Abstract:
A matching degree computing apparatus is provided for comparing an input image and an object template image and computing a matching degree between an input image and an object template image based on the compared result. The computing apparatus includes a transforming unit for transforming the input image so as to be matched to the template object region and a computing unit for computing a matching degree between the transformed input image and the template image. The transforming unit provides a shaping unit for shaping a non-background region to the form of the template object region in the object corresponding region of the input image and a processing unit for arranging the non-background region contacting with the template object corresponding region so that the non-background region has no substantial impact on the matching degree in the object non-corresponding region of the input image.
Abstract:
A data management equipment connected with a general inspection system for detecting a defect candidate on a wafer and acquiring a location thereof, a design data server for storing a design data for a semiconductor circuit and a defect review system for acquiring a defect data image on the basis of the location and comparing the defect candidate image with a defect-free reference image to identify a defect. The data management equipment includes a first detecting unit for finding that the general inspection system is acquiring a location, a storage controlling unit responsive to the finding to start to store the location from the general inspection system in a storage unit and a defect-circumferential design data acquiring unit for acquiring from a portion of the design data a defect-circumferential design data such that a reference image including the location can be produced from the defect-circumferential design data.
Abstract:
An operator-free and fully automated semiconductor inspection system with high throughput is realized. All conditions required for capturing and inspection are generated from design information such as CAD data. In order to perform actual inspection under the conditions, a semiconductor inspection system is composed of a navigation system for generating all the conditions required for capturing and inspection from the design information and a scanning electron microscope system for actually performing capturing and inspection. Moreover, in the case of performing a matching process between designed data and a SEM image, deformed parts are corrected by use of edge information in accordance with multiple directions and smoothing thereof. Furthermore, a SEM image corresponding to a detected position is re-registered as a template, and the matching process is thereby performed.
Abstract:
Information indicating the reason for a failure of template matching is provided. Difference information between a first image, which is referred to as a template, and a third image that is selected by the operator from a second image and that is larger than the template is displayed.
Abstract:
It is an object of the present invention to obtain an image which is focused on all portions of a sample and to provide a charged particle beam apparatus capable of obtaining a two-dimensional image which has no blurred part over an entire sample. In order to achieve the above object, the present invention comprises means for changing a focus condition of a charged particle beam emitted from a charged particle source, a charged particle detector for detecting charged particles irradiated from a surface portion of said sample in response to the emitted charged particle beam, and means for composing a two-dimensional image of the surface portion of the sample based on signals on which said charged particle beam is focused, said signals being among signals output from the charged particle detector.
Abstract:
This invention is to provide a shape measuring device and a shape measuring method that can accurately measure a cross-sectional shape or a three-dimensional shape of a sample without using matching of characteristics. A shape measuring apparatus comprises a charged particle beam apparatus comprising a processor for measuring detected charged particles signal generated from the sample. The charged particle beam is irradiated to sample at first angle to generate a first signal and second angle to generate second signal. The processor selects a parameter indicating a relation between the first signal and a height of the sample or an inclination angle of the specimen until the first signal which achieves the second signal.
Abstract:
The present invention relates to a method and apparatus for measuring a three-dimensional profile using a SEM, capable of accurately measuring the three-dimensional profile of even a flat surface or a nearly vertical surface based on the inclination angle dependence of the amount of secondary electron image signal detected by the SEM. Specifically, a tilt image obtaining unit obtains a tilt image (a tilt secondary electron image) I(2) of flat regions a and c1 on a pattern to be measured by using an electron beam incident on the pattern from an observation direction φ(2). Then, profile measuring units presume the slope (or surface inclination angle) at each point on the pattern based on the obtained tilt image and integrate successively each presumed slope value (or surface inclination angle value) to measure three-dimensional profiles S2a and S2c. This arrangement allows a three-dimensional profile to be accurately measured.
Abstract:
It is an object of the present invention to obtain an image which is focused on all portions of a sample and to provide a charged particle beam apparatus capable of obtaining a two-dimensional image which has no blurred part over an entire sample. In order to achieve the above object, the present invention comprises means for changing a focus condition of a charged particle beam emitted from a charged particle source, a charged particle detector for detecting charged particles irradiated from a surface portion of said sample in response to the emitted charged particle beam, and means for composing a two-dimensional image of the surface portion of the sample based on signals on which said charged particle beam is focused, said signals being among signals output from the charged particle detector.
Abstract:
This invention is to provide a shape measuring device and a shape measuring method that can accurately measure a cross-sectional shape or a three-dimensional shape of a sample without using matching of characteristics. A shape measuring apparatus comprises a charged particle beam apparatus comprising a processor for measuring detected charged particles signal generated from the sample. The charged particle beam is irradiated to sample at first angle to generate a first signal and second angle to generate second signal. The processor selects a parameter indicating a relation between the first signal and a height of the sample or an inclination angle of the specimen until the first signal which achieves the second signal.
Abstract:
A ceramic article having a base made of an insulating ceramic material, the insulating ceramic material includes a metal element, and a conductive surface layer provided on the base, wherein the conductive surface layer includes carbon atoms as its main component, and wherein the conductive surface layer further includes silicon atoms and atoms of the metal element present in the insulating ceramic material.