Lithium composite oxide sintered body plate

    公开(公告)号:US12224423B2

    公开(公告)日:2025-02-11

    申请号:US17495004

    申请日:2021-10-06

    Abstract: Provided is a lithium complex oxide sintered plate for use in a positive electrode of a lithium secondary battery. The lithium complex oxide sintered plate has a structure in which a plurality of primary grains having a layered rock-salt structure are bonded, and has a porosity of 3 to 40%, a mean pore diameter of 15 μm or less, an open porosity of 70% or more, and a thickness of 15 to 200 μm. The plurality of primary grains has a primary grain diameter, i.e., a mean diameter of the primary grains, of 20 μm or less and a mean tilt angle of more than 0° to 30° or less. The mean tilt angle is a mean value of the angles defined by the (003) planes of the primary grains and the plate face of the lithium complex oxide sintered plate.

    CONDUCTIVITY MEASUREMENT METHOD
    23.
    发明申请

    公开(公告)号:US20250035575A1

    公开(公告)日:2025-01-30

    申请号:US18794011

    申请日:2024-08-05

    Abstract: A conductivity measurement method of measuring a conductivity of a liquid includes: a) measuring a first complex impedance between a first detection electrode and a second detection electrode at a first frequency with the liquid being in contact with a protective layer to face each of the first detection electrode and the second detection electrode through the protective layer; b) extracting a first extraction value from the first complex impedance according to a predetermined extraction rule; and c) deciding the conductivity of the liquid based on the first extraction value. In the extraction rule, a real part of a complex impedance is considered, and an imaginary part of the complex impedance is ignored.

    Member for semiconductor manufacturing apparatus

    公开(公告)号:US12211729B2

    公开(公告)日:2025-01-28

    申请号:US18346951

    申请日:2023-07-05

    Abstract: A member for a semiconductor manufacturing apparatus includes: a ceramic plate that has a wafer placement surface at an upper surface thereof; a plug disposition hole that extends through the ceramic plate in an up-down direction and that has a truncated conical space whose upper opening is larger than a lower opening thereof; a truncated conical plug that is disposed in the plug disposition hole, that allows gas to flow in the up-down direction, and whose upper surface is larger than a lower surface thereof; an adhesive layer that is provided between the plug disposition hole and the truncated conical plug; an electrically conductive baseplate that is joined to a lower surface of the ceramic plate through a joint layer; and a gas supply path that is provided in the baseplate and the joint layer and that supplies gas to the truncated conical plug.

    Electrostatic chuck assembly
    25.
    发明授权

    公开(公告)号:US12211725B2

    公开(公告)日:2025-01-28

    申请号:US18165454

    申请日:2023-02-07

    Abstract: There is provided an electrostatic chuck assembly including: an electrode-embedded ceramic plate; a cooling plate that supports a bottom surface of the ceramic plate and has an internal space of an annular or arcuate shape; an internal fixation member of an annular or arcuate shape accommodated in the internal space so as to be rotatable about a central axis of the cooling plate; female threads in a multiple of n, which is an integer of 2 or more, spaced apart from each other in the internal fixation member; and n insertion holes for insertion of bolts for being fixed to a chamber, the insertion holes each being provided at the bottom of the cooling plate such that one set of n female threads is exposed. Each of the female threads is disposed such that another set of n female threads is exposed in the insertion holes when rotated.

    Wafer placement table
    26.
    发明授权

    公开(公告)号:US12211671B2

    公开(公告)日:2025-01-28

    申请号:US18171837

    申请日:2023-02-21

    Abstract: A wafer placement table includes: a ceramic substrate having a wafer placement surface at an upper surface, and incorporating an electrode; a cooling substrate which is bonded to a lower surface of the ceramic substrate, and in which a refrigerant flow path is formed; a power supply terminal connected to the electrode; and a power supply terminal hole vertically penetrating the cooling substrate and storing the power supply terminal. The power supply terminal hole intersects with the refrigerant flow path.

    Honeycomb structure and exhaust gas purifying device

    公开(公告)号:US12209526B2

    公开(公告)日:2025-01-28

    申请号:US17460756

    申请日:2021-08-30

    Abstract: A pillar shaped honeycomb structure, including: an outer peripheral wall; and a porous partition wall disposed inside the outer peripheral wall, the a porous partition wall defining a plurality of cells, each of the cells extending from one end face to other end face to form a flow path, wherein a surface of the porous partition wall in the cells comprise a collecting layer having an average pore diameter lower than that of the porous partition wall; and wherein magnetic particles having a Curie point of 700° C. or higher are provided either or both between the surfaces of the porous partition wall and the collecting layer, and on the collecting layer.

    Metal member and production method therefor

    公开(公告)号:US12209313B2

    公开(公告)日:2025-01-28

    申请号:US17447322

    申请日:2021-09-10

    Abstract: A metal member includes a metal substrate, a first intermediate plating layer, a second intermediate plating layer, and a precious metal plating layer. The metal substrate includes a surface constituted of a plurality of crystal grains. The first intermediate plating layer is directly formed on the plurality of crystal grains of the metal substrate, contains a nickel element, and is non-oriented with respect to each crystal orientation of the plurality of crystal grains of the metal substrate. The second intermediate plating layer is directly formed on the first intermediate plating layer. The precious metal plating layer is formed on the second intermediate plating layer.

    CERAMIC WIRING MEMBER
    29.
    发明申请

    公开(公告)号:US20250024592A1

    公开(公告)日:2025-01-16

    申请号:US18898781

    申请日:2024-09-27

    Abstract: The electroconductive portion has a structure including: an electroconductive phase, which is made of a metal component containing at least one of W or Mo and has a plurality of air gaps dispersed so as to be separated from each other; and glass phases, which are contained in at least some of the plurality of air gaps and have an area ratio of 3% or more and 20% or less on a cross section of the plate-shaped portion taken in a thickness direction. A proportion of the number of the glass phases, each having an aspect ratio of 1.5 or less, to a total number of the glass phases on the cross section of the plate-shaped portion taken in the thickness direction is 40% or more.

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