-
Patent Agency Ranking
公开(公告)号：US09173284B2
公开(公告)日：2015-10-27
申请号：US14068029
申请日：2013-10-31
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K1/024 , H01B7/0838 , H01B7/0861 , H05K1/0242 , H05K1/025 , H05K3/28 , H05K3/281 , H05K2201/0323 , H05K2201/09236 , H05K2201/098 , H05K2201/09881
Abstract: A planarized cover layer structure of a flexible circuit board includes an insulation layer bonded through a first adhesive layer to a surface of each one of conductive signal lines laid on a substrate of a flexible circuit board. Separation areas respectively formed between adjacent ones of the conductive signal lines are each formed with a filling layer, so that the filling layer provides the first adhesive layer with a planarization height in the separation areas and the planarization height is substantially equal to the height of the conductive signal lines. The filling layer can alternatively be of a height that is higher than the surface of the conductor layer by a covering height so that the first adhesive layer has a planarization height in the separation areas and the planarization height is substantially equal to the sum of the height of the conductive signal lines and the covering height.
Abstract translation: 柔性电路板的平面化覆盖层结构包括通过第一粘合剂层粘合到布置在柔性电路板的基板上的每个导电信号线的表面的绝缘层。 分别在相邻的导电信号线之间形成的分离区域各自形成有填充层，使得填充层在分离区域中为第一粘合剂层提供平坦化高度，并且平坦化高度基本上等于 导电信号线。 填充层可以替代地具有比导体层的表面高一个覆盖高度的高度，使得第一粘合剂层在分离区域中具有平坦化高度，并且平坦化高度基本上等于高度 的导电信号线和覆盖高度。
-
公开(公告)号：US10980113B2
公开(公告)日：2021-04-13
申请号：US16412613
申请日：2019-05-15
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
Abstract: A circuit board structure that includes a resin-based conductive adhesive layer is disclosed, in which a conductive layer is arranged between a first circuit board and a second circuit board. The conductive layer includes a first conductive paste layer and the resin-based conductive adhesive layer is formed on the first conductive paste layer. The resin-based conductive adhesive layer contains a sticky resin material and a plurality of conductive particles distributed in the sticky resin material. The plurality of conductive particles establish an electrical connection between the first conductive paste layer and the resin-based conductive adhesive layer.
-
公开(公告)号：US10159143B1
公开(公告)日：2018-12-18
申请号：US16044962
申请日：2018-07-25
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Kuo-Fu Su , Chih-Heng Chuo , Gwun-Jin Lin
Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. A resin-based conductive adhesive layer is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The resin-based conductive adhesive layer is pressed to bond between the conductive paste coating zone and a top insulation layer such that the conductive paste coating zone and the resin-based conductive adhesive layer achieve electrical connection therebetween.
-
公开(公告)号：US09913369B2
公开(公告)日：2018-03-06
申请号：US15450204
申请日：2017-03-06
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Chih-Heng Chuo , Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K1/0245 , H05K1/0216 , H05K1/0219 , H05K1/0224 , H05K1/024 , H05K1/0253 , H05K1/032 , H05K2201/09336
Abstract: A circuit board structure with selectively corresponding ground layers includes a first ground layer, a second ground layer, and a dielectric layer arranged between the first ground layer and the second ground layer to define a ground layer height difference between the first ground layer and the second ground layer. The first ground layer includes a plurality of non-electromagnetic shield areas. The circuit board includes a plurality of conductor wires formed thereon and selectively classified and divided into a first group of conductor wires and the second group of conductor wires. The first-group conductor wires are arranged to correspond to and electromagnetically couple to the first ground layer, and the second-group conductor wires are arranged to correspond to and electromagnetically couple to the second ground layer through the non-electromagnetic shield areas respectively, so that impedance value control is achieved.
-
25.发明授权公开(公告)号：US09252510B2
公开(公告)日：2016-02-02
申请号：US14068041
申请日：2013-10-31
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Gwun-Jin Lin , Kuo-Fu Su , Chih-Heng Chuo
CPC classification number: H01R12/592 , H01R43/0256
Abstract: Disclosed is a soldering structure for mounting at least one connector on a flexible circuit board. The connector includes SMD pins and solder-dipping pins. The flexible circuit board has a connector mounting section having a component surface on which SMD soldering zones and solder-dipping pin holes are formed. A reinforcement plate is coupled to a reinforcement bonding surface of the flexible circuit board. The reinforcement plate has through holes corresponding to the solder-dipping pin holes of the flexible circuit board. The SMD pins of the connector are respectively soldered to the SMD soldering zones of the flexible circuit board, and the solder-dipping pins of the connector are respectively inserted through the solder-dipping pin holes of the flexible circuit board and the through holes of the reinforcement plate to the soldering surface of the reinforcement plate to be soldered with a solder material.
Abstract translation: 公开了一种用于将至少一个连接器安装在柔性电路板上的焊接结构。 连接器包括SMD引脚和焊锡引脚。 柔性电路板具有连接器安装部分，其具有形成有SMD焊接区域和焊料浸渍针孔的部件表面。 加强板联接到柔性电路板的加强结合表面。 加强板具有与柔性电路板的焊料浸渍针孔相对应的通孔。 连接器的SMD引脚分别焊接到柔性电路板的SMD焊接区域，连接器的焊料浸渍引脚分别插入柔性电路板的焊料浸渍针孔和 加强板加固板的焊接表面，以焊接材料焊接。
-
-
-
-
Search Results
25
records
(took 0.015 seconds)
