公开(公告)号：US20160107287A1

公开(公告)日：2016-04-21

申请号：US14887240

申请日：2015-10-19

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Daniel REDFIELD ,  Mahendra C. ORILALL ,  Boyi FU ,  Aniruddh KHANNA ,  Jason G. FUNG ,  Mario CORNEJO ,  Ashwin CHOCKALINGAM ,  Mayu YAMAMURA ,  Veera Raghava Reddy KAKIREDDY ,  Ashavani KUMAR ,  Venkatachalam HARIHARAN ,  Gregory E. MENK ,  Fred C. REDEKER ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Robert E. DAVENPORT ,  Amritanshu SINHA

IPC: B24B37/22 ,  B24B37/24 ,  B24D3/28

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US20250056920A1

公开(公告)日：2025-02-13

申请号：US18797189

申请日：2024-08-07

Applicant: Applied Materials, Inc.

Inventor： Peiwen LIU ,  Uma SRIDHAR ,  Hyunsung BANG ,  Kai DING ,  Jeffrey L. FRANKLIN ,  Mingwei ZHU ,  Hou T. NG ,  Nag B. PATIBANDLA

IPC: H01L33/00 ,  H01L25/075

Abstract: The present disclosure provides devices and methods for repairing dice during micro-LED display fabrication. The devices include a backplane. The backplane has a plurality of backplane electrodes. Each backplane electrode includes a first material. A plurality of micro-LEDs having a plurality of micro-LED electrodes is included in the device. Each micro-LED electrode includes a second material. Each micro-LED electrode is bonded to each backplane electrode with an alloy of the first material and the second material therebetween. At least one backplane electrode is bonded to the micro-LED electrode via a repair material. The device includes a plurality of subpixel isolation (SI) structures formed over the backplane. The SI structures define wells of sub-pixels. Each well includes a respective micro-LED between adjacent SI structures. The sub-pixels have a color conversion material disposed in the wells.

公开(公告)号：US20230330805A1

公开(公告)日：2023-10-19

申请号：US18138555

申请日：2023-04-24

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Nag B. PATIBANDLA ,  Rajeev BAJAJ ,  Daniel REDFIELD ,  Fred C. REDEKER ,  Mahendra C. ORILALL ,  Boyi FU ,  Mayu YAMAMURA ,  Ashwin CHOCKALINGAM

IPC: B24B37/22 ,  B24D3/22 ,  B24D3/18 ,  B33Y10/00 ,  B24B37/24 ,  B24B37/26

CPC classification number: B24B37/22 ,  B24D3/22 ,  B24D3/18 ,  B33Y10/00 ,  B24B37/24 ,  B24B37/26 ,  B33Y80/00

Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.

公开(公告)号：US20210123156A1

公开(公告)日：2021-04-29

申请号：US17016614

申请日：2020-09-10

Applicant: Applied Materials, Inc.

Inventor： Zihao YANG ,  Mingwei ZHU ,  Nag B. PATIBANDLA ,  Yong CAO ,  Shumao ZHANG ,  Zhebo CHEN ,  Jean LU ,  Daniel Lee DIEHL ,  Xianmin TANG

IPC: C30B23/00 ,  C30B29/40 ,  C30B33/04 ,  C23C14/06 ,  C23C14/34 ,  C23C14/54 ,  C23C14/58

Abstract: Embodiments described herein include a method for depositing a material layer on a substrate while controlling a bow of the substrate and a surface roughness of the material layer. A bias applied to the substrate while the material layer is deposited is adjusted to control the bow of the substrate. A bombardment process is performed on the material layer to improve the surface roughness of the material layer. The bias and bombardment process improve a uniformity of the material layer and reduce an occurrence of the material layer cracking due to the bow of the substrate.

公开(公告)号：US20200325353A1

公开(公告)日：2020-10-15

申请号：US16668961

申请日：2019-10-30

Applicant: Applied Materials, Inc.

Inventor： Uma SRIDHAR ,  Sivapackia GANAPATHIAPPAN ,  Ashwin CHOCKALINGAM ,  Yingdong LUO ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Sudhakar MADHUSOODHANAN

IPC: C09D11/38 ,  B24B37/24 ,  C09D11/107 ,  C09D11/101 ,  B33Y70/00 ,  B33Y80/00

Abstract: Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.

公开(公告)号：US20200227294A1

公开(公告)日：2020-07-16

申请号：US16249653

申请日：2019-01-16

Applicant: Applied Materials, Inc.

Inventor： Mingwei ZHU ,  Zihao YANG ,  Nag B. PATIBANDLA ,  Daniel DIEHL ,  Yong CAO ,  Weimin ZENG ,  Renjing ZHENG ,  Edward BUDIARTO ,  Surender Kumar GURUSAMY ,  Todd EGAN ,  Niranjan R. KHASGIWALE

IPC: H01L21/67 ,  G01N21/21 ,  H01L21/687

Abstract: A method and apparatus for forming an optical stack having uniform and accurate layers is provided. A processing tool used to form the optical stack comprises, within an enclosed environment, a first transfer chamber, an on-board metrology unit, and a second transfer chamber. A first plurality of processing chambers is coupled to the first transfer chamber or the second transfer chamber. The on-board metrology unit is disposed between the first transfer chamber and the second transfer chamber. The on-board metrology unit is configured to measure one or more optical properties of the individual layers of the optical stack without exposing the layers to an ambient environment.

公开(公告)号：US20200070302A1

公开(公告)日：2020-03-05

申请号：US16529884

申请日：2019-08-02

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Ankit VORA ,  Boyi FU ,  Venkat HARIHARAN ,  Mayu YAMAMURA ,  Mario CORNEJO ,  Igor ABRAMSON ,  Mo YANG ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA

IPC: B24B37/24 ,  C08F283/00 ,  B33Y10/00 ,  B33Y70/00 ,  B29C64/112

Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.

公开(公告)号：US20190337117A1

公开(公告)日：2019-11-07

申请号：US16375506

申请日：2019-04-04

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Ankit VORA ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Sudhakar MADHUSOODHANAN

IPC: B24B37/22 ,  B24B37/24 ,  B24B37/26

Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.

公开(公告)号：US20190299357A1

公开(公告)日：2019-10-03

申请号：US16442687

申请日：2019-06-17

Applicant: Applied Materials, Inc.

Inventor： Mahendra Christopher ORILALL ,  Timothy MICHAELSON ,  Kasiraman KRISHNAN ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA ,  Daniel REDFIELD ,  Fred C. REDEKER ,  Gregory E. MENK

IPC: B24B37/24 ,  B24D18/00 ,  B24B37/26 ,  B24B37/22

Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.

公开(公告)号：US20190139788A1

公开(公告)日：2019-05-09

申请号：US16171000

申请日：2018-10-25

Applicant: Applied Materials, Inc.

Inventor： Boyi FU ,  Han-Wen CHEN ,  Kyuil CHO ,  Sivapackia GANAPATHIAPPAN ,  Roman GOUK ,  Steven VERHAVERBEKE ,  Nag B. PATIBANDLA ,  Yan ZHAO ,  Hou T. NG ,  Ankit VORA ,  Daihua ZHANG

IPC: H01L21/56 ,  H01L21/67

Abstract: Aspects of the disclosure generally relate to methods of immobilizing die on a substrate. In one method one or more immobilization features are formed in a selected pattern on a substrate. A die is positioned in contact with the one or more immobilization features and the substrate. The one or more immobilization features are cured, and a mold layer is formed on top of the cured one or more immobilization features and the die so as to encapsulate the die.