FIELD EFFECT TRANSISTOR
    21.
    发明申请
    FIELD EFFECT TRANSISTOR 失效
    场效应晶体管

    公开(公告)号:US20080150040A1

    公开(公告)日:2008-06-26

    申请号:US12034822

    申请日:2008-02-21

    IPC分类号: H01L29/78

    摘要: An field effect transistor includes a first semiconductor region, a gate electrode insulatively disposed over the first semiconductor region, source and drain electrodes between which the first semiconductor region is sandwiched, and second semiconductor regions each formed between the first semiconductor region and one of the source and drain electrodes, and having impurity concentration higher than that of the first semiconductor region, the source electrode being offset to the gate electrode in a direction in which the source electrode and the drain electrode are separated from each other with respect to a channel direction, and one of the second semiconductor regions having a thickness not more than a thickness with which the one of second semiconductor regions is completely depleted in the channel direction being in thermal equilibrium with the source electrode therewith.

    摘要翻译: 场效应晶体管包括第一半导体区域,绝缘地设置在第一半导体区域上的栅极电极,夹在第一半导体区域之间的源极和漏极电极以及形成在第一半导体区域和源极之一之间的第二半导体区域 和漏电极,其杂质浓度高于第一半导体区域,源电极在源电极和漏电极相对于沟道方向彼此分离的方向上偏移到栅电极, 并且所述第二半导体区域中的一个具有不大于所述第二半导体区域中的所述第二半导体区域在所述沟道方向上完全耗尽的厚度的厚度与所述源极电极处于热平衡。

    Field effect transistor
    22.
    发明授权
    Field effect transistor 有权
    场效应晶体管

    公开(公告)号:US07358550B2

    公开(公告)日:2008-04-15

    申请号:US11081348

    申请日:2005-03-16

    IPC分类号: H01L29/76

    摘要: An field effect transistor includes a first semiconductor region, a gate electrode insulatively disposed over the first semiconductor region, source and drain electrodes between which the first semiconductor region is sandwiched, and second semiconductor regions each formed between the first semiconductor region and one of the source and drain electrodes, and having impurity concentration higher than that of the first semiconductor region, the source electrode being offset to the gate electrode in a direction in which the source electrode and the drain electrode are separated from each other with respect to a channel direction, and one of the second semiconductor regions having a thickness not more than a thickness with which the one of second semiconductor regions is completely depleted in the channel direction being in thermal equilibrium with the source electrode therewith.

    摘要翻译: 场效应晶体管包括第一半导体区域,绝缘地设置在第一半导体区域上的栅极电极,夹在第一半导体区域之间的源极和漏极电极以及形成在第一半导体区域和源极之一之间的第二半导体区域 和漏电极,其杂质浓度高于第一半导体区域,源电极在源电极和漏电极相对于沟道方向彼此分离的方向上偏移到栅电极, 并且所述第二半导体区域中的一个具有不大于所述第二半导体区域中的所述第二半导体区域在所述沟道方向上完全耗尽的厚度的厚度与所述源极电极处于热平衡。

    Nonvolatile semiconductor memory device and manufacturing method thereof
    23.
    发明申请
    Nonvolatile semiconductor memory device and manufacturing method thereof 失效
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US20070291539A1

    公开(公告)日:2007-12-20

    申请号:US11699334

    申请日:2007-01-30

    IPC分类号: G11C11/34 H01L21/822

    摘要: A nonvolatile semiconductor memory device includes a semiconductor substrate, plural semiconductor columns arranged in a matrix form on the substrate, plural first conductive areas zonally formed in a column direction on the substrate between the semiconductor columns and functioning as word lines, plural second conductive areas formed at tops of the semiconductor columns, respectively, plural bit lines connecting the second conductive areas in a row direction, plural channel areas respectively formed in the semiconductor columns between the first and second conductive areas and contacting the first and second conductive areas, plural third conductive areas continuously formed via first insulating films above the substrate and opposite to the channel areas in the column direction between the semiconductor columns and functioning as control gates, and plural charge accumulation areas respectively formed via second insulating films at upper portions of the channel areas at a position higher than the third conductive areas.

    摘要翻译: 非易失性半导体存储器件包括:半导体衬底,以矩阵形式布置在衬底上的多个半导体柱,在半导体柱之间的衬底上的列方向上分区形成的多个第一导电区域,并且用作字线,形成多个第二导电区域 在半导体柱的顶部分别分别连接在行方向上的第二导电区域的多个位线,分别形成在第一和第二导电区域之间的半导体柱中并与第一和第二导电区域接触的多个沟道区域,多个第三导电 通过基板上方的第一绝缘膜连续形成的区域,并且与半导体柱之间的列方向上的沟道区域相对,并且用作控制栅极,以及分别在沟道区域的上部经由第二绝缘膜形成的多个电荷累积区域 位置高 她比第三个导电区域。

    Field effect transistor and manufacturing method thereof
    24.
    发明授权
    Field effect transistor and manufacturing method thereof 失效
    场效应晶体管及其制造方法

    公开(公告)号:US07589381B2

    公开(公告)日:2009-09-15

    申请号:US11519794

    申请日:2006-09-13

    IPC分类号: H01L47/00

    摘要: A field effect transistor includes a first semiconductor region forming a channel region, a gate electrode insulatively disposed above the first semiconductor region, source and drain electrodes formed to sandwich the first semiconductor region in a channel lengthwise direction, and second semiconductor regions formed between the first semiconductor region and the source and drain electrodes and having impurity concentration higher than the first semiconductor region. The thickness of the second semiconductor region in the channel lengthwise direction is set to a value equal to or less than depletion layer width determined by the impurity concentration so that the second semiconductor region is depleted in a no-voltage application state.

    摘要翻译: 场效应晶体管包括形成沟道区域的第一半导体区域,绝缘地设置在第一半导体区域上方的栅电极,形成为在沟道纵向方向夹着第一半导体区域的源电极和漏电极,以及形成在第一半导体区域之间的第二半导体区域 半导体区域和源极和漏极,并且具有高于第一半导体区域的杂质浓度。 通道长度方向上的第二半导体区域的厚度被设定为等于或小于由杂质浓度确定的耗尽层宽度的值,使得第二半导体区域在无电压施加状态下耗尽。

    Fin-type channel transistor and method of manufacturing the same
    25.
    发明授权
    Fin-type channel transistor and method of manufacturing the same 失效
    鳍型沟道晶体管及其制造方法

    公开(公告)号:US07521752B2

    公开(公告)日:2009-04-21

    申请号:US11384269

    申请日:2006-03-21

    IPC分类号: H01L27/108 H01L29/94

    摘要: It is possible to reliably implant an impurity into an impurity forming region, and to form a self-aligned silicides on the entire portion of the source and drain regions. There are provided: a first semiconductor layer of a first conductivity type in a substantially a rectangular solid shape formed on a substrate; a gate electrode formed on a pair of first side portions of the first semiconductor layer facing to each other with a gate insulating film being placed between the gate electrode and the first side portions; a second semiconductor layer of the first conductivity type connected to bottom portions of a pair of second side portions of the first semiconductor layer placed in a substantially perpendicular direction with respect to the first side portions, the second semiconductor layer extending along the substantially perpendicular direction; a first impurity region of a second conductivity type formed in the second semiconductor layer; second impurity regions formed on the pair of side portions of the first semiconductor layer and connected to the first impurity region; and a channel region formed between the second impurity regions of the first semiconductor layer.

    摘要翻译: 可以将杂质可靠地注入到杂质形成区域中,并且在源极和漏极区域的整个部分上形成自对准的硅化物。 提供:形成在基板上的基本为矩形的实心形状的第一导电类型的第一半导体层; 形成在所述第一半导体层的一对第一侧部分上的栅电极,栅极绝缘膜位于所述栅电极和所述第一侧部之间,所述栅极绝缘膜彼此面对; 所述第一导电类型的第二半导体层连接到所述第一半导体层的一对第二侧部的与所述第一侧部大致垂直的方向上的第二侧部的底部,所述第二半导体层沿着大致垂直的方向延伸; 形成在第二半导体层中的第二导电类型的第一杂质区; 第二杂质区,形成在第一半导体层的一对侧部并连接到第一杂质区; 以及形成在第一半导体层的第二杂质区之间的沟道区。

    SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SAME
    26.
    发明申请
    SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SAME 审中-公开
    半导体装置及其制造方法

    公开(公告)号:US20080237655A1

    公开(公告)日:2008-10-02

    申请号:US12053873

    申请日:2008-03-24

    IPC分类号: H01L27/12 H01L21/84

    摘要: A semiconductor apparatus includes: a support substrate made of a semiconductor; an insulating layer provided on the support substrate and having a first and a second openings; a semiconductor fin having a channel section, a first and second buried regions, a source section and a drain section; a gate insulating film covering a side face of the channel section; and a gate electrode opposed to the side face of the channel section across the gate insulating film. The channel section is provided upright on the insulating layer between the first and the second openings. The first and the second buried regions are provided in the first and the second openings on both sides of the channel section. The source-drain sections are provided on the first and the second buried regions and connected to the channel section.

    摘要翻译: 半导体装置包括:由半导体制成的支撑基板; 绝缘层,设置在所述支撑基板上并且具有第一和第二开口; 具有通道部分,第一和第二掩埋区域,源极部分和漏极部分的半导体鳍片; 覆盖所述通道部分的侧面的栅极绝缘膜; 以及栅极电极,与栅极绝缘膜的沟道部分的侧面相对。 通道部分直立地设置在第一和第二开口之间的绝缘层上。 第一和第二掩埋区域设置在通道部分两侧的第一和第二开口中。 源极 - 漏极部分设置在第一和第二埋置区域上并且连接到沟道部分。

    METHOD OF FABRICATING SEMICONDUCTOR DEVICE
    27.
    发明申请
    METHOD OF FABRICATING SEMICONDUCTOR DEVICE 审中-公开
    制造半导体器件的方法

    公开(公告)号:US20080227241A1

    公开(公告)日:2008-09-18

    申请号:US12043327

    申请日:2008-03-06

    IPC分类号: H01L21/84

    摘要: A semiconductor device fabrication method for forming on a wafer-bonded substrate p- and n-type FinFETs each having a channel plane exhibiting high carrier mobility is disclosed. First, prepare two semiconductor wafers. Each wafer has a surface of {100} crystalline orientation and a direction. These wafers are surface-bonded together so that the directions of upper and lower wafers cross each other at a rotation angle, thereby providing a “hybrid” crystal-oriented substrate. On this substrate, form semiconductor regions, one of which is identical in direction to the upper wafer, and the other of which is equal in direction to the lower wafer. In the one region, form a pFinFET having {100} channel plane. In the other region, form an nFinFET having its channel direction in parallel or perpendicular to that of the pFinFET. A CMOS FinFET structure is thus obtained.

    摘要翻译: 公开了一种半导体器件制造方法,用于在晶片结合的衬底上形成各自具有表现出高载流子迁移率的沟道平面的p型和n型FinFET。 首先,准备两个半导体晶圆。 每个晶片具有{100}晶体取向和<110>方向的表面。 这些晶片被表面粘合在一起,使得上下晶片的<110>方向以旋转角彼此交叉,从而提供“混合”的晶体取向基板。 在该衬底上,形成半导体区域,其中一个在<110>方向上与上晶片相同,另一个在<110>方向与下晶片相等。 在一个区域中,形成具有{100}通道平面的pFinFET。 在另一区域,形成其通道方向平行或垂直于pFinFET的nFinFET。 由此获得CMOS FinFET结构。

    Nonvolatile semiconductor memory device and manufacturing method thereof
    28.
    发明授权
    Nonvolatile semiconductor memory device and manufacturing method thereof 失效
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US07569879B2

    公开(公告)日:2009-08-04

    申请号:US11699334

    申请日:2007-01-30

    IPC分类号: H01L29/788

    摘要: A nonvolatile semiconductor memory device includes a semiconductor substrate, plural semiconductor columns arranged in a matrix form on the substrate, plural first conductive areas zonally formed in a column direction on the substrate between the semiconductor columns and functioning as word lines, plural second conductive areas formed at tops of the semiconductor columns, respectively, plural bit lines connecting the second conductive areas in a row direction, plural channel areas respectively formed in the semiconductor columns between the first and second conductive areas and contacting the first and second conductive areas, plural third conductive areas continuously formed via first insulating films above the substrate and opposite to the channel areas in the column direction between the semiconductor columns and functioning as control gates, and plural charge accumulation areas respectively formed via second insulating films at upper portions of the channel areas at a position higher than the third conductive areas.

    摘要翻译: 非易失性半导体存储器件包括:半导体衬底,以矩阵形式布置在衬底上的多个半导体柱,在半导体柱之间的衬底上的列方向上分区形成的多个第一导电区域,并且用作字线,形成多个第二导电区域 在半导体柱的顶部分别分别连接在行方向上的第二导电区域的多个位线,分别形成在第一和第二导电区域之间的半导体柱中并与第一和第二导电区域接触的多个沟道区域,多个第三导电 通过基板上方的第一绝缘膜连续形成的区域,并且与半导体柱之间的列方向上的沟道区域相对,并且用作控制栅极,以及分别在沟道区域的上部经由第二绝缘膜形成的多个电荷累积区域 位置高 她比第三个导电区域。

    Fin-type channel transistor and method of manufacturing the same

    公开(公告)号:US20060220131A1

    公开(公告)日:2006-10-05

    申请号:US11384269

    申请日:2006-03-21

    摘要: It is possible to reliably implant an impurity into an impurity forming region, and to form a self-aligned silicides on the entire portion of the source and drain regions. There are provided: a first semiconductor layer of a first conductivity type in a substantially a rectangular solid shape formed on a substrate; a gate electrode formed on a pair of first side portions of the first semiconductor layer facing to each other with a gate insulating film being placed between the gate electrode and the first side portions; a second semiconductor layer of the first conductivity type connected to bottom portions of a pair of second side portions of the first semiconductor layer placed in a substantially perpendicular direction with respect to the first side portions, the second semiconductor layer extending along the substantially perpendicular direction; a first impurity region of a second conductivity type formed in the second semiconductor layer; second impurity regions formed on the pair of side portions of the first semiconductor layer and connected to the first impurity region; and a channel region formed between the second impurity regions of the first semiconductor layer.

    Semiconductor device and method of manufacturing the same

    公开(公告)号:US08343870B2

    公开(公告)日:2013-01-01

    申请号:US12585034

    申请日:2009-09-01

    IPC分类号: H01L21/44

    摘要: A semiconductor device which can effectively suppress a short channel effect and junction leakage is provided. A semiconductor device includes a field effect transistor. The field effect transistor includes a first semiconductor region of a first conductivity type, a gate electrode formed on a gate insulating film, and source and drain electrodes. The field effect transistor also includes second semiconductor regions of a second conductivity type. The field effect transistor further includes third semiconductor regions of the second conductivity type having an impurity concentration higher than that of the second semiconductor region and formed between the source electrode and the first and second semiconductor regions and between the drain electrode and the first and second semiconductor regions, and side wall insulating films formed on both the side surfaces of the gate electrode. The source electrode and the drain electrode are separated from the side wall insulating films.