公开(公告)号：US20210372911A1

公开(公告)日：2021-12-02

申请号：US16885257

申请日：2020-05-27

Applicant: Applied Materials, Inc.

Inventor： Mehdi VAEZ-IRAVANI ,  Todd EGAN ,  Guoheng ZHAO

IPC: G01N15/02 ,  G01N15/14

Abstract: Examples disclosed herein generally relate to systems and methods for detecting the size of a particle in a fluid. In one example, a system for imaging a particle includes a first imaging device. The first imaging device includes a lens and a digital detector. The system further includes a laser source. He laser source is configured to emit a first laser beam and a second laser beam. The digital detector is configured to accumulate a metric of an intensity of an accumulated light that passes through the lens. The accumulated light is scattered from the particle. The accumulated light includes light from the first laser beam and the second laser beam.

公开(公告)号：US20190072497A1

公开(公告)日：2019-03-07

申请号：US16080075

申请日：2017-05-23

Applicant: Applied Materials, Inc.

Inventor： Todd EGAN ,  Mehdi VAEZ-IRAVANI ,  Samer BANNA ,  Kyle TANTIWONG ,  Gregory KIRK ,  Abraham RAVID ,  Yaoming SHEN

IPC: G01N21/95 ,  H01L21/67 ,  G01N15/02 ,  G01N21/94 ,  G01N15/14

Abstract: A system for processing a substrate is provided. The system includes a process chamber including one or more sidewalls enclosing a processing region; and a substrate support. The system further includes a passageway connected to the process chamber; and a first particle detector disposed at a first location along the passageway. The first particle detector includes an energy source configured to emit a first beam; one or more optical devices configured to direct the first beam along one or more paths, where the one or more paths extend through at least a portion of the passageway. The first particle detector further includes a first energy detector disposed at a location other than on the one or more paths. The system further includes a controller configured to communicate with the first particle detector, wherein the controller is configured to identify a fault based on signals received from the first particle detector.

公开(公告)号：US20190057910A1

公开(公告)日：2019-02-21

申请号：US16080102

申请日：2017-03-09

Applicant: Applied Materials, Inc.

Inventor： Mehdi VAEZ-IRAVANI ,  Todd EGAN ,  Samer BANNA ,  Kyle TANTIWONG

IPC: H01L21/66 ,  G01B11/24 ,  G02B27/12

Abstract: Embodiments of the disclosure provide a metrology system. In one example, a metrology system includes a laser source adapted to transmit a light beam, a lens adapted to receive at least a portion of the light beam from the laser source, a first beam splitter positioned to receive at least the portion of the light beam passing through the lens, a first beam displacing device adapted to cause a portion of the light beam received from the beam splitter to be split into two or more sub-light beams a first recording device having a detection surface, and a first polarizer that is positioned between the first displacing device and the first recording device, wherein the first polarizer is configured to cause the two or more sub-light beams provided from the first displacing device to form an interference pattern on the detection surface of the first recording device.

公开(公告)号：US20160035577A1

公开(公告)日：2016-02-04

申请号：US14775651

申请日：2014-03-11

Applicant: APPLIED MATERIALS, INC.

Inventor： Wei-Sheng LEI ,  Mohammad Kamruzzaman CHOWDHURY ,  Todd EGAN ,  Brad EATON ,  Madhava Rao YALAMANCHILI ,  Ajay KUMAR

IPC: H01L21/308 ,  H01L21/3065 ,  H01L21/687 ,  B23K26/402 ,  H01L21/67 ,  H01L21/673 ,  H01L21/82 ,  B23K26/364

CPC classification number: H01L21/3086 ,  B23K26/364 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/172 ,  B23K2103/50 ,  B23K2103/56 ,  H01L21/3065 ,  H01L21/30655 ,  H01L21/3081 ,  H01L21/3085 ,  H01L21/67069 ,  H01L21/67196 ,  H01L21/67207 ,  H01L21/67383 ,  H01L21/68707 ,  H01L21/78 ,  H01L21/82

Abstract: Methods of dicing substrates having a plurality of ICs. A method includes forming a multi-layered mask comprising a laser energy absorbing, non-photodefinable topcoat disposed over a water-soluble base layer disposed over the semiconductor substrate. Because the laser light absorbing material layer is non-photodefinable, material costs associated with conventional photo resist formulations may be avoided. The mask is direct-write patterned with a laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. Absorption of the mask layer within the laser emission band (e.g., UV band and/or green band) promotes good scribe line quality. The substrate may then be plasma etched through the gaps in the patterned mask to singulate the IC with the mask protecting the ICs during the plasma etch. The soluble base layer of the mask may then be dissolved subsequent to singulation, facilitating removal of the layer.

Abstract translation: 具有多个IC的切割基板的方法。 一种方法包括形成多层掩模，该多层掩模包括设置在半导体衬底上的水溶性基底层上的激光能量吸收不可光限定的顶涂层。 因为激光吸收材料层是不可光定型的，所以可以避免与常规光致抗蚀剂配方相关的材料成本。 掩模是用激光划线工艺直接写入图案，以提供具有间隙的图案化掩模。 图案化使IC之间的衬底的区域暴露。 激光发射带（例如，UV带和/或绿色带）内的掩模层的吸收促进了良好的划线质量。 然后可以通过图案化掩模中的间隙等离子体蚀刻衬底，以在等离子体蚀刻期间用掩模保护IC来对IC进行分离。 然后可以在分离后溶解掩模的可溶性基底层，从而有助于去除该层。

公开(公告)号：US20240142223A1

公开(公告)日：2024-05-02

申请号：US18308844

申请日：2023-04-28

Applicant: Applied Materials, Inc.

Inventor： Khokan C. PAUL ,  Zhepeng CONG ,  Tao SHENG ,  Edward W. BUDIARTO ,  Todd EGAN

IPC: G01B11/06

CPC classification number: G01B11/0625

Abstract: In one implementation, a method of monitoring film thickness on a substrate, comprises: generating light from a light source; collimating the light from the light source to form a collimated beam; reflecting the collimated beam off of a surface to be measured to produce a reflected beam; splitting the reflected beam with a dichroic mirror, wherein the reflected beam splits into a first beam and a second beam; receiving, by a pyrometer, the first beam from the dichroic mirror; receiving, by a spectrometer, the second beam from the dichroic mirror; and analyzing data derived from the pyrometer and the spectrometer to determine one or more characteristics of the surface to be measured.

公开(公告)号：US20200227294A1

公开(公告)日：2020-07-16

申请号：US16249653

申请日：2019-01-16

Applicant: Applied Materials, Inc.

Inventor： Mingwei ZHU ,  Zihao YANG ,  Nag B. PATIBANDLA ,  Daniel DIEHL ,  Yong CAO ,  Weimin ZENG ,  Renjing ZHENG ,  Edward BUDIARTO ,  Surender Kumar GURUSAMY ,  Todd EGAN ,  Niranjan R. KHASGIWALE

IPC: H01L21/67 ,  G01N21/21 ,  H01L21/687

Abstract: A method and apparatus for forming an optical stack having uniform and accurate layers is provided. A processing tool used to form the optical stack comprises, within an enclosed environment, a first transfer chamber, an on-board metrology unit, and a second transfer chamber. A first plurality of processing chambers is coupled to the first transfer chamber or the second transfer chamber. The on-board metrology unit is disposed between the first transfer chamber and the second transfer chamber. The on-board metrology unit is configured to measure one or more optical properties of the individual layers of the optical stack without exposing the layers to an ambient environment.

公开(公告)号：US20190074201A1

公开(公告)日：2019-03-07

申请号：US16079961

申请日：2017-03-30

Applicant: Applied Materials, Inc.

Inventor： Mehdi VAEZ-IRAVANI ,  Todd EGAN ,  Samer BANNA ,  Kyle TANTIWONG

IPC: H01L21/67 ,  G06T7/00

Abstract: Embodiments of the disclosure provide methods and system for inspecting and treating a substrate. In one embodiment, a method is provided including transmitting a first plurality of beams from a diffractive beam splitter to a first surface of a substrate to generate a reflection of a second plurality of beams, wherein the first plurality of beams are spaced apart from each other upon arriving at the first surface of the substrate; receiving the second plurality of beams on a recording surface of an optical device, wherein the second plurality of beams are spaced apart from each other upon arriving at the recording surface; measuring positional information of the second plurality of beams on the recording surface; comparing the positional information of the second plurality of beams to positional information stored in a memory; and storing a result of the comparison in the memory.

公开(公告)号：US20230193466A1

公开(公告)日：2023-06-22

申请号：US18108989

申请日：2023-02-13

Applicant: Applied Materials, Inc.

Inventor： Nagarajan RAJAGOPALAN ,  Xinhai HAN ,  Michael Wenyoung TSIANG ,  Masaki OGATA ,  Zhijun JIANG ,  Juan Carlos ROCHA-ALVAREZ ,  Thomas NOWAK ,  Jianhua ZHOU ,  Ramprakash SANKARAKRISHNAN ,  Amit Kumar BANSAL ,  Jeongmin LEE ,  Todd EGAN ,  Edward W. BUDIARTO ,  Dmitriy PANASYUK ,  Terrance Y. LEE ,  Jian J. CHEN ,  Mohamad A. AYOUB ,  Heung Lak PARK ,  Patrick REILLY ,  Shahid SHAIKH ,  Bok Hoen KIM ,  Sergey STARIK ,  Ganesh BALASUBRAMANIAN

IPC: C23C16/52 ,  G01B11/06 ,  H01L21/687 ,  H01L21/67 ,  C23C16/509 ,  G01N21/55 ,  G01N21/65 ,  H01L21/00 ,  C23C16/458 ,  C23C16/46 ,  C23C16/50 ,  C23C16/505 ,  C23C16/455

CPC classification number: C23C16/52 ,  G01B11/0683 ,  H01L21/687 ,  H01L21/67248 ,  H01L21/67253 ,  C23C16/5096 ,  G01N21/55 ,  G01N21/658 ,  G01B11/0625 ,  H01L21/00 ,  C23C16/458 ,  C23C16/46 ,  C23C16/50 ,  C23C16/505 ,  C23C16/45565 ,  C23C16/4557 ,  C23C16/509 ,  G01N2201/1222

Abstract: A method of processing a substrate according to a PECVD process is described. Temperature profile of the substrate is adjusted to change deposition rate profile across the substrate. Plasma density profile is adjusted to change deposition rate profile across the substrate. Chamber surfaces exposed to the plasma are heated to improve plasma density uniformity and reduce formation of low quality deposits on chamber surfaces. In situ metrology may be used to monitor progress of a deposition process and trigger control actions involving substrate temperature profile, plasma density profile, pressure, temperature, and flow of reactants.

公开(公告)号：US20210018449A1

公开(公告)日：2021-01-21

申请号：US17062231

申请日：2020-10-02

Applicant: Applied Materials, Inc.

Inventor： Todd EGAN ,  Mehdi VAEZ-IRAVANI ,  Samer BANNA ,  Kyle TANTIWONG ,  Gregory KIRK ,  Abraham RAVID ,  Yaoming SHEN

IPC: G01N21/95 ,  H01L21/67 ,  G01N15/02 ,  G01N15/14 ,  G01N21/94

Abstract: A system for processing a substrate is provided. The system includes a process chamber including one or more sidewalls enclosing a processing region; and a substrate support. The system further includes a passageway connected to the process chamber; and a first particle detector disposed at a first location along the passageway. The first particle detector includes an energy source configured to emit a first beam; one or more optical devices configured to direct the first beam along one or more paths, where the one or more paths extend through at least a portion of the passageway. The first particle detector further includes a first energy detector disposed at a location other than on the one or more paths. The system further includes a controller configured to communicate with the first particle detector, wherein the controller is configured to identify a fault based on signals received from the first particle detector.

公开(公告)号：US20190317021A1

公开(公告)日：2019-10-17

申请号：US16258392

申请日：2019-01-25

Applicant: Applied Materials, Inc.

Inventor： Avishek GHOSH ,  Byung-Sung KWAK ,  Todd EGAN ,  Robert Jan VISSER

IPC: G01N21/64 ,  H01L51/52

Abstract: An apparatus for determining a characteristic of a photoluminescent (PL) layer comprises: a light source that generates an excitation light that includes light from the visible or near-visible spectrum; an optical assembly configured to direct the excitation light onto a PL layer; a detector that is configured to receive a PL emission generated by the PL layer in response to the excitation light interacting with the PL layer and generate a signal based on the PL emission; and a computing device coupled to the detector and configured to receive the signal from the detector and determine a characteristic of the PL layer based on the signal.