公开(公告)号：US06882535B2

公开(公告)日：2005-04-19

申请号：US10405055

申请日：2003-03-31

申请人： Nick Labanok ,  Sabina J. Houle

发明人： Nick Labanok ,  Sabina J. Houle

IPC分类号： H01L23/36 ,  H01L23/40 ,  H01L23/42 ,  H05K7/20

CPC分类号： H01L23/36 ,  H01L23/4006 ,  H01L23/4093 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2224/0401

摘要： A downset edge integrated heat spreader is disclosed. The downset edge can be formed to an industrially accepted flatness with a single stamping operation. The downset edge can provide a surface for fastening the downset edge integrated heat spreader to a mounting substrate. The downset edge can also provide a component recess for mounting a component near a processor, but on the mounting substrate. The downset edge can also provide a warp and bend resistant structure during ordinary field use.

公开(公告)号：US06837306B2

公开(公告)日：2005-01-04

申请号：US09955889

申请日：2001-09-18

申请人： Sabina J. Houle ,  Paul A. Koning ,  Greg M. Chrysler

发明人： Sabina J. Houle ,  Paul A. Koning ,  Greg M. Chrysler

IPC分类号： H01L23/373 ,  H05K7/20

CPC分类号： H01L21/4882 ,  H01L23/373 ,  H01L23/3733 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/15321 ,  H01L2924/16195 ,  Y10T428/24994 ,  Y10T428/249945 ,  H01L2224/0401

摘要： A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers facilitate the spreading of heat away from the smaller semiconductor device and up to a larger heat removal device, such as a heat sink.

摘要翻译： 描述了由在多个方向上取向的多个碳纤维构成的散热器，其中分布在纤维周围的碳或金属基体材料。 碳纤维有助于将热量从较小的半导体器件扩散到更大的散热装置，例如散热器。

公开(公告)号：US06748350B2

公开(公告)日：2004-06-08

申请号：US09963438

申请日：2001-09-27

申请人： Christopher L. Rumer ,  Sabina J. Houle

发明人： Christopher L. Rumer ,  Sabina J. Houle

IPC分类号： G06G748

CPC分类号： H01L23/3675 ,  H01L23/34 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/16152

摘要： A device and method identify and compensate for tensile and/or shear stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method may change the shape of the integrated heat spreader based upon the identification of location(s) of high tensile and/or shear stress so that additional thermal interface material may be deposited between the integrated heat spreader and a die in corresponding locations. Utilizing this method and device, heat is efficiently transferred from the die to the integrated heat spreader.

摘要翻译： 一种装置和方法识别和补偿由于集成散热器和热界面材料之间的热引起的膨胀和收缩引起的拉伸和/或剪切应力。 该装置和方法可以基于识别高拉伸和/或剪切应力的位置来改变集成散热器的形状，使得额外的热界面材料可以沉积在集成的散热器和相应位置的模具之间 。 利用该方法和装置，将热量从模具有效地传递到集成散热器。

公开(公告)号：US5544458A

公开(公告)日：1996-08-13

申请号：US27078

申请日：1993-03-05

申请人： Daniel J. Fisher ,  Douglas Crank ,  Marc A. Lovell ,  Sabina J. Houle ,  James L. Brodie

发明人： Daniel J. Fisher ,  Douglas Crank ,  Marc A. Lovell ,  Sabina J. Houle ,  James L. Brodie

IPC分类号： E06B3/54 ,  B29C45/14 ,  B29C70/76 ,  B32B7/10 ,  B60J1/00 ,  B60J10/00 ,  B60J10/02 ,  E06B3/62 ,  B60J1/10

CPC分类号： B29C45/14434 ,  B29C70/763 ,  B60J1/10 ,  B60J10/30 ,  B60J10/70 ,  B29K2105/0097 ,  B29K2709/02 ,  Y10S425/047

摘要： A single-sided gasketed panel assembly for use as a flush-mounted panel or window in vehicles, buildings, or other structures, as well as a method and apparatus for making such panel assemblies, wherein the panel assembly comprises a sheet-like panel having; a primer layer and at least one polymeric gasket molded to the panel on the primer layer. The primer applied to the panel has a predetermined transition temperature above which improved adhesion properties are exhibited for polymeric gaskets molded thereon when the primer is at or above such temperature. In a preferred embodiment, a gasket is molded from a thermoplastic polymeric material such as PVC onto the primed portion of the panel while the panel is at or above the transition temperature. The resulting bond between the gasket and panel can withstand a shear force greater than 300 pounds per square inch at a rate of 25 millimeters per minute and a 180.degree. peel test force greater than 30 pounds per linear inch at a rate of 25 millimeters per minute after soaking for at least 250 hours in water having a temperature greater than 175.degree. F.The method for manufacturing the panel assembly includes applying a primer having a predetermined transition temperature as a coating to a surface of a panel, heating the panel and primer coating to a temperature at least equal to the transition temperature of the primer, and molding a gasket, preferably of a thermoplastic polymeric material, onto the surface of the heated panel and the primer coating while the temperature of the primer coating is at least equal to the primer transition temperature. The preferred mold assembly includes a mold cavity defined in a facing surface of one mold section and a heat insulative pad in the second mold section, the pad being urged against the surface of a sheet-like panel at a position opposite the mold cavity when the mold sections are closed.

摘要翻译： 一种在车辆，建筑物或其他结构中用作平面安装的面板或窗户的单面密封面板组件，以及用于制造这种面板组件的方法和装置，其中面板组件包括片状面板，其具有 ; 底漆层和模塑到底漆层上的面板的至少一个聚合物垫片。 施加到面板上的底漆具有预定的转变温度，当底漆处于或高于该温度时，在其上模塑的聚合物垫圈上显示出改进的粘合性能。 在一个优选实施例中，垫片由诸如PVC的热塑性聚合物材料模制到面板的底漆部分上，而面板处于或高于转变温度。 垫圈和面板之间的结合可以每分钟25毫米的速率承受大于300磅/平方英寸的剪切力，每分钟25毫米的速度可以承受大于30磅每线性英寸的180度剥离试验力 在温度大于175°F的水中浸泡至少250小时之后。面板组件的制造方法包括将具有预定转变温度的底漆作为涂层施加到面板表面，加热面板和底漆涂层 至少等于底漆的转变温度的温度，并将优选由热塑性聚合物材料制成的垫片模塑到加热面板和底漆涂层的表面上，同时底漆涂层的温度至少等于 引物转变温度。 优选的模具组件包括限定在一个模具部分的相对表面中的模具腔和第二模具部分中的绝热垫，当所述模具腔在与模具腔相对的位置处，所述衬垫被推压在片状面板的表面上， 模具部分关闭。

公开(公告)号：US20140312487A1

公开(公告)日：2014-10-23

申请号：US14320210

申请日：2014-06-30

申请人： Sabina J. Houle ,  James P. Mellody

发明人： Sabina J. Houle ,  James P. Mellody

IPC分类号： H01L23/28 ,  H01L23/34

CPC分类号： H01L23/3675 ,  H01L21/50 ,  H01L23/28 ,  H01L23/3142 ,  H01L23/34 ,  H01L23/3736 ,  H01L23/42 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/81 ,  H01L2224/0401

摘要： A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel, and mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates by mounting perimeter ribs of the IHS panel to a corresponding pattern of sealant on the substrate panel and by mounting each of the plurality of dies to a corresponding one of the plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel. Other embodiments are also disclosed and claimed.

摘要翻译： 一种制造微电子封装的方法，以及根据该方法制造的微电子封装。 该方法包括：将多个IC管芯结合并热耦合到IHS面板以产生载流子IHS面板，以及通过将周边肋条安装在包含多个封装衬底的衬底面板上来将芯片承载IHS面板安装 IHS面板到基板面板上的相应的密封剂图案，并且通过将多个模具中的每一个安装到多个封装衬底中的对应的一个封装衬底中，以产生包括安装到衬底面板的芯片承载IHS面板的组合。 还公开并要求保护其他实施例。

公开(公告)号：US08215536B2

公开(公告)日：2012-07-10

申请号：US11613490

申请日：2006-12-20

申请人： Harikrishnan Ramanan ,  Nitin Deshpande ,  Sabina J. Houle

发明人： Harikrishnan Ramanan ,  Nitin Deshpande ,  Sabina J. Houle

IPC分类号： B23K1/20

CPC分类号： B23K3/082 ,  B05B5/032 ,  B05B5/0403 ,  B05B7/0861 ,  B05B12/36 ,  B05B14/30 ,  B05B15/65 ,  B05C5/02 ,  B23K35/0244 ,  Y10T137/2931

摘要： A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.

摘要翻译： 通过使焊剂组合物在喷雾帽内旋转，并且在焊剂液体离开喷雾帽之前，通过流体扰动其流动，将焊剂组合物喷涂到基底上。

公开(公告)号：US07723160B2

公开(公告)日：2010-05-25

申请号：US11360245

申请日：2006-02-23

申请人： Sabina J. Houle ,  James Christopher Matayabas, Jr.

发明人： Sabina J. Houle ,  James Christopher Matayabas, Jr.

IPC分类号： H01L21/00

CPC分类号： H01L23/3736 ,  H01L2224/13109 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provide composite thermal conduction and circulated liquid cooling. Embodiments are further shown that require simple, low numbers of manufacturing steps and reduced thermal interface thickness.

摘要翻译： 提供了一种用于导热的方法和装置。 描述了一种热界面装置和形成方法，其包括诸如改进的界面强度和改进的界面接触的优点。 示出了提供复合热传导和循环液体冷却的热传导结构的实施例。 进一步示出了实施例，其需要简单，低数量的制造步骤和降低的热界面厚度。

公开(公告)号：US20090321963A1

公开(公告)日：2009-12-31

申请号：US12165358

申请日：2008-06-30

申请人： Sabina J. Houle

发明人： Sabina J. Houle

IPC分类号： H01L23/28

CPC分类号： H01L23/16 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/19 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/00

摘要： In some embodiments, an injection molded metal stiffener for packaging applications is presented. In this regard, an apparatus is introduced comprising a microelectronic device package substrate, a microelectronic device coupled with a top surface of the package substrate, and an injection-molded, metal stiffener coupled with the package substrate, wherein the stiffener includes a central opening and at least partially surrounds the microelectronic device. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，提供了用于包装应用的注射成型金属加强件。 在这方面，引入了包括微电子器件封装衬底，与封装衬底的顶表面耦合的微电子器件以及与封装衬底耦合的注射成型的金属加强件的装置，其中加强件包括中心开口和 至少部分地围绕微电子器件。 还公开并要求保护其他实施例。

公开(公告)号：US07416922B2

公开(公告)日：2008-08-26

申请号：US10405095

申请日：2003-03-31

申请人： Sabina J. Houle ,  Carl Deppisch

发明人： Sabina J. Houle ,  Carl Deppisch

IPC分类号： H01L21/50

CPC分类号： H01L21/4882 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

摘要： A process of making an integrated heat spreader is disclosed. The integrated heat spreader is stamped with a thermal interface material under conditions to form a diffusion bonding zone between the integrated heat spreader and the thermal interface material. The thermal interface material can have one of several cross-sectional profiles to facilitate reflow thereof against a die during a method of assembling a packaged microelectronic device. The thermal interface material can also have one of several footprints to further facilitate reflow thereof against the die.

摘要翻译： 公开了一种制造集成散热器的工艺。 集成的散热器在条件下用热界面材料冲压以在集成散热器和热界面材料之间形成扩散结合区。 在组装封装的微电子器件的方法期间，热界面材料可以具有几个横截面轮廓之一，以促进其相对于模具的回流。 热界面材料还可以具有几个覆盖区中的一个，以进一步促进其与模具的回流。

公开(公告)号：US07358606B2

公开(公告)日：2008-04-15

申请号：US10857303

申请日：2004-05-28

申请人： Christopher L. Rumer ,  Sabina J. Houle

发明人： Christopher L. Rumer ,  Sabina J. Houle

IPC分类号： H01L23/34

CPC分类号： H01L23/3675 ,  H01L23/34 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/16152

摘要： A device and method identify and compensate for tensile stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method change the shape of the integrated heat spreader based upon the identification of the location of the highest tensile and/or shear stress so that additional thermal interface material is deposited between the integrated heat spreader and a die. Utilizing this method and device, heat is efficiently transferred from the die to the integrated heat spreader.

摘要翻译： 一种装置和方法识别和补偿由于集成散热器和热界面材料之间的热引起的膨胀和收缩引起的拉伸应力。 该装置和方法基于识别最高拉伸和/或剪切应力的位置来改变集成散热器的形状，使得额外的热界面材料沉积在集成散热器和模具之间。 利用该方法和装置，将热量从模具有效地传递到集成散热器。