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公开(公告)号：US09973845B2
公开(公告)日：2018-05-15
申请号：US15588400
申请日：2017-05-05
Applicant: Apple Inc.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: H04R1/28 , H04R1/10 , H04R1/34 , A45C11/00 , A45C13/02 , A45C13/10 , A45C13/00 , H02J7/00 , H02J7/02
CPC classification number: H04R1/1016 , A45C11/00 , A45C11/24 , A45C13/005 , A45C13/02 , A45C13/1069 , A45C2011/001 , A45C2013/026 , B65D25/02 , B65D43/16 , F16B2001/0035 , H01R13/521 , H02J7/0044 , H02J7/0047 , H02J7/025 , H02J7/027 , H02J2007/0096 , H04B1/385 , H04B1/3888 , H04B5/0037 , H04M1/6033 , H04R1/02 , H04R1/1025 , H04R1/1041 , H04R1/1058 , H04R1/1075 , H04R1/2826 , H04R1/2857 , H04R1/345 , H04R5/033 , H04R9/025 , H04R9/06 , H04R2201/105 , H04R2420/07 , H04R2460/03 , H04R2460/09 , H04R2460/17
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号：US09883281B2
公开(公告)日：2018-01-30
申请号：US15588400
申请日：2017-05-05
Applicant: Apple Inc.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: H04R1/28 , H04R1/10 , H04R1/34 , A45C11/00 , A45C13/02 , A45C13/10 , A45C13/00 , H02J7/00 , H02J7/02
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号：US20130251915A1
公开(公告)日：2013-09-26
申请号：US13901350
申请日：2013-05-23
Applicant: Apple Inc.
Inventor： Rimple Bhatia , Paul Choiniere , Michael S. Nashner
IPC: H05K13/00
CPC classification number: H05K13/0084 , B05D1/32 , B05D5/06 , B05D7/53 , G09F3/00 , G09F7/165 , H05K5/0243
Abstract: Techniques or processes for providing markings on products are disclosed. The markings provided on products can be textual and/or graphic. The techniques or processes can provide high resolution markings on surfaces that are flat or curved. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, the housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface. The markings can be formed using a ultra-violet (UV) curable material that can be selectively cured on a surface (e.g., housing surface) in places where markings, namely text and/or graphics, are to be provided.
Abstract translation: 公开了在产品上提供标记的技术或工艺。 产品上提供的标记可以是文字和/或图形。 这些技术或工艺可以在平坦或弯曲的表面上提供高分辨率的标记。 在一个实施例中，产品具有外壳，并且标记将设置在外壳上。 例如，用于特定产品的壳体可以包括外部壳体表面，并且标记可以设置在外部壳体表面上。 可以使用紫外线（UV）可固化材料形成标记，该材料可以在要提供标记即文本和/或图形的地方在表面（例如，外壳表面）上选择性固化。
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公开(公告)号：US11026011B2
公开(公告)日：2021-06-01
申请号：US16882020
申请日：2020-05-22
Applicant: Apple Inc.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: H04R1/10 , A45C11/00 , H04R5/033 , A45C13/02 , H02J50/10 , H02J7/00 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C11/24 , A45C13/10 , H04R9/02 , H04R9/06 , H02J7/02 , H01R13/52 , A45C13/00 , H04B1/3827 , H04M1/60 , F16B1/00
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号：US20210152912A1
公开(公告)日：2021-05-20
申请号：US17131610
申请日：2020-12-22
Applicant: Apple Inc.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: H04R1/10 , A45C11/00 , H04R5/033 , A45C13/02 , H02J50/10 , H02J7/00 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C11/24 , A45C13/10 , H04R9/02 , H04R9/06 , H01R13/52 , A45C13/00
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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Patent Agency Ranking
公开(公告)号：US10904652B2
公开(公告)日：2021-01-26
申请号：US16430823
申请日：2019-06-04
Applicant: Apple Inc.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: H04R1/10 , A45C11/00 , H04R5/033 , A45C13/02 , H02J50/10 , H02J7/00 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C11/24 , A45C13/10 , H04R9/02 , H04R9/06 , H02J7/02 , H01R13/52 , A45C13/00 , H04B1/3827 , H04M1/60 , F16B1/00
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号：US10681446B2
公开(公告)日：2020-06-09
申请号：US16430773
申请日：2019-06-04
Applicant: Apple Inc.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: H04R25/00 , H04R1/10 , A45C11/00 , H04R5/033 , A45C13/02 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C11/24 , A45C13/10 , H04R9/02 , H04R9/06 , H02J7/00 , H02J7/02 , H01R13/52 , A45C13/00 , H04B1/3827 , H04M1/60 , F16B1/00
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号：US20190289381A1
公开(公告)日：2019-09-19
申请号：US16430773
申请日：2019-06-04
Applicant: Apple Inc.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: H04R1/10 , A45C11/24 , H02J7/02 , A45C13/02 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C13/10 , A45C13/00 , H04R5/033 , A45C11/00 , H01R13/52 , H02J7/00 , H04R9/06 , H04R9/02
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号：US10397682B2
公开(公告)日：2019-08-27
申请号：US15273683
申请日：2016-09-22
Applicant: Apple Inc.
Inventor： Arun D. Chawan , Kurt Stiehl , Benjamin A. Cousins , Jonathan S. Aase , Yacine Azmi , Paul Choiniere , Scott W. Slabaugh
IPC: H04R1/10 , H04R1/28 , H04R1/34 , B65D25/02 , B65D43/16 , H04R1/02 , H04B1/3888 , H04B5/00 , A45C11/24 , A45C13/10 , H04R9/02 , H04R9/06 , H02J7/00 , H02J7/02 , H01R13/52 , A45C11/00 , H04R5/033 , A45C13/02 , A45C13/00 , H04B1/3827 , H04M1/60 , F16B1/00
Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
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公开(公告)号：US09972934B1
公开(公告)日：2018-05-15
申请号：US15612975
申请日：2017-06-02
Applicant: Apple Inc.
Inventor： Warren Taylor , Jesse A. Lippert , Amin M. Younes , Paul Choiniere , Sathyanarayanan Kaliyamoorthy , Maegan K. Spencer , Shannon X. Yang
CPC classification number: H01R13/5227 , A45C2011/002 , H01R25/006 , H01R43/18 , H04B1/3833 , H05K5/0213 , H05K5/069
Abstract: An electronic device with a port is disclosed. To expel liquid in the port, the port includes modifications to form a capillary pressure gradient with the liquid, causing uneven capillary forces to act on the liquid in the port. For example, the port may include an asymmetric profile with one section having a curved profile and another section having one or more linear profiles that join at an edge. The edge may form a relative higher curved surface as compared to the curved profile. As a result, the capillary pressure gradient may exert a higher capillary pressure in a location associated with the edge, as compared to a capillary pressure along the curved profile. The capillary pressure gradient causes ambient air into the port along the edge, and separates the liquid from the edge, allowing gravity to overcome atmospheric pressure and causing removal of the liquid from the port.
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