公开(公告)号：US20090166008A1

公开(公告)日：2009-07-02

申请号：US11964913

申请日：2007-12-27

Applicant: CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

Inventor： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC: F28D15/04 ,  H01L23/427

CPC classification number: F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat spreader for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, a working liquid contained between the lower plate and the upper plate, and a wick structure formed between the lower plate and the upper plate. Each of the upper plate and the lower plate defines a cavity receiving a portion of the wick structure therein, and a plurality of grooves extending radially from the cavity to a periphery thereof.

Abstract translation: 用于冷却电子部件的散热器包括下板，固定在下板上的上板，容纳在下板和上板之间的工作液，以及形成在下板与上板之间的芯结构。 上板和下板中的每一个限定了容纳其中的芯结构的一部分的空腔，以及从空腔径向延伸到其周边的多个凹槽。

公开(公告)号：US20090095959A1

公开(公告)日：2009-04-16

申请号：US11964836

申请日：2007-12-27

Applicant: CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

Inventor： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC: H01L33/00 ,  F28F7/00

CPC classification number: F21K9/00 ,  F21V29/51 ,  F21V29/75 ,  F21V29/763 ,  F21Y2115/10 ,  F28D15/0233 ,  F28F3/02 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation device for removing heat from LED chips includes a heat sink and a plurality of substrates. The heat sink comprises a base plate. A plurality of fins extends upwardly from the base plate. The substrates each have a unidirectional heat transfer and are attached to a bottom face of the heat sink. Each of the substrates defines a first wall on which The LED chips are mounted and a second wall coupled to the heat sink. The substrates only transfer heat from the first wall to the second wall and restrict the heat transfer in a reverse direction. When the LED chips generate heat, the heat is transferred to the fins of the heat sink via the unidirectional substrates to lower temperature of the LED chips.

Abstract translation: 用于从LED芯片除去热量的散热装置包括散热器和多个基板。 散热器包括基板。 多个翅片从基板向上延伸。 基板各自具有单向热传递并且附接到散热器的底面。 每个基板限定了其上安装有LED芯片的第一壁和耦合到散热器的第二壁。 基板仅将热量从第一壁传递到第二壁并限制相反方向的热传递。 当LED芯片产生热量时，热量通过单向基板传递到散热器的散热片，降低LED芯片的温度。

公开(公告)号：US20090095448A1

公开(公告)日：2009-04-16

申请号：US11959434

申请日：2007-12-18

Applicant: CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

Inventor： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC: F28D15/00

CPC classification number: F21V29/763 ,  F21K9/00 ,  F21V29/75 ,  F21Y2113/00 ,  F21Y2115/10 ,  F28D15/0233 ,  F28F3/02 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation device for removing heat from LED chips includes a finned heat sink, a plurality of heat pipes and a plurality of heat conductive substrates. The heat sink comprises a base plate and a plurality of fins formed on the base plate. The heat pipes which transfer heat in a unidirectional manner are embedded in the base plate. Each of the heat pipes defines a first wall and a second wall coupled to the heat sink. The heat pipes only transfer heat from the first walls to the second walls and restrict a heat transfer in a reversed direction. The substrates are in contact with first walls of the heat pipes. The LED chips are mounted on the substrates. When the LED chips generate heat, the heat is transferred to the fins via the unidirectional heat pipes to lower the temperature of the LED chips.

Abstract translation: 用于从LED芯片除去热量的散热装置包括翅片式散热器，多个热管和多个导热基板。 散热器包括基板和形成在基板上的多个散热片。 将单向传热的热管嵌入基板中。 每个热管限定了耦合到散热器的第一壁和第二壁。 热管仅将热量从第一壁传递到第二壁并限制相反方向的热传递。 基板与热管的第一壁接触。 LED芯片安装在基板上。 当LED芯片产生热量时，热量通过单向热管传递到散热片，以降低LED芯片的温度。

公开(公告)号：US20090089729A1

公开(公告)日：2009-04-02

申请号：US11863252

申请日：2007-09-28

Applicant: Li Ding ,  Peivand Tehrani ,  Jindrich Zejda ,  Alireza Kasnavi

Inventor： Li Ding ,  Peivand Tehrani ,  Jindrich Zejda ,  Alireza Kasnavi

IPC: G06F17/50

CPC classification number: G06F17/5031

Abstract: A method to perform timing analysis for a complex logic cell with distorted input waveform and coupled load networks is presented. Timing arc based models are used in conjunction with CCB based current models of portions of the logic cell to compute the output signal of the logic cell. For example, an intermediary signal is generated using a first timing arc based model and an equivalent coupled network output signal is generated using a channel connected block (CCB) based current model.

Abstract translation: 提出了一种对具有失真输入波形和耦合负载网络的复杂逻辑单元执行定时分析的方法。 基于时间弧的模型与基于CCB的当前模型的逻辑单元的部分结合使用以计算逻辑单元的输出信号。 例如，使用基于第一定时弧的模型生成中间信号，并且使用基于信道连接块（CCB）的当前模型生成等效的耦合网络输出信号。

公开(公告)号：US07479781B2

公开(公告)日：2009-01-20

申请号：US11440318

申请日：2006-05-24

Applicant: Kang Wu ,  Wei Zhang ,  Jun Huang ,  Li Ding

Inventor： Kang Wu ,  Wei Zhang ,  Jun Huang ,  Li Ding

IPC: G01R31/00

CPC classification number: H04L43/50

Abstract: A system and method for testing a Link Control Card (LCC) of a storage device includes a host, a middle plane (MP), a switch, and a testing device array. The host is connected to the testing device array for sending out command sets and receiving results. The MP is connected between the LCC and the testing device array. The switch determines the LCC to output hard reset signals and the hard reset signals are transferred to the testing device array via the MP. The testing device array includes a plurality of testing devices, and each of the testing devices includes a micro-controller unit (MCU); a connector being connected to the MCU, and coupled to the MP; an address setting unit being connected to the MCU, for setting an unique address of each of the testing devices; and a first interface being connected to the MCU for outputting results.

Abstract translation: 用于测试存储设备的链路控制卡（LCC）的系统和方法包括主机，中间平面（MP），交换机和测试设备阵列。 主机连接到测试设备阵列，用于发送命令集和接收结果。 MP连接在LCC和测试设备阵列之间。 该开关确定LCC输出硬复位信号，硬复位信号通过MP传输到测试器件阵列。 测试装置阵列包括多个测试装置，并且每个测试装置包括微控制器单元（MCU）; 连接器连接到MCU，并连接到MP; 连接到MCU的地址设置单元，用于设置每个测试设备的唯一地址; 以及连接到MCU的第一接口，用于输出结果。

公开(公告)号：US07457122B2

公开(公告)日：2008-11-25

申请号：US11309225

申请日：2006-07-13

Applicant: Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

Inventor： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC: H05K7/20

CPC classification number: G11C5/143 ,  H01L23/3672 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.

Abstract translation: 存储模块组件包括其上具有发热电子部件（14）的印刷电路板（10）和安装在印刷电路板的相对侧上的第一和第二散热板（20），（30）。 第一散热板包括从其一侧延伸的第一钩（24），第一钩包括从第一散热板的端部延伸的阻挡部分（242）和从第一散热板的一端延伸的第一接合部分（244） 用于抵抗印刷电路板和第二散热板的抵抗部分的自由端。 第二散热板在其一侧限定了与第一钩接合的凹部（34）。 第一和第二散热板的另一侧彼此接合以将印刷电路板夹在第一和第二散热板之间。

公开(公告)号：US07438449B2

公开(公告)日：2008-10-21

申请号：US11621759

申请日：2007-01-10

Applicant: Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

Inventor： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC: B60Q1/06

CPC classification number: F21V29/004 ,  F21V17/164 ,  F21V29/51 ,  F21V29/763 ,  F21Y2115/10 ,  Y10S362/80

Abstract: An LED module includes a latching component, a frame holding an LED thereon, a heat spreader located in the latching component and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The latching component cooperates with the heat spreader to tightly press the frame being attached on the heat spreader. The heat transfer member thermally connects with the heat spreader and transfers heat from the LED to an ambient environment. The latching component has two spring pieces pushing the frame toward the heat spreader and the heat pipe. The spring pieces electrically engage with the frame to thereby electrically connect with the LED.

Abstract translation: LED模块包括闩锁部件，保持LED的框架，位于闩锁部件中的散热器和具有远离LED的散热单元和与散热器热连接的热管的传热部件， LED和散热单元。 闩锁部件与散热器配合，以紧紧地按压附着在散热器上的框架。 传热构件与散热器热连接并将热量从LED传递到周围环境。 闩锁部件具有两个弹簧片，将框架推向散热器和热管。 弹簧片与框架电接合，从而与LED电连接。

公开(公告)号：US20080241158A1

公开(公告)日：2008-10-02

申请号：US11896125

申请日：2007-08-29

Applicant: Preeti G. Lal ,  Richard C. Graul ,  April J.A. Hafalia ,  Narinder K. Chawla ,  Michael B. Thornton ,  Danniel B. Nguyen ,  Yan Lu ,  Ameena R. Gandhi ,  Chandra S. Arvizu ,  Deborah A. Kallick ,  Mariah R. Baughn ,  Jayalaxmi Ramkumar ,  Catherine M. Tribouley ,  Ernestine A. Lee ,  Li Ding ,  Neil Burford ,  Monique G. Yao ,  Junming Yang ,  Jennifer A. Griffin

Inventor： Preeti G. Lal ,  Richard C. Graul ,  April J.A. Hafalia ,  Narinder K. Chawla ,  Michael B. Thornton ,  Danniel B. Nguyen ,  Yan Lu ,  Ameena R. Gandhi ,  Chandra S. Arvizu ,  Deborah A. Kallick ,  Mariah R. Baughn ,  Jayalaxmi Ramkumar ,  Catherine M. Tribouley ,  Ernestine A. Lee ,  Li Ding ,  Neil Burford ,  Monique G. Yao ,  Junming Yang ,  Jennifer A. Griffin

IPC: A61K39/395 ,  C07K14/00 ,  C07H21/00 ,  C12N1/21 ,  C12P21/00 ,  C07K16/00 ,  C07K1/14 ,  A61P35/00 ,  A61P25/00 ,  A61P9/00 ,  G01N33/00 ,  G01N33/68 ,  C12Q1/68 ,  A61K38/16 ,  G01N33/53

CPC classification number: C07K14/705 ,  A61K38/00 ,  G01N2333/4719 ,  Y10T436/143333

Abstract: The invention provides human G-protein coupled receptors (GCREC) and polynucleotides which identify and encode GCREC. The invention also provides expression vectors, host cells, antibodies, agonists, and antagonists. The invention also provides methods for diagnosing, treating, or preventing disorders associated with aberrant expression of GCREC.

Abstract translation: 本发明提供鉴定和编码GCREC的人G-蛋白偶联受体（GCREC）和多核苷酸。 本发明还提供表达载体，宿主细胞，抗体，激动剂和拮抗剂。 本发明还提供用于诊断，治疗或预防与GCREC异常表达相关的疾病的方法。

公开(公告)号：US20080165536A1

公开(公告)日：2008-07-10

申请号：US11621759

申请日：2007-01-10

Applicant: CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

Inventor： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC: F21V29/00

CPC classification number: F21V29/004 ,  F21V17/164 ,  F21V29/51 ,  F21V29/763 ,  F21Y2115/10 ,  Y10S362/80

Abstract: An LED module includes a latching component, a frame holding an LED thereon, a heat spreader located in the latching component and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The latching component cooperates with the heat spreader to tightly press the frame being attached on the heat spreader. The heat transfer member thermally connects with the heat spreader and transfers heat from the LED to an ambient environment. The latching component has two spring pieces pushing the frame toward the heat spreader and the heat pipe. The spring pieces electrically engage with the frame to thereby electrically connect with the LED.

Abstract translation: LED模块包括闩锁部件，保持LED的框架，位于闩锁部件中的散热器和具有远离LED的散热单元和与散热器热连接的热管的传热部件， LED和散热单元。 闩锁部件与散热器配合，以紧紧地按压附着在散热器上的框架。 传热构件与散热器热连接并将热量从LED传递到周围环境。 闩锁部件具有两个弹簧片，将框架推向散热器和热管。 弹簧片与框架电接合，从而与LED电连接。

公开(公告)号：US07391613B2

公开(公告)日：2008-06-24

申请号：US11308839

申请日：2006-05-12

Applicant: Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

Inventor： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC: H05K7/20

CPC classification number: H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A memory module assembly includes a printed circuit board (10) having a main heat-generating electronic component (52) thereon, first and second heat sinks (20), (30) attached on opposite sides of the printed circuit board and a clamp (40) clamping the first, second heat sinks and the printed circuit board together. The first heat sink comprises a pair of positioning poles (24). The second heat sink comprises a heat pipe (36) disposed therein and thermally connecting therewith. The clamp comprises a connecting portion (42) and a pair of elastic pressing portions (44). The clamp resiliently presses the second heat sink toward the main heat-generating electronic component and the first heat sink engages with the second heat sink via the positioning poles of the first heat sink extending in and engaging with the second heat sink.

Abstract translation: 存储模块组件包括其上具有主要发热电子部件（52）的印刷电路板（10），安装在印刷电路板的相对侧上的第一和第二散热器（20），（30）和夹具 40）将第一，第二散热器和印刷电路板夹在一起。 第一散热器包括一对定位极（24）。 第二散热器包括设置在其中并与其热连接的热管（36）。 夹具包括连接部分（42）和一对弹性按压部分（44）。 夹具将第二散热器弹性地压向主发热电子部件，并且第一散热器经由第一散热器的定位极与第二散热器接合，第一散热器的定位极延伸并与第二散热器接合。