Method of detecting an end point of plasma treatment
    21.
    发明授权
    Method of detecting an end point of plasma treatment 失效
    检测等离子体处理终点的方法

    公开(公告)号:US4936967A

    公开(公告)日:1990-06-26

    申请号:US368

    申请日:1987-01-05

    IPC分类号: H01J37/32

    CPC分类号: H01J37/32935

    摘要: The present invention relates to a method of and apparatus for detecting an end point of plasma treatment of a specimen. There is included selecting plasma spectrum having a characteristic wavelength from the plasma spectrum generating at the time of reaction in the plasma treatment of a specimen, setting a disregarding time for the plasma treatment end point detection, assuming, at the stage when the disregarding time for treatment end point detection has elapsed, a quantity of the selected plasma spectrum up to the time of said stage based on a quantity of same plasma spectrum at the time of said stage and a variation with the time in the last said quantity of plasma spectrum, and detecting the reaction time end point from the assumed quantity of plasma spectrum and an actual quantity of the same plasma spectrum after the time of said stage thereby making it possible to prevent erroneous detection of the end point of reaction in the plasma treatment and detect accurately the same even when the reaction time of the plasma treatment is short.

    摘要翻译: 本发明涉及一种用于检测样品的等离子体处理终点的方法和装置。 包括从在等离子体处理终点检测中设定无视等待时间的等离子体处理终点检测时,从等离子体处理中检测到的反应时产生的等离子体光谱中选出具有特征波长的等离子体光谱,假设在不考虑时间的情况下, 处理终点检测已经过去,基于所述阶段时相同等离子体光谱的量和所述最后所述等离子体光谱中的时间的变化,所选择的等离子体谱的数量直到所述阶段的时间, 并且从所述阶段的时间之后的等离子体谱的假定量和相同等离子体光谱的实际量检测反应时间终点,从而可以防止在等离子体处理中的反应结束点的错误检测并准确检测 即使当等离子体处理的反应时间短时也是如此。

    Wafer gripping device
    22.
    发明授权
    Wafer gripping device 失效
    晶圆夹持装置

    公开(公告)号:US4453757A

    公开(公告)日:1984-06-12

    申请号:US324121

    申请日:1981-11-23

    申请人: Minoru Soraoka

    发明人: Minoru Soraoka

    摘要: A wafer gripping device including a mechanism for automatically gripping a wafer by claws for transporting a wafer between an auxiliary vacuum chamber and a vacuum chamber of a semiconductor etching device. The claws for gripping a wafer have a vertical stroke increased when a wafer gripping operation is performed to enable the wafer to be gripped without any damage being caused thereto. The wafer gripping device includes a dust collection preventing member for minimizing dust collection.

    摘要翻译: 一种晶片夹持装置,包括用于通过爪自动夹持晶片的机构,用于在半导体蚀刻装置的辅助真空室和真空室之间输送晶片。 当执行晶片夹紧操作以使得能够夹持晶片而没有对其造成任何损坏时,用于夹紧晶片的爪具有增加的垂直行程。 晶片夹持装置包括用于最小化集尘的集尘防止部件。

    Load port
    28.
    发明申请
    Load port 审中-公开
    加载端口

    公开(公告)号:US20070066204A1

    公开(公告)日:2007-03-22

    申请号:US11405421

    申请日:2006-04-18

    IPC分类号: B08B15/02

    摘要: A load port is provided with a table and a plate. The table is arranged on a side of a front wall of an atmospheric transfer unit for transferring a piece of material under processing and is adapted to mount on it a container with the piece of material received in the same. The plate serves to isolate an interior of the atmospheric transfer unit from an exterior of the atmospheric transfer unit. The load port includes an exhaust duct arranged on a rear side of the plate and a fan arranged in a lower extremity of the exhaust duct. By the exhaust duct and the fan, an internal atmosphere of the atmospheric transfer unit can be exhausted into the atmosphere.

    摘要翻译: 装载端口设有工作台和板。 工作台布置在大气传送单元的前壁的一侧,用于传送正在加工的一块材料,并且适于在其上安装容纳该材料的容器。 该板用于将大气传送单元的内部与大气传送单元的外部隔离。 负载端口包括布置在板的后侧的排气管和布置在排气管的下端的风扇。 通过排风管和风扇,大气转移单元的内部气氛可以排放到大气中。