Abstract:
The present invention discloses a heat dissipation structure for a SOI field effect transistor having a schottky source/drain, which relates to a field of microelectronics. The heat dissipation structure includes two holes connected with a drain terminal or with both a source terminal and a drain terminal, which are filled with an N-type material with high thermoelectric coefficient and a P-type material with high thermoelectric coefficient respectively. A metal wire for the N-type material with high thermoelectric coefficient in the vicinity of the drain terminal is applied a high potential with respect to the drain terminal, and a metal wire for the P-type material with high thermoelectric coefficient in the vicinity of the drain terminal is applied a low potential with respect to the drain terminal. A metal wire for the N-type material with high thermoelectric coefficient in the vicinity of the source terminal is applied a high potential with respect to the source terminal, and a metal wire for the P-type material in the vicinity of the source terminal is applied a lower potential with respect to the source terminal. By way of a Peltier effect, in the present invention heat can be absorbed at a contact portion between the thermoelectric material and the source/drain, and at the same time dissipated at a connection portion between the thermoelectric material and a bottom electrode metal, so that the heat generated in an active region of the device is effectively transferred to the substrate and dissipated through a heat sink.
Abstract:
A method for fabricating a surrounding-gate silicon nanowire transistor with air sidewalls is provided. The method is compatible with the CMOS process; the introduced air sidewalls can reduce the parasitic capacitance effectively and increase the transient response characteristic of the device, thus being applicable to a high-performance logic circuit.
Abstract:
The invention discloses a fabrication method for a surrounding gate silicon nanowire transistor with air as spacers. The method comprises: performing isolation, and depositing a material A which has a higher etch selectivity ratio with respect to Si; performing photolithography to define a Fin hard mask; etching the material A to form the Fin hard mask; performing source and drain implantation; performing photolithography to define a channel region and large source/drain regions; forming the Si Fin and the large source/drains; removing the hard mask of the material A; forming a nanowire; etching the SiO2 to form a floating nanowire; forming a gate oxide layer; depositing a polysilicon; performing polysilicon injection; performing annealing to activate dopants; etching the polysilicon; depositing SiN; performing photolithography to define a gate pattern; etching the SiN and the polysilicon to form the gate pattern; separating the gate and the source/drain with a space in between filled with air; depositing SiO2 to form air sidewalls; performing annealing to densify the SiO2 layer; using subsequent processes to complete the device fabrication. The invention is compatible with the CMOS process flow. The introduction of the air sidewalls can effectively reduce the parasitic capacitance of the device, and improve the transient response of the device, so that the method is applicable for a logic circuit with high performance.
Abstract:
Disclosed herein is a method for fabricating a silicon nanowire field effect transistor based on a wet etching. The method includes defining an active region; depositing a silicon oxide film as a hard mask, forming a pattern of a source and a drain and a fine bar connecting the source and the drain; transferring the pattern on the hard mask to a silicon substrate by performing etching process for the silicon substrate; performing ion implanting; etching the silicon substrate by wet etching, so that the silicon fine bar connecting the source and the drain is suspended; reducing the silicon fine bar to a nano size to form a silicon nanowire; depositing a polysilicon film; forming a polysilicon gate line acrossing the silicon nanowire by electron beam lithography and forming a structure of nanowire-all-around; forming a silicon oxide sidewall at both sides of the polysilicon gate line, by depositing a silicon oxide film and subsequently etching the silicon oxide film; forming the source and the drain by using ion implantation and high temperature annealing, so that the silicon nanowire field effect transistor is finally fabricated. The method is compatible with a conventional integrated circuit fabrication technology. The fabrication process is simple and convenient, and has a short cycle.
Abstract:
A heat dissipation structure of a chip in the field of microelectronics is provided. The heat dissipation structure includes a P-type superlattice layer and an N-type superlattice layer formed over an upper surface of the chip by oxidation isolation. The P-type superlattice and the N-type superlattice are isolated by silicon oxide. Through a contact hole the P-type superlattice is electrically connected to a metal layer that is applied with a low potential in the chip, and a metal layer to be connected with an external power source is formed over the P-type superlattice. Through a contact hole the N-type superlattice is electrically connected to a metal layer that is applied with a high-potential power source in the chip, and a metal layer to be connected with an external power source is formed over the N-type superlattice. The potential of the external power source connected with the P-type superlattice is lower than that of the external power source connected with the N-type superlattice. The present invention can achieve heat dissipation of the chip and meanwhile prevent the ambient heat from transferring into the chip, by using the feature that the superlattice has a low thermal conductivity and phonon-localization-like behavior.
Abstract:
A method and a communications system are provided. The system includes a Node B and a RNC. The Node B report the RNC whether the base station an E-DPCCH power boost capability. The RNC is also informed whether a UE supports and E-DPCCH power boost capability. If the Node B and the UE both support the E-DPCCH power boost capability, the RNC configures the resource for the Node B to perform channel estimation by using the E-DPCCH power boost feature for the UE. Through the solution of the system, the accuracy of channel estimation can be improved and thus a bit error rate in high-speed data transmission can be reduced.
Abstract:
The present invention discloses a nitropyridinyl ethyleneimine compound as shown in the formula I and a preparation method of the same, as well as use of the compound in manufacture of a prodrug and in manufacture of a drug for treating a tumor.
Abstract:
EGFR biomarkers useful in a method for predicting the likelihood that a mammal that will respond therapeutically to a method of treating cancer comprising administering an EGFR modulator, wherein the method comprises (a) measuring in the mammal the level of at least one biomarker selected from epiregulin and amphiregulin, (b) exposing a biological sample from the mammal to the EGFR modulator, and (c) following the exposing of step (b), measuring in the biological sample the level of the at least one biomarker, wherein an increase in the level of the at least one biomarker measured in step (c) compared to the level of the at least one biomarker measured in step (a) indicates an increased likelihood that the mammal will respond therapeutically to the method of treating cancer.
Abstract:
Determining email filtering type based on sender classification. Incoming email is accessed and a sender of the incoming email is identified. The reputation of the sender of the incoming email is determined. An email sender classification is made based on the reputation of the sender. A determination of the type of filtering operations to be performed by an email filter on the email is made based on the classification. The parameters of the type of filtering operations to be performed are determined. The parameters of the type of filtering operations to be performed are provided to the email filter.
Abstract:
An inverter includes a counter, a PWM generator, a central controller and a power converter. The counter is used for receiving a frame switch signal to generate a frame counting signal. The PWM generator is coupled to the counter, and is used to select a specific frequency among a plurality of predetermined frequencies according to the frame counting signal, and generate a modulated signal having the specific frequency. The central controller is coupled to the PWM generator, and is used to generate a processed signal according to the modulated signal. The power converter is coupled to the central controller, and is used to generate an output signal according to the processed signal.