衬底的装置和方法。 该装置包括一个提供进行处理的空间的壳体,以及以预定的间隔垂直地布置在壳体中的多个支撑构件,以分别支撑基板的边缘。

    Apparatus and method for treating substrate
    23.
    发明授权
    Apparatus and method for treating substrate 有权
    底物处理装置及方法

    公开(公告)号:US08122899B2

    公开(公告)日:2012-02-28

    申请号:US11809170

    申请日:2007-05-31

    IPC分类号: B08B3/12 B08B6/00

    摘要: An apparatus is provided for supplying a plurality of chemicals or gases to the surface of a substrate to clean and dry the substrate. The apparatus includes a substrate support unit with a chuck on which a substrate is loaded, a bottom chamber having an open top and configured to surround the circumference of the chuck, a top chamber configured to open or close the top of the bottom chamber such that a drying treatment for the substrate is performed while the substrate is isolated from the outside, and an indirect injection nozzle installed at the edge of the top chamber and configured to inject drying fluid toward the center of the top chamber such that the drying fluid is indirectly injected to the substrate. According to the apparatus, it is possible to enhance a substrate drying efficiency, suppress external contamination, and prevent the formation of an oxide layer.

    摘要翻译: 提供了一种用于将多种化学物质或气体供应到基底表面以清洁和干燥基底的装置。 该装置包括具有卡盘的基板支撑单元,其上装载有基板,底部室具有敞开的顶部并且构造成围绕卡盘的圆周;顶部腔室,其构造成打开或关闭底部腔室的顶部,使得 在将基板从外部隔离的同时进行基板的干燥处理,以及间接注入喷嘴,其安装在顶部室的边缘并且被配置为朝向顶部室的中心注入干燥流体,使得干燥流体间接地 注入基材。 根据该装置,能够提高基板干燥效率,抑制外部污染,防止形成氧化物层。

    Apparatus for supplying chemical liquid
    24.
    发明授权
    Apparatus for supplying chemical liquid 有权
    用于提供化学液体的设备

    公开(公告)号:US07900853B2

    公开(公告)日:2011-03-08

    申请号:US12248085

    申请日:2008-10-09

    IPC分类号: B05B1/28

    CPC分类号: H01L21/6708

    摘要: Provided is an apparatus for supplying chemical liquid. The apparatus includes: a plurality of nozzles, each of which can be moved forward or backward and supplies chemical liquid; a nozzle cover which accommodates the nozzles therein and has an open end to allow each of the nozzles to move into or out of the nozzle cover; and a nozzle driver which moves each of the nozzles forward or backward.

    摘要翻译: 提供了一种用于供应化学液体的装置。 该装置包括:多个喷嘴,每个喷嘴可向前或向后移动并供应化学液体; 喷嘴盖,其在其中容纳喷嘴并具有开口端,以允许每个喷嘴移入或移出喷嘴盖; 以及使每个喷嘴向前或向后移动的喷嘴驱动器。

    Method and apparatus for cleaning substrates
    25.
    发明申请
    Method and apparatus for cleaning substrates 有权
    洗涤基材的方法和设备

    公开(公告)号:US20070283983A1

    公开(公告)日:2007-12-13

    申请号:US11796885

    申请日:2007-04-30

    IPC分类号: B08B5/04 B08B3/02 C23G5/04

    摘要: Provided is an apparatus for cleaning and drying a substrate by applying a plurality of chemicals and gases to the substrate. The apparatus may include: a substrate support member including a chuck receiving a substrate; a first nozzle member injecting a drying fluid onto a top surface of the substrate for drying the substrate; a low cover including an opened top and enclosing the chuck; and an upper cover selectively closing the opened top of the low cover so as to dry the substrate in a closed space. Therefore, the apparatus dries a substrate more efficiently and protects the substrate from being contaminated by foreign pollutants. Furthermore, generation of an undesired oxidation layer on the substrate can be prevented.

    摘要翻译: 提供了一种用于通过向基板施加多种化学物质和气体来清洁和干燥基板的装置。 该装置可以包括:基板支撑构件,其包括容纳基板的卡盘; 第一喷嘴构件,其将干燥流体注入到所述基板的顶表面上以干燥所述基板; 低盖,包括打开的顶部并包围卡盘; 并且上盖选择性地闭合低盖的开口顶部,以便在封闭空间中干燥基板。 因此,该装置更有效地干燥基板,并保护基板免受外来污染物的污染。 此外,可以防止在基板上产生不期望的氧化层。

    Facility with Multi-Storied Process Chamber for Cleaning Substrates and Method for Cleaning Substrates Using the Facility
    26.
    发明申请
    Facility with Multi-Storied Process Chamber for Cleaning Substrates and Method for Cleaning Substrates Using the Facility 有权
    用于清洁基材的多层过程室的设施和使用设施清洁基材的方法

    公开(公告)号:US20070224820A1

    公开(公告)日:2007-09-27

    申请号:US10574113

    申请日:2004-10-07

    IPC分类号: H01L21/302

    摘要: A facility for cleaning substrates such as semiconductor wafers includes a loading/unloading part, an aligning part where wafers are repositioned from a horizontal state to a vertical state, a cleaning part performing etchant-treating, rinsing, and drying processes for wafers and having a plurality of process chamber stacked, and an interface part where a transfer bath is disposed to transfer wafers between the process chambers. When the wafers are transferred between the process chamber, the transfer bath is filled with deionized water (DI water) to prevent their exposure to the air. Wafers drawn out of the loading/unlading part are repositioned from a horizontal state to a vertical state and are transferred to a first process chamber being one of the process chambers to be subjected to a part of processes. After the wafers are transferred to a second process chamber being the other one of the process chambers to be subjected to the other processes, they are repositioned from a vertical state to a horizontal state. That is, the wafers are transferred along a loop shape to be processed.

    摘要翻译: 用于清洁诸如半导体晶片的基板的设备包括装载/卸载部分,其中晶片从水平状态重新定位到垂直状态的对准部分,执行晶片的蚀刻处理,漂洗和干燥处理的清洁部件,并且具有 多个处理室堆叠,以及界面部分,其中设置传送槽以在处理室之间传送晶片。 当晶片在处理室之间转移时,转移浴用去离子水(DI水)填充,以防止它们暴露于空气中。 从加载/非拉伸部分引出的晶片从水平状态重新定位到垂直状态,并被转移到作为处理室之一进行一部分处理的第一处理室。 在将晶片转移到作为要进行其它处理的另一个处理室的第二处理室之后,它们从垂直状态重新定位到水平状态。 也就是说,晶片沿着要被处理的环形传送。