LED lighting devices
    26.
    发明授权

    公开(公告)号:US10158057B2

    公开(公告)日:2018-12-18

    申请号:US13828297

    申请日:2013-03-14

    Abstract: Packaged chip-on-board (COB) LED arrays are provided where a color conversion medium is distributed within a glass containment plate, rather than silicone, to reduce the operating temperature of the color conversion medium and avoid damage while increasing light output. A lighting device is provided comprising a chip-on-board (COB) light emitting diode (LED) light source, a light source encapsulant, a distributed color conversion medium, and a glass containment plate. The COB LED light source comprises a thermal heat sink framework and at least one LED and defines a light source encapsulant cavity in which the light source encapsulant is distributed over the LED. The glass containment plate is positioned over the light source encapsulant cavity and contains the distributed color conversion medium. The light source encapsulant is distributed over the LED at a thickness that is sufficient to encapsulate the LED and define encapsulant thermal conduction paths.

    LED LIGHTING DEVICES
    28.
    发明申请
    LED LIGHTING DEVICES 审中-公开
    LED照明设备

    公开(公告)号:US20130175558A1

    公开(公告)日:2013-07-11

    申请号:US13828297

    申请日:2013-03-14

    Abstract: Packaged chip-on-board (COB) LED arrays are provided where a color conversion medium is distributed within a glass containment plate, rather than silicone, to reduce the operating temperature of the color conversion medium and avoid damage while increasing light output. In accordance with one embodiment of the present disclosure, a lighting device is provided comprising a chip-on-board (COB) light emitting diode (LED) light source, a light source encapsulant, a distributed color conversion medium, and a glass containment plate. The COB LED light source comprises a thermal heat sink framework and at least one LED and defines a light source encapsulant cavity in which the light source encapsulant is distributed over the LED. The glass containment plate is positioned over the light source encapsulant cavity and contains the distributed color conversion medium. The light source encapsulant is distributed over the LED at a thickness that is sufficient to encapsulate the LED and define encapsulant thermal conduction paths TPE extending through the light source encapsulant to the thermal heat sink framework from the distributed color conversion medium.

    Abstract translation: 提供了封装的芯片上(COB)LED阵列,其中颜色转换介质分布在玻璃容纳板而不是硅胶中,以降低颜色转换介质的工作温度,并在增加光输出的同时避免损坏。 根据本公开的一个实施例,提供了一种照明装置,其包括芯片上的(COB)发光二极管(LED)光源,光源密封剂,分布式颜色转换介质和玻璃容纳板 。 COB LED光源包括热散热器框架和至少一个LED并且限定光源密封剂腔,光源密封剂分布在LED上。 玻璃容纳板位于光源密封腔上方,并包含分布式颜色转换介质。 光源密封剂以足够的厚度分布在LED上,该厚度足以封装LED并且从分布式颜色转换介质定义通过光源密封剂延伸到热散热器框架的密封剂热传导路径TPE。

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