公开(公告)号：US20250098378A1

公开(公告)日：2025-03-20

申请号：US18369107

申请日：2023-09-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pei-Jung YANG ,  Jr-Wei LIN ,  Mei-Ju LU ,  Chi-Han CHEN

IPC: H01L33/58 ,  H01L25/075 ,  H01L25/16

Abstract: A method for manufacturing an optoelectronic structure and a package structure are provided. The method includes providing a substrate and a light source module and a photonic component over the substrate; and adjusting a lens structure to a unit specific position related to the substrate to couple an optical signal from the light source module to the photonic component.

公开(公告)号：US20240345343A1

公开(公告)日：2024-10-17

申请号：US18135080

申请日：2023-04-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Wen Chieh YANG

IPC: G02B6/42 ,  G02B6/43

CPC classification number: G02B6/4274 ,  G02B6/4244 ,  G02B6/4257 ,  G02B6/4295 ,  G02B6/43

Abstract: An electronic device includes a first transducer, a second transducer and a bridging component. The second transducer is spaced apart from the first transducer. The bridging component is configured for lateral optical-signal coupling with the first transducer and the second transducer.

公开(公告)号：US20240302589A1

公开(公告)日：2024-09-12

申请号：US18120346

申请日：2023-03-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Wen Chieh YANG

IPC: G02B6/122

CPC classification number: G02B6/122

Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component, a second photonic component, and an interposer. The first photonic component is disposed over the second photonic component. The interposer is optically coupled between the first photonic component and the second photonic component. The interposer is configured to define a first signal path therebetween.

公开(公告)号：US20230120036A1

公开(公告)日：2023-04-20

申请号：US17506462

申请日：2021-10-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/538

Abstract: An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.

公开(公告)号：US20230054600A1

公开(公告)日：2023-02-23

申请号：US17407070

申请日：2021-08-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Sin-Yuan MU ,  Chia-Sheng CHENG

IPC: G02B6/43 ,  G02B6/42 ,  G02B6/02 ,  G02B6/036

Abstract: An optoelectronic device includes a photonic component. The photonic component includes an active side, a second side different from the active side, and an optical channel extending from the active side to the second side of the photonic component. The optical channel includes a non-gaseous material configured to transmit light.

公开(公告)号：US20220214488A1

公开(公告)日：2022-07-07

申请号：US17144114

申请日：2021-01-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Feng YOU ,  Jr-Wei LIN ,  Chieh-Chen FU ,  Kao-Ming SU ,  Chen Yuan Weng

IPC: F21V8/00 ,  G02B6/36

Abstract: A device is provided. The device may be an optical device, a light coupling device, or a tunable light coupling device. The device includes a first portion, a lens, a light emitting element, and a waveguide. The first portion is disposed adjacent to a surface of a substrate and has a first side and a second side opposite to the first side. The light emitting element is disposed adjacent to the second side of the first portion. The lens is disposed adjacent to the first side of the first portion and between the light emitting element and the waveguide.

公开(公告)号：US20220196934A1

公开(公告)日：2022-06-23

申请号：US17127666

申请日：2020-12-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Sin-Yuan MU ,  Mei-Ju LU

IPC: G02B6/42

Abstract: A device is provided. The device may be an optical device, a light coupling device, or a device containing an optical structure. The device includes a waveguide, a cladding, and a light coupling material. The light coupling material is disposed adjacent to the waveguide and has a first surface and a second surface, where the second surface is disposed further away from the waveguide than the first surface and a thickness of the second surface is greater than that of the first surface.

公开(公告)号：US20220181264A1

公开(公告)日：2022-06-09

申请号：US17677962

申请日：2022-02-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Jr-Wei LIN

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/367 ,  H01L21/768 ,  H01L23/00 ,  H01L21/56

Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.

公开(公告)号：US20210175385A1

公开(公告)日：2021-06-10

申请号：US16709631

申请日：2019-12-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN

IPC: H01L31/153 ,  H01L31/0203 ,  H01L31/18 ,  H01L23/00

Abstract: A semiconductor package structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a substrate and a circuit. The substrate has a first portion and a second portion. A first thickness of the first portion is greater than a second thickness of the second portion. The circuit is disposed on the second portion of the substrate. The second semiconductor device is disposed on the circuit of the first semiconductor device.