公开(公告)号：US20240258136A1

公开(公告)日：2024-08-01

申请号：US18430398

申请日：2024-02-01

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: H01L21/67 ,  C23C14/35 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67184 ,  C23C14/35 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/68707

Abstract: Embodiments disclosed herein include a substrate processing module and a method of moving a workpiece. The substrate processing module includes a shutter stack and two process stations. The shutter stack is disposed between the process stations. The method of moving a workpiece includes moving a supporting portion from a first location to a shutter stack in a first direction, retrieving the workpiece from the shutter stack, and moving the supporting portion to a second location. The transfer chamber assembly and method allows for moving workpieces to and from the shutter stack to the two process stations. A central transfer robot of the substrate processing module is configured to grip both substrates and shutter discs, allowing for one robot when typically two robots would be required.

公开(公告)号：US20240153801A1

公开(公告)日：2024-05-09

申请号：US18141926

申请日：2023-05-01

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Lakshmikanth Krishnamurthy SHIRAHATTI

IPC: H01L21/677

CPC classification number: H01L21/67706 ,  H01L21/67709 ,  H01L21/6773

Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

公开(公告)号：US20240068086A1

公开(公告)日：2024-02-29

申请号：US18074363

申请日：2022-12-02

Applicant: Applied Materials, Inc.

Inventor： Sundarapandian Ramalinga Vijayalakshmi REDDY ,  Kirankumar Neelasandra SAVANDAIAH ,  Junqi WEI ,  Bridger Earl HOERNER ,  Kelvin Tai Ming BOH ,  Madan Kumar SHIMOGA MYLARAPPA

IPC: C23C14/34

CPC classification number: C23C14/3414

Abstract: Target assemblies for PVD chambers are provided herein. In some embodiments, a target assembly for a PVD chamber includes: a backing plate; and a target coupled to the backing plate and having a substrate facing surface opposite the backing plate, wherein a peripheral portion of the target includes an angled surface extending radially outward and toward the backing plate, wherein an annular portion of the angled surface has a surface roughness greater than a surface roughness of a remainder of the substrate facing surface of the target.

公开(公告)号：US20220359171A1

公开(公告)日：2022-11-10

申请号：US17737536

申请日：2022-05-05

Applicant: Applied Materials, Inc.

Inventor： William R. JOHANSON ,  Cory Eugene LAFOLLETT ,  Kirankumar Neelasandra SAVANDAIAH

IPC: H01J37/32 ,  C23C14/50 ,  C23C14/34

Abstract: Embodiments of apparatus for high pressure plasma processing are provided herein. In some embodiments, the apparatus includes an isolator plate and grounding bracket for a substrate support, such as an electrostatic chuck, in a plasma processing chamber. In some embodiments, apparatus for high pressure plasma processing includes: an electrostatic chuck; a ground return bracket spaced apart from the electrostatic chuck; and a dielectric plate disposed between the electrostatic chuck and the ground return bracket.

公开(公告)号：US20220336248A1

公开(公告)日：2022-10-20

申请号：US17230775

申请日：2021-04-14

Applicant: Applied Materials, Inc.

Inventor： Anubhav SRIVASTAVA ,  Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Srinivasa Rao YEDLA ,  Lakshmikanth Krishnamurthy SHIRAHATTI

IPC: H01L21/683 ,  H01L21/677

Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for processing substrates. More specifically, embodiments of the present disclosure relate to transfer apparatus and substrate-supporting members. In an embodiment, an apparatus for transferring a substrate is provided. The apparatus includes a hub and a plurality of transfer arms extending from the hub. The apparatus further includes a plurality of substrate-supporting members, wherein each of the transfer arms has a first end coupled to the hub and a second end coupled to a respective one of the plurality of substrate-supporting members. The apparatus further includes a first electrical interface connection for electrostatically chucking a substrate and located at a first position on each substrate-supporting member, and a second electrical interface connection for electrostatically chucking the substrate and located at a second position on each substrate-supporting member. Substrate processing modules are also described.

公开(公告)号：US20220270898A1

公开(公告)日：2022-08-25

申请号：US17185360

申请日：2021-02-25

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Nitin Bharadwaj SATYAVOLU ,  Srinivasa Rao YEDLA ,  Bhaskar PRASAD ,  Thomas BREZOCZKY

IPC: H01L21/67 ,  H01J37/32 ,  H01J37/34 ,  C23C14/35 ,  C23C14/50

Abstract: A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed. A seal ring assembly is coupled to the support chuck. The seal ring assembly includes an inner assembly, an assembly bellows circumscribing the inner assembly, and a bellows disposed between the inner and outer platform. An inner ring is disposed between inner assembly of the seal ring assembly and the bottom surface of the support chuck. An outer ring disposed between the seal ring assembly and the lower sealing surface of the process chamber wall. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using the bellows, the inner ring, and the outer ring.

公开(公告)号：US20220243331A1

公开(公告)日：2022-08-04

申请号：US17166762

申请日：2021-02-03

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Nitin Bharadwaj SATYAVOLU ,  Ganesh SUBBUSWAMY ,  Devi Raghavee VEERAPPAN ,  Thomas BREZOCZKY

IPC: C23C16/455 ,  C23C14/34 ,  C23C14/22

Abstract: Aspects of the present disclosure provide systems and apparatuses for a substrate processing assembly with a laminar flow cavity gas injection for high and low pressure. A dual gas reservoir assembly is provided in a substrate processing chamber, positioned within a lower shield assembly. A first gas reservoir is in fluid communication with a processing volume of the substrate processing assembly via a plurality of gas inlet, positioned circumferentially about the processing volume. A second gas reservoir is positioned circumferentially about the first gas reservoir, coupled therewith via one or more reservoir ports. The second gas reservoir is in fluid communication with a first gas source. A recursive path gas assembly is positioned in an upper shield body adjacent to an electrode to provide one or more gases to a dark space gap.

公开(公告)号：US20220186361A1

公开(公告)日：2022-06-16

申请号：US17121603

申请日：2020-12-14

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra SAVANDAIAH ,  Shane LAVAN ,  Sundarapandian Ramalinga Vijayalakshmi REDDY ,  Randal Dean SCHMIEDING ,  Yong CAO

IPC: C23C14/56 ,  C23C14/28

Abstract: Embodiments of process shield for use in process chambers are provided herein. In some embodiments, a process shield for use in a process chamber includes: an annular body having an upper portion and a lower portion extending downward and radially inward from the upper portion, wherein the upper portion includes a plurality of annular trenches on an upper surface thereof and having a plurality of slots disposed therebetween to fluidly couple the plurality of annular trenches, wherein one or more inlets extend from an outer surface of the annular body to an outermost trench of the plurality of annular trenches.

公开(公告)号：US20220068690A1

公开(公告)日：2022-03-03

申请号：US17008940

申请日：2020-09-01

Applicant: Applied Materials, Inc.

Inventor： Sreenath SOVENAHALLI ,  Kirankumar Neelasandra SAVANDAIAH ,  Lakshmikanth Krishnamurthy SHIRAHATTI ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: H01L21/683 ,  H01L21/677 ,  H01L21/67

Abstract: A method and apparatus for processing substrates is described herein. In one embodiment, a transfer apparatus is described that includes a blade, a plurality of support arms coupled to the blade, a plurality of grippers coupled to each of the support arms, and a grip actuator operably coupled to the support arms or one or more of the plurality of grippers.

公开(公告)号：US20210381101A1

公开(公告)日：2021-12-09

申请号：US16892173

申请日：2020-06-03

Applicant: Applied Materials, Inc.

Inventor： Nagabhushana NANJUNDAPPA ,  Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY ,  Bhaskar PRASAD

IPC: C23C14/54 ,  H01L21/683 ,  C23C14/34

Abstract: Embodiments disclosed herein generally relate to a system and, more specifically, a substrate processing system. The substrate processing system includes one or more cooling systems. The cooling systems are configured to lower and/or control the temperature of a body of the substrate processing system. The cooling systems include features to cool the body disposed in the substrate processing system using gas and/or liquid cooling systems. The cooling systems disclosed herein can be used when the body is disposed at any height.