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    PRESSURE SENSOR MODULE AND ELECTRONIC COMPONENT
    24.
    发明申请
    PRESSURE SENSOR MODULE AND ELECTRONIC COMPONENT 有权
    压力传感器模块和电子元件

    公开(公告)号：US20120036936A1

    公开(公告)日：2012-02-16

    申请号：US13281959

    申请日：2011-10-26

    申请人： Satoshi Yamamoto ,  Hirokazu Hashimoto

    发明人： Satoshi Yamamoto ,  Hirokazu Hashimoto

    IPC分类号： G01L7/08

    CPC分类号： G01L9/0054 ,  G01L19/0069 ,  G01L19/148 ,  H01L2224/05001 ,  H01L2224/16225 ,  H01L2924/07811 ,  H01L2924/00

    摘要： A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate.

    摘要翻译： 压力传感器模块包括压力传感器，凸块和层压基板。 压力传感器包括半导体衬底; 一个空腔 压敏元件; 和导电部分。 空腔设置在半导体衬底的内部，使得设置半导体衬底的薄板区域，并且将薄板区域定义为膜片。 压敏元件设置在隔膜上。 导电部分电连接到压敏元件并且设置在除了隔膜之外的区域的半导体衬底的表面上。 凸块电连接到导电部分。 层压基板包括经由凸块与压力传感器电连接的布线基材。 配线基材配置在层叠基板的内部。 布线基材的表面电连接到凸块并具有来自层叠基板的露出区域。

    Cyclic amine compound
    25.
    发明授权
    Cyclic amine compound 有权
    环胺化合物

    公开(公告)号：US08013008B2

    公开(公告)日：2011-09-06

    申请号：US12516733

    申请日：2007-11-29

    申请人： Atsushi Hasuoka ,  Satoshi Yamamoto

    发明人： Atsushi Hasuoka ,  Satoshi Yamamoto

    IPC分类号： A61K31/402 ,  C07D207/12

    CPC分类号： C07D207/12

    摘要： A compound represented by the formula (I) each symbol of which is defined in the specification, or a salt thereof which has a superior androgen receptor regulating activity.

    摘要翻译： 由式（I）表示的化合物，其各符号在说明书中定义，或其盐具有优越的雄激素受体调节活性。

    Chemically amplified positive resist composition
    26.
    发明授权
    Chemically amplified positive resist composition 有权
    化学放大正光刻胶组合物

    公开(公告)号：US08003296B2

    公开(公告)日：2011-08-23

    申请号：US12536386

    申请日：2009-08-05

    申请人： Masahiko Shimada ,  Kazuhiko Hashimoto ,  Junji Shigematsu ,  Takayuki Miyagawa ,  Satoshi Yamamoto

    发明人： Masahiko Shimada ,  Kazuhiko Hashimoto ,  Junji Shigematsu ,  Takayuki Miyagawa ,  Satoshi Yamamoto

    IPC分类号： G03F7/004

    CPC分类号： G03F7/0397 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0395 ,  Y10S430/108 ,  Y10S430/111

    摘要： The present invention provides a chemically amplified positive composition comprising: (A) a resin comprising a structural unit having an acid-labile group and being itself insoluble or poorly soluble in an alkali aqueous solution but becoming soluble in an alkali aqueous solution by the action of an acid, (B) a resin comprising a structural unit represented by the formula (I): wherein R1 represents a hydrogen atom, a halogen atom, a C1-C4 alkyl group or a C1-C4 perfluoroalkyl group, Z represents a single bond or —(CH2)k—CO—X4—, k represents an integer of 1 to 4, X1, X2, X3 and X4 each independently represents an oxygen atom or a sulfur atom, m represents an integer of 1 to 3 and n represents an integer of 0 to 3, and a structural unit having a fluorine atom in a side chain, and an acid generator.

    摘要翻译： 本发明提供了一种化学放大阳性组合物，其包含：（A）包含具有酸不稳定基团的结构单元的树脂，其本身不溶于或难溶于碱性水溶液，但通过作用于 酸，（B）包含由式（I）表示的结构单元的树脂：其中R1表示氢原子，卤素原子，C1-C4烷基或C1-C4全氟烷基，Z表示单键 或 - （CH 2）k -CO-X 4 - ，k表示1〜4的整数，X 1，X 2，X 3，X 4各自独立地表示氧原子或硫原子，m表示1〜3的整数，n表示 0〜3的整数，侧链具有氟原子的结构单元和酸发生剂。

    METHOD FOR PRODUCING MOLDED ARTICLE
    27.
    发明申请
    METHOD FOR PRODUCING MOLDED ARTICLE 有权
    生产模制品的方法

    公开(公告)号：US20110104380A1

    公开(公告)日：2011-05-05

    申请号：US12997194

    申请日：2009-06-09

    申请人： Atsushi Yusa ,  Tetsuya Ano ,  Satoshi Yamamoto ,  Toshiyuki Ogano

    发明人： Atsushi Yusa ,  Tetsuya Ano ,  Satoshi Yamamoto ,  Toshiyuki Ogano

    IPC分类号： B05D1/18 ,  B29C45/18

    CPC分类号： B29C45/1704 ,  B29C44/348 ,  B29C45/1642

    摘要： The present invention provides a method for producing a molded article which enables dissolution of a desired amount of a subject material in a molten resin without any limitation by the solubility of a high-pressure carbon dioxide in the molten resin and which is therefore suitable for commercial production of molded articles. The present invention pertains to a method for producing a molded article by molding a molten resin, and this method is characterized by including steps of supplying a high-pressure carbon dioxide and a subject material dissolved therein, into the molten resin; kneading the molten resin into which the high-pressure carbon dioxide and the subject material have been supplied; and exhausting the high-pressure carbon dioxide from the kneaded molten resin.

    摘要翻译： 本发明提供了一种能够将所需量的主题材料溶解在熔融树脂中的模塑制品的方法，而不受高压二氧化碳在熔融树脂中的溶解度的限制，因此适用于商业 模制品的生产。 本发明涉及一种通过模制熔融树脂来生产模制品的方法，该方法的特征在于包括将溶解在其中的高压二氧化碳和被摄体材料供给到熔融树脂中的步骤; 捏合已经供应高压二氧化碳和主体材料的熔融树脂; 并从捏合的熔融树脂中排出高压二氧化碳。

    PROCESS FOR PRODUCING COMPOSITE MATERIAL COMPRISING RESIN MOLDED PRODUCT
    28.
    发明申请
    PROCESS FOR PRODUCING COMPOSITE MATERIAL COMPRISING RESIN MOLDED PRODUCT 审中-公开
    用于生产包含树脂模制产品的复合材料的方法

    公开(公告)号：US20110020550A1

    公开(公告)日：2011-01-27

    申请号：US12921912

    申请日：2009-03-12

    申请人： Hironori Ota ,  Atsushi Yusa ,  Satoshi Yamamoto

    发明人： Hironori Ota ,  Atsushi Yusa ,  Satoshi Yamamoto

    IPC分类号： C23C18/28 ,  C23C18/54 ,  C23C18/31

    CPC分类号： C23C18/30 ,  C08J7/06 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1682 ,  C23C18/1685 ,  C23C18/2073 ,  C23C18/31

    摘要： The present invention provides a method for allowing a metal complex to stably penetrate into a polymer and immobilizing the metal complex in the polymer by a low temperature treatment, in a batch processing for a plating pre-treatment wherein the metal complex is allowed to penetrate into the polymer with the use of high-pressure carbon dioxide. In particular, the present invention provides a method for producing a composite material containing a resin molded product, characterized in that a reducing agent is brought into contact with the resin molded product so as to allow the reducing agent to penetrate into the resin molded product, and in that high-pressure carbon dioxide having an organic metal complex dissolved therein is brought into contact with the resin molded product into which said reducing agent has penetrated, so as to immobilize the organic metal complex in the resin molded product by the reducing agent.

    摘要翻译： 本发明提供一种允许金属络合物稳定地渗透到聚合物中并通过低温处理将金属络合物固定在聚合物中的方法，其中允许金属络合物渗入的电镀预处理的间歇式处理 该聚合物使用高压二氧化碳。 特别地，本发明提供一种含有树脂成型体的复合材料的制造方法，其特征在于，与所述树脂成形体接触还原剂，使所述还原剂渗透到所述树脂成形体中， 并且将其中溶解有有机金属配合物的高压二氧化碳与所述还原剂渗入的树脂成型体接触，从而通过还原剂将有机金属配合物固定在树脂成型体中。

    COMPRESSOR
    29.
    发明申请
    COMPRESSOR 有权
    压缩机

    公开(公告)号：US20100329914A1

    公开(公告)日：2010-12-30

    申请号：US12867780

    申请日：2009-02-27

    申请人： Masahiro Yamada ,  Kazuhiko Matsukawa ,  Hiroyuki Yamaji ,  Satoshi Yamamoto ,  Yasuhiro Murakami ,  Tomoko Mizuguchi

    发明人： Masahiro Yamada ,  Kazuhiko Matsukawa ,  Hiroyuki Yamaji ,  Satoshi Yamamoto ,  Yasuhiro Murakami ,  Tomoko Mizuguchi

    IPC分类号： F04C29/02

    CPC分类号： F04C18/0215 ,  F04C23/008 ,  F04C29/0057 ,  F04C29/028

    摘要： A compressor is configured to compress a refrigerant and use a lubricating oil. The compressor includes a compression mechanism configured to compress the refrigerant, a driving shaft configured to rotate about a rotation axis in order to drive the compression mechanism, a slide bearing slidably supporting the driving shaft, a first surface fixed to the driving shaft and intersecting with a line arranged in parallel to the rotation axis, a second surface facially abutted to the first surface, and a recovery space formed in the compressor. The recovery space is configured and arranged to recover the lubricating oil leaking out of bottom ends of sliding surfaces of the slide bearing and the driving shaft. The first surface and the second surface respectively continue to surfaces forming the recovery space.

    摘要翻译： 压缩机被构造成压缩制冷剂并使用润滑油。 压缩机包括：压缩机构，其构造成压缩制冷剂;驱动轴，其构造成围绕旋转轴线旋转以驱动压缩机构;滑动轴承，其可滑动地支撑所述驱动轴;第一表面，固定到所述驱动轴并与 平行于旋转轴线布置的线，与第一表面表面贴合的第二表面和形成在压缩机中的回收空间。 回收空间被构造和布置成回收从滑动轴承和驱动轴的滑动表面的底端泄漏的润滑油。 第一表面和第二表面分别连续地形成形成恢复空间的表面。

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    30.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号：US20100276765A1

    公开(公告)日：2010-11-04

    申请号：US12810279

    申请日：2008-12-12

    申请人： Satoshi Yamamoto ,  Hirokazu Hashimoto

    发明人： Satoshi Yamamoto ,  Hirokazu Hashimoto

    IPC分类号： H01L29/84 ,  H01L21/50 ,  H01L31/0203

    CPC分类号： B81C1/00317 ,  B81C2201/0104 ,  B81C2201/0108 ,  B81C2201/0125 ,  B81C2203/0118 ,  B81C2203/0145 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of manufacturing a semiconductor device includes: a bonding step of bonding a first substrate with optical transparency and a second substrate having a surface on which a functional element is provided to each other such that the functional element faces the first substrate; a thinning step of thinning at least one of the first and second substrates; and a through-hole forming step of forming a cavity and a through-hole communicated with the cavity in at least part of a bonding portion between the first and second substrates. According to the present invention, it is possible to prevent irregularities or cracks caused by the presence or absence of the cavity and more regularly thin the substrate. In addition, it is possible to manufacture a semiconductor device capable of contributing to the miniaturization of devices and electronic equipment having the devices, using a more convenient process.

    摘要翻译： 一种制造半导体器件的方法包括：将具有光学透明性的第一衬底和第二衬底接合的接合步骤，其中功能元件彼此设置在其上，使得功能元件面向第一衬底; 减薄所述第一和第二基板中的至少一个的薄化步骤; 以及通孔形成步骤，在第一和第二基板之间的接合部分的至少一部分中形成与空腔连通的空腔和通孔。 根据本发明，可以防止由于空腔的存在或不存在引起的不规则或裂纹，并且更规则地使基板变薄。 此外，可以使用更方便的工艺来制造能够有助于具有该器件的器件和电子设备的小型化的半导体器件。