METHOD AND APPARATUS FOR COMPUTING DEGREE OF MATCHING
    21.
    发明申请
    METHOD AND APPARATUS FOR COMPUTING DEGREE OF MATCHING 有权
    用于计算匹配度的方法和装置

    公开(公告)号:US20090232405A1

    公开(公告)日:2009-09-17

    申请号:US12401848

    申请日:2009-03-11

    Abstract: A matching degree computing apparatus is provided for comparing an input image and an object template image and computing a matching degree between an input image and an object template image based on the compared result. The computing apparatus includes a transforming unit for transforming the input image so as to be matched to the template object region and a computing unit for computing a matching degree between the transformed input image and the template image. The transforming unit provides a shaping unit for shaping a non-background region to the form of the template object region in the object corresponding region of the input image and a processing unit for arranging the non-background region contacting with the template object corresponding region so that the non-background region has no substantial impact on the matching degree in the object non-corresponding region of the input image.

    Abstract translation: 提供了一种匹配度计算装置,用于比较输入图像和对象模板图像,并且基于比较结果计算输入图像和对象模板图像之间的匹配度。 计算装置包括:变换单元,用于变换输入图像以与模板对象区域匹配;以及计算单元,用于计算变换后的输入图像与模板图像之间的匹配度。 变换单元提供一个成形单元,用于将非背景区域形成为输入图像的对象对应区域中的模板对象区域的形式;以及处理单元,用于布置与模板对象对应区域接触的非背景区域 非背景区域对输入图像的对象非对应区域中的匹配度没有实质影响。

    DATA MANAGEMENT EQUIPMENT USED TO DEFECT REVIEW EQUIPMENT AND TESTING SYSTEM CONFIGURATIONS
    22.
    发明申请
    DATA MANAGEMENT EQUIPMENT USED TO DEFECT REVIEW EQUIPMENT AND TESTING SYSTEM CONFIGURATIONS 审中-公开
    用于缺陷审查设备和测试系统配置的数据管理设备

    公开(公告)号:US20090074286A1

    公开(公告)日:2009-03-19

    申请号:US12205419

    申请日:2008-09-05

    Abstract: A data management equipment connected with a general inspection system for detecting a defect candidate on a wafer and acquiring a location thereof, a design data server for storing a design data for a semiconductor circuit and a defect review system for acquiring a defect data image on the basis of the location and comparing the defect candidate image with a defect-free reference image to identify a defect. The data management equipment includes a first detecting unit for finding that the general inspection system is acquiring a location, a storage controlling unit responsive to the finding to start to store the location from the general inspection system in a storage unit and a defect-circumferential design data acquiring unit for acquiring from a portion of the design data a defect-circumferential design data such that a reference image including the location can be produced from the defect-circumferential design data.

    Abstract translation: 与用于检测晶片上的缺陷候选物并获取其位置的一般检查系统连接的数据管理设备,用于存储半导体电路的设计数据的设计数据服务器和用于获取半导体电路的缺陷数据图像的缺陷审查系统 并且将缺陷候选图像与无缺陷参考图像进行比较以识别缺陷。 数据管理设备包括用于发现一般检查系统正在获取位置的第一检测单元,响应于发现的存储控制单元开始将来自一般检查系统的位置存储在存储单元中的缺陷周边设计 数据获取单元,用于从设计数据的一部分获取缺陷圆周设计数据,使得可以从缺陷圆周设计数据产生包括位置的参考图像。

    Semiconductor inspection system
    23.
    发明申请

    公开(公告)号:US20070194236A1

    公开(公告)日:2007-08-23

    申请号:US11790224

    申请日:2007-04-24

    CPC classification number: H01J37/28

    Abstract: An operator-free and fully automated semiconductor inspection system with high throughput is realized. All conditions required for capturing and inspection are generated from design information such as CAD data. In order to perform actual inspection under the conditions, a semiconductor inspection system is composed of a navigation system for generating all the conditions required for capturing and inspection from the design information and a scanning electron microscope system for actually performing capturing and inspection. Moreover, in the case of performing a matching process between designed data and a SEM image, deformed parts are corrected by use of edge information in accordance with multiple directions and smoothing thereof. Furthermore, a SEM image corresponding to a detected position is re-registered as a template, and the matching process is thereby performed.

    Shape measuring device and shape measuring method
    26.
    发明授权
    Shape measuring device and shape measuring method 有权
    形状测量装置和形状测量方法

    公开(公告)号:US07078688B2

    公开(公告)日:2006-07-18

    申请号:US10927536

    申请日:2004-08-27

    CPC classification number: G01B15/04 H01J2237/2816

    Abstract: This invention is to provide a shape measuring device and a shape measuring method that can accurately measure a cross-sectional shape or a three-dimensional shape of a sample without using matching of characteristics. A shape measuring apparatus comprises a charged particle beam apparatus comprising a processor for measuring detected charged particles signal generated from the sample. The charged particle beam is irradiated to sample at first angle to generate a first signal and second angle to generate second signal. The processor selects a parameter indicating a relation between the first signal and a height of the sample or an inclination angle of the specimen until the first signal which achieves the second signal.

    Abstract translation: 本发明提供一种形状测量装置和形状测量方法,其可以在不使用特性匹配的情况下精确地测量样品的横截面形状或三维形状。 一种形状测量装置包括带电粒子束装置,其包括用于测量从样本产生的检测到的带电粒子信号的处理器。 带电粒子束以第一角度照射到样品上以产生第一信号和第二角度以产生第二信号。 处理器选择指示第一信号和样本高度之间的关系的参数或样本的倾斜角,直到实现第二信号的第一信号为止。

    Method and apparatus for measuring three-dimensional shape of specimen by using SEM
    27.
    发明申请
    Method and apparatus for measuring three-dimensional shape of specimen by using SEM 有权
    用SEM测量样品三维形状的方法和装置

    公开(公告)号:US20050285034A1

    公开(公告)日:2005-12-29

    申请号:US11156478

    申请日:2005-06-21

    CPC classification number: H01J37/28 H01J2237/2814

    Abstract: The present invention relates to a method and apparatus for measuring a three-dimensional profile using a SEM, capable of accurately measuring the three-dimensional profile of even a flat surface or a nearly vertical surface based on the inclination angle dependence of the amount of secondary electron image signal detected by the SEM. Specifically, a tilt image obtaining unit obtains a tilt image (a tilt secondary electron image) I(2) of flat regions a and c1 on a pattern to be measured by using an electron beam incident on the pattern from an observation direction φ(2). Then, profile measuring units presume the slope (or surface inclination angle) at each point on the pattern based on the obtained tilt image and integrate successively each presumed slope value (or surface inclination angle value) to measure three-dimensional profiles S2a and S2c. This arrangement allows a three-dimensional profile to be accurately measured.

    Abstract translation: 本发明涉及一种用于使用SEM测量三维轮廓的方法和装置,其能够基于二次侧的量的倾斜角度依赖性精确地测量均匀的平面或几乎垂直的表面的三维轮廓 电子图像信号由SEM检测。 具体地说,倾斜图像获取单元通过使用从观察方向phi入射到图案上的电子束来获得待测图案上的平坦区域a和c 1的倾斜图像(倾斜二次电子图像)I(2) 2)。 然后,轮廓测量单元基于所获得的倾斜图像来假设在图案上的每个点处的斜率(或表面倾斜角),并且连续地积分每个假设的斜率值(或表面倾斜角值),以测量三维轮廓S 2a和 S 2 c。 这种布置允许精确地测量三维轮廓。

    Shape measuring device and shape measuring method
    29.
    发明申请
    Shape measuring device and shape measuring method 有权
    形状测量装置和形状测量方法

    公开(公告)号:US20050061973A1

    公开(公告)日:2005-03-24

    申请号:US10927536

    申请日:2004-08-27

    CPC classification number: G01B15/04 H01J2237/2816

    Abstract: This invention is to provide a shape measuring device and a shape measuring method that can accurately measure a cross-sectional shape or a three-dimensional shape of a sample without using matching of characteristics. A shape measuring apparatus comprises a charged particle beam apparatus comprising a processor for measuring detected charged particles signal generated from the sample. The charged particle beam is irradiated to sample at first angle to generate a first signal and second angle to generate second signal. The processor selects a parameter indicating a relation between the first signal and a height of the sample or an inclination angle of the specimen until the first signal which achieves the second signal.

    Abstract translation: 本发明提供一种形状测量装置和形状测量方法,其可以在不使用特性匹配的情况下精确地测量样品的横截面形状或三维形状。 一种形状测量装置包括带电粒子束装置,其包括用于测量从样本产生的检测到的带电粒子信号的处理器。 带电粒子束以第一角度照射到样品上以产生第一信号和第二角度以产生第二信号。 处理器选择指示第一信号和样本高度之间的关系的参数或样本的倾斜角,直到实现第二信号的第一信号为止。

    Ceramic articles and method for manufacturing the same
    30.
    发明授权
    Ceramic articles and method for manufacturing the same 失效
    陶瓷制品及其制造方法

    公开(公告)号:US06265077B1

    公开(公告)日:2001-07-24

    申请号:US09260941

    申请日:1999-03-02

    Abstract: A ceramic article having a base made of an insulating ceramic material, the insulating ceramic material includes a metal element, and a conductive surface layer provided on the base, wherein the conductive surface layer includes carbon atoms as its main component, and wherein the conductive surface layer further includes silicon atoms and atoms of the metal element present in the insulating ceramic material.

    Abstract translation: 一种陶瓷制品,其具有由绝缘陶瓷材料制成的基底,所述绝缘陶瓷材料包括金属元件和设置在所述基底上的导电表面层,其中所述导电表面层包括碳原子作为其主要成分,并且其中所述导电表面 层还包括存在于绝缘陶瓷材料中的金属元素的硅原子和原子。

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