Holographic display device and driving method thereof, and display cabinet

    公开(公告)号:US10802442B2

    公开(公告)日:2020-10-13

    申请号:US15956234

    申请日:2018-04-18

    Inventor: Hao Chen

    Abstract: A holographic display device is provided, comprising a spatial light modulator. The spatial light modulator is configured to load at least one composite hologram, and one of the at least one composite hologram is formed by superposing N sub-holograms. The holographic display device further comprises a light source arranged on a light incoming side of the spatial light modulator. The light source is configured to provide readout light to the spatial light modulator. The light source comprises M light source components. The direction of propagation of emergent light of each of at least two light source components among the M light source components is identical to the direction of propagation of a reference wave corresponding to one of the N sub-holograms, wherein M≥N≥2, and M and N are positive integers.

    Array substrate, manufacturing method thereof and display device

    公开(公告)号:US10109653B2

    公开(公告)日:2018-10-23

    申请号:US15568155

    申请日:2017-05-12

    Abstract: An array substrate, a manufacturing method thereof and a display device are provided. The array substrate includes: a base substrate; a thin-film transistor and a first conductive layer formed on the base substrate; and a passivation layer formed on the TFT and the first conductive layer. The TFT includes a source electrode and a drain electrode; the first conductive layer is arranged in the same layer with the source electrode and the drain electrode; a second conductive layer is disposed on a side of the first conductive layer opposite to the passivation layer; the passivation layer is provided with a through hole penetrating therethrough; and an orthographic projection of the through hole on the base substrate falls within an orthographic projection of the first conductive layer on the base substrate and falls within an orthographic projection of the second conductive layer on the base substrate.

    Monitoring device and monitoring method

    公开(公告)号:US12010460B2

    公开(公告)日:2024-06-11

    申请号:US17427476

    申请日:2020-10-29

    CPC classification number: H04N7/18 G02B7/02 G02B7/182

    Abstract: The monitoring device of the disclosure includes a carrying unit having at least one carrying area for carrying a monitored object, at least part of the carrying area is provided with a corresponding image capturing unit and a corresponding optical path adjusting unit; the image capturing unit captures a monitoring image of the carrying area, each image capturing unit has a preset field of view, each image capturing unit forms the monitoring image according to light incident from the field of view; at least part of the carrying area is an extension area, the extension area is positioned outside the field of view of the image capturing unit; the optical path adjusting unit enables the light emitted from the extension area of the carrying area corresponding thereto to enter the image capturing unit from the field of view of the image capturing unit corresponding to the carrying area.

    Method for transferring chip, display device, chip and target substrate

    公开(公告)号:US11901486B2

    公开(公告)日:2024-02-13

    申请号:US17256185

    申请日:2020-04-03

    Abstract: Provided is a method for transferring a chip, including: disposing a target substrate in a sealed chamber; applying charges of different polarities to a first alignment bonding structure of the target substrate and a first chip bonding structure of the chip, and injecting an insulation fluid flowing in a first direction into the sealed chamber, so that the first chip bonding structure is aligned with the first alignment bonding structure; applying charges of different polarities to a second alignment bonding structure of the target substrate and a second chip bonding structure of the chip, and changing the flowing direction of the insulation fluid to a second direction, so that the second chip bonding structure is aligned with the second alignment bonding structure; and applying a bonding force to the chip, so that the chip bonding structures is bonded to the alignment bonding structures.

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