公开(公告)号：US20230059533A1

公开(公告)日：2023-02-23

申请号：US17796013

申请日：2021-02-01

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jinwook Kim ,  Seong-Woo Woo ,  Dongeun Lee ,  Sang-Jun Mo ,  Jung Ju Suh

IPC: H01F17/00 ,  H01F41/061 ,  H01F41/04

Abstract: The present disclosure relates to a coil assembly. According to a first embodiment of the present disclosure, there is provided a coil assembly including a coil including a multilayer film which is extended between a first longitudinal end and a second longitudinal end of the multilayer film, which are opposite to each other, and which is wound to form a plurality of loops which are substantially concentric, wherein the multilayer film includes: cut edges which are extended between the first longitudinal end and the second longitudinal end, and are opposite to each other and are substantially parallel to each other; a metal layer; and a magnetic layer disposed on the metal layer, wherein, at one or more of the first longitudinal end and the second longitudinal end of the multilayer film, the metal layer is electrically connected to a conductive terminal.

公开(公告)号：US20210159000A1

公开(公告)日：2021-05-27

申请号：US16629597

申请日：2018-08-08

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Seong-Woo Woo ,  Jung Ju Suh ,  Charles L. Bruzzone ,  Jennifer J. Sokol ,  Sergei A. Manuilov

IPC: H01F1/153 ,  C21D9/46

Abstract: A magnetic film includes iron and copper distributed between opposing first and second major surfaces of the magnetic film. The copper has a first atomic concentration C1 at a first depth d1 from the first major surface and a peak second atomic concentration C2 at a second depth d2 from the first major surface, d2>d1, C2/C1≥5.

公开(公告)号：US10587049B2

公开(公告)日：2020-03-10

申请号：US15780403

申请日：2016-11-29

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Michael S. Graff ,  Seong-Woo Woo ,  Chuang Wei Chiu

IPC: H01Q17/00 ,  H01F1/153 ,  H01F27/36 ,  H01F1/24 ,  H01Q1/38 ,  H01P1/365 ,  H01Q7/06 ,  H01F38/14 ,  H01Q7/00

Abstract: A magnetic isolator includes a dielectric film having a layer of electrically-conductive soft magnetic material bonded thereto. The layer of electrically-conductive soft magnetic material comprises substantially coplanar electrically-conductive soft magnetic islands separated one from another by a network of interconnected gaps. The interconnected gaps are at least partially filled with a thermoset dielectric material. The network of interconnected gaps at least partially suppresses electrical eddy current induced within the layer of soft magnetic material when in the presence of applied external magnetic field. An electronic device including the magnetic isolator and a method of making the magnetic isolator are also disclosed.

公开(公告)号：US20190098805A1

公开(公告)日：2019-03-28

申请号：US16090755

申请日：2017-03-30

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Seong-Woo Woo ,  Jinbae Kim ,  Jung-Ju Suh

IPC: H05K9/00 ,  B32B7/12 ,  B32B15/04 ,  B32B15/08 ,  B32B15/20 ,  B32B5/16 ,  B32B15/16

CPC classification number: H05K9/0098 ,  B32B3/10 ,  B32B5/16 ,  B32B7/06 ,  B32B7/12 ,  B32B15/043 ,  B32B15/08 ,  B32B15/09 ,  B32B15/16 ,  B32B15/18 ,  B32B15/20 ,  B32B27/00 ,  B32B27/281 ,  B32B27/36 ,  B32B27/365 ,  B32B2250/03 ,  B32B2264/105 ,  B32B2307/202 ,  B32B2307/212 ,  B32B2307/726 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2457/04 ,  H01B11/1008 ,  H01B11/1025 ,  H05K9/0075

Abstract: The present disclosure relates to a magnetic shielding tape, which is capable of shielding a high-to-low frequency of a signal transmitted through a cable in shielding of a magnetic field which flows in such a cable or is emitted therefrom, and a method for manufacturing the same. The basic magnetic shielding tape comprises: —a thin film magnetic layer including at least one metal ribbon sheet which is divided into a plurality of fine pieces by flaking process, and a gap provided between adjacent fine pieces among the plurality of fine pieces; —a cover film layer adhered to one side surface of the thin film magnetic layer through a first adhesive layer; and—a conductive layer adhered to the other side surface of the thin film magnetic layer through a second adhesive layer, wherein a size of the gap is determined according to a frequency band of the signal.

公开(公告)号：US20240371788A1

公开(公告)日：2024-11-07

申请号：US18777911

申请日：2024-07-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jiwoong Kong ,  Jung Ju Suh ,  Seong-Woo Woo

IPC: H01L23/552 ,  H01L21/50 ,  H05K9/00

Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer. The first edge surface connects a main top surface of the circuit board and a main bottom surface of the circuit board, the second edge surface connects a main top surface of the protection layer and a main bottom surface of the protection layer, and the third edge surface connects a main top surface of the magnetic field shielding film and a main bottom surface of the magnetic field shielding film, and the first edge surface, the second edge surface, and the third edge surface are substantially aligned with one another to form a coupling edge surface which is substantially planar. In addition, the first metal layer is disposed on the magnetic field shielding film, and covers the main top surface of the magnetic field shielding film and the coupling edge surface.

公开(公告)号：US20240296985A1

公开(公告)日：2024-09-05

申请号：US18578425

申请日：2022-07-19

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jinwook Kim ,  Seong-Woo Woo ,  Sang-Jun Mo ,  Dongeun Lee ,  Jong-Pil Kim

IPC: H01F10/10 ,  H01F27/28 ,  H02J50/00 ,  H02J50/10

CPC classification number: H01F10/10 ,  H01F27/2847 ,  H01F27/2871 ,  H02J50/005 ,  H02J50/10 ,  H01F2027/2857

Abstract: The disclosure relates to a coil and an electrical system including the same. Specifically, according to an embodiment of the disclosure, there is provided a coil including: main coil surfaces which are opposite each other and are substantially planar; and a multilayer film which is wound to form a plurality of loops which are substantially concentric, wherein the plurality of loops include an innermost loop including a first longitudinal direction end of the coil, and an outermost loop including a second longitudinal direction end of the coil, wherein the multilayer film includes a plurality of first electro-conductive layers which alternate with each other, and one or more second electrical insulation layers, wherein the first electro-conductive layer and the second electrical insulation layer have a width and a length which are substantially coextensive therebetween, such that the main coil surfaces, which are substantially planar, include corresponding end surfaces of the first electro-conductive layer and the second electrical insulation layer, respectively, wherein at least two first electro-conductive layers have different average thicknesses to reduce an alternating current resistance of the coil by 5%-11.3% inclusive in a frequency of at least about 148 KHz.

公开(公告)号：US12068258B2

公开(公告)日：2024-08-20

申请号：US17737285

申请日：2022-05-05

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jiwoong Kong ,  Jung Ju Suh ,  Seong-Woo Woo

IPC: H01L23/552 ,  H01L21/50 ,  H05K9/00

CPC classification number: H01L23/552 ,  H01L21/50 ,  H05K9/0026

Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer. The first edge surface connects a main top surface of the circuit board and a main bottom surface of the circuit board, the second edge surface connects a main top surface of the protection layer and a main bottom surface of the protection layer, and the third edge surface connects a main top surface of the magnetic field shielding film and a main bottom surface of the magnetic field shielding film, and the first edge surface, the second edge surface, and the third edge surface are substantially aligned with one another to form a coupling edge surface which is substantially planar. In addition, the first metal layer is disposed on the magnetic field shielding film, and covers the main top surface of the magnetic field shielding film and the coupling edge surface.

公开(公告)号：US11355453B2

公开(公告)日：2022-06-07

申请号：US17249559

申请日：2021-03-05

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jiwoong Kong ,  Jung Ju Suh ,  Seong-Woo Woo

IPC: H01L23/552 ,  H05K9/00

Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer. The first edge surface connects a main top surface of the circuit board and a main bottom surface of the circuit board, the second edge surface connects a main top surface of the protection layer and a main bottom surface of the protection layer, and the third edge surface connects a main top surface of the magnetic field shielding film and a main bottom surface of the magnetic field shielding film, and the first edge surface, the second edge surface, and the third edge surface are substantially aligned with one another to form a coupling edge surface which is substantially planar. In addition, the first metal layer is disposed on the magnetic field shielding film, and covers the main top surface of the magnetic field shielding film and the coupling edge surface.

公开(公告)号：US11328850B2

公开(公告)日：2022-05-10

申请号：US16904997

申请日：2020-06-18

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jinwook Kim ,  Seong-Woo Woo ,  Jung Ju Suh ,  Matthew R.C. Atkinson

IPC: H01F10/08 ,  H05K9/00 ,  H01F27/36 ,  H01F1/153 ,  H01F38/14

Abstract: A magnetic film includes one or more magnetically conductive layers. Each magnetically conductive layer is cracked to form a plurality of first through-cracks defining a plurality of magnetically conductive segments. The first through-cracks extend along a first direction and form a first regular pattern along an orthogonal second direction at a first pitch P1, such that a Fourier transform of the first regular pattern has a first peak along the second direction at a first spatial frequency corresponding to the first pitch P1. The first through-cracks have an average length L1 along the first direction. L1/P1 is greater than or equal to 5.

公开(公告)号：US20210090794A1

公开(公告)日：2021-03-25

申请号：US16630006

申请日：2018-08-01

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Seong-Woo Woo ,  Jung Ju Suh ,  Charles L. Bruzzone ,  Jennifer J. Sokol ,  Sergei A. Manuilov

IPC: H01F27/36 ,  H01F10/13

Abstract: A magnetic film includes iron and copper distributed between opposing first and second major surfaces of the magnetic film. The copper has a first atomic concentration C1 at a first depth d1 from the first major surface and a peak second atomic concentration C2 at a second depth d2 from the first major surface, d2>d1, C2/C1≥5.