公开(公告)号：US06882535B2

公开(公告)日：2005-04-19

申请号：US10405055

申请日：2003-03-31

申请人： Nick Labanok ,  Sabina J. Houle

发明人： Nick Labanok ,  Sabina J. Houle

IPC分类号： H01L23/36 ,  H01L23/40 ,  H01L23/42 ,  H05K7/20

CPC分类号： H01L23/36 ,  H01L23/4006 ,  H01L23/4093 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2224/0401

摘要： A downset edge integrated heat spreader is disclosed. The downset edge can be formed to an industrially accepted flatness with a single stamping operation. The downset edge can provide a surface for fastening the downset edge integrated heat spreader to a mounting substrate. The downset edge can also provide a component recess for mounting a component near a processor, but on the mounting substrate. The downset edge can also provide a warp and bend resistant structure during ordinary field use.

公开(公告)号：US07015073B2

公开(公告)日：2006-03-21

申请号：US10807220

申请日：2004-03-22

申请人： Sabina J. Houle ,  Nick Labanok

发明人： Sabina J. Houle ,  Nick Labanok

IPC分类号： H01L21/44

CPC分类号： H01L23/3675 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： Numerous embodiments of a heat spreader, comprised of a plurality of downset legs, which provides a simple and lower cost method of forming a heat spreader as compared to conventional methods are disclosed, as well as novel apparatus and methods for attaching the heat spreader to a substrate and a secondary device to the heat spreader, are disclosed.

摘要翻译： 公开了散热器的许多实施例，其包括多个下降支腿，其与传统方法相比提供了形成散热器的简单且成本较低的方法，以及用于将散热器附接到 衬底和到散热器的辅助装置。

公开(公告)号：US06756669B2

公开(公告)日：2004-06-29

申请号：US10118220

申请日：2002-04-05

申请人： Sabina J. Houle ,  Nick Labanok

发明人： Sabina J. Houle ,  Nick Labanok

IPC分类号： H01L2310

CPC分类号： H01L23/3675 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： Numerous embodiments of a heat spreader, comprised of a plurality of downset legs, which provides a simple and lower cost method of forming a heat spreader as compared to conventional methods are disclosed, as well as novel apparatus and methods for attaching the heat spreader to a substrate and a secondary device to the heat spreader, are disclosed.

摘要翻译： 公开了散热器的许多实施例，其包括多个下降支腿，其与传统方法相比提供了形成散热器的简单且成本较低的方法，以及用于将散热器附接到 衬底和到散热器的辅助装置。

公开(公告)号：US08308047B2

公开(公告)日：2012-11-13

申请号：US11612652

申请日：2006-12-19

申请人： Joel Williams ,  Sonny J. Randall ,  Steven B. Roach ,  Sabina J. Houle

发明人： Joel Williams ,  Sonny J. Randall ,  Steven B. Roach ,  Sabina J. Houle

IPC分类号： B23K1/20 ,  B05C5/02 ,  B05C17/06

CPC分类号： H05K3/3489 ,  B23K1/203 ,  B23K2101/40 ,  H05K2203/0557 ,  H05K2203/1366

摘要： A flux spray head, a mask, and an integrated circuit substrate are arranged in a flux spray station to reduce flux overspray during a spraying operation. A support element within the spray station is used to align the substrate with the mask and spray head. A portion of the mask contacts the substrate along a boundary between a region to be sprayed and a region to be masked. The flux spray head sprays the substrate while a portion of the mask is in contact with the boundary of the region to be masked. In an embodiment, the mask may comprise one or more replaceable non-stick stencil elements and associated springs to press the stencil elements against the substrate. Each stencil element may have a wall to contact the substrate along a portion of the boundary.

摘要翻译： 焊剂喷射头，掩模和集成电路基板布置在焊剂喷射站中以在喷涂操作期间减少焊剂过量喷射。 喷雾站内的支撑元件用于将基底与掩模和喷头对准。 掩模的一部分沿着待喷射区域和待掩蔽区域之间的边界接触基板。 助焊剂喷头喷射衬底，同时掩模的一部分与待掩蔽区域的边界接触。 在一个实施例中，掩模可以包括一个或多个可替换的不粘模版元件和相关联的弹簧，以将模版元件压靠在基底上。 每个模板元件可以具有沿着边界的一部分接触基板的壁。

公开(公告)号：US08067256B2

公开(公告)日：2011-11-29

申请号：US11864279

申请日：2007-09-28

申请人： Sabina J. Houle ,  James P. Mellody

发明人： Sabina J. Houle ,  James P. Mellody

IPC分类号： H01L21/00

CPC分类号： H01L23/36 ,  H01L21/563 ,  H01L23/4334 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2224/81 ,  H01L2924/00

摘要： A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel; mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel; and singulating the combination to yield a plurality of microelectronic packages, each of the packages including: an IHS component of the IHS panel, one of the plurality IC dies bonded and thermally coupled to said IHS component and one of the plurality of package substrates, said IHS component and said one of the plurality of IC dies being mounted to said one of the plurality of package substrates to form said each of the packages.

摘要翻译： 一种制造微电子封装的方法，以及根据该方法制造的微电子封装。 该方法包括：将多个IC管芯结合并热耦合到IHS面板以产生携带芯片的IHS面板; 将带芯片的IHS面板安装到包括多个封装衬底的衬底面板上，以产生包括安装到衬底面板的芯片承载IHS面板的组合; 并且单独组合以产生多个微电子封装，每个封装包括：IHS面板的IHS部件，所述多个IC管芯中的一个结合并热耦合到所述IHS部件和所述多个封装基板中的一个，所述多个封装基板中的一个 IHS组件，并且所述多个IC管芯中的所述一个安装到所述多个封装衬底中的所述一个，以形成所述每个封装。

公开(公告)号：US08013439B2

公开(公告)日：2011-09-06

申请号：US12165358

申请日：2008-06-30

申请人： Sabina J. Houle

发明人： Sabina J. Houle

IPC分类号： H01L23/34

CPC分类号： H01L23/16 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/19 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/00

摘要： In some embodiments, an injection molded metal stiffener for packaging applications is presented. In this regard, an apparatus is introduced comprising a microelectronic device package substrate, a microelectronic device coupled with a top surface of the package substrate, and an injection-molded, metal stiffener coupled with the package substrate, wherein the stiffener includes a central opening and at least partially surrounds the microelectronic device. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，提供了用于包装应用的注射成型金属加强件。 在这方面，引入了包括微电子器件封装衬底，与封装衬底的顶表面耦合的微电子器件以及与封装衬底耦合的注射成型的金属加强件的装置，其中加强件包括中心开口和 至少部分地围绕微电子器件。 还公开并要求保护其他实施例。

公开(公告)号：US20100079957A1

公开(公告)日：2010-04-01

申请号：US12242060

申请日：2008-09-30

申请人： Sabina J. Houle ,  James P. Mellody

发明人： Sabina J. Houle ,  James P. Mellody

IPC分类号： H05K7/20 ,  H01L21/50

CPC分类号： H01L23/3675 ,  H01L21/50 ,  H01L23/28 ,  H01L23/3142 ,  H01L23/34 ,  H01L23/3736 ,  H01L23/42 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2224/81 ,  H01L2224/0401

摘要： A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel to yield a die-carrying IHS panel, and mounting the die-carrying IHS panel onto a substrate panel including a plurality of package substrates by mounting perimeter ribs of the IHS panel to a corresponding pattern of sealant on the substrate panel and by mounting each of the plurality of dies to a corresponding one of the plurality of package substrates to yield a combination including the die-carrying IHS panel mounted to the substrate panel. Other embodiments are also disclosed and claimed.

摘要翻译： 一种制造微电子封装的方法，以及根据该方法制造的微电子封装。 该方法包括：将多个IC管芯结合并热耦合到IHS面板以产生载流子IHS面板，以及通过将周边肋条安装在包含多个封装衬底的衬底面板上来将芯片承载IHS面板安装 IHS面板到基板面板上的相应的密封剂图案，并且通过将多个模具中的每一个安装到多个封装衬底中的对应的一个封装衬底中，以产生包括安装到衬底面板的芯片承载IHS面板的组合。 还公开并要求保护其他实施例。

公开(公告)号：US20080149692A1

公开(公告)日：2008-06-26

申请号：US11613490

申请日：2006-12-20

申请人： Harikrishnan Ramanan ,  Nitin Deshpande ,  Sabina J. Houle

发明人： Harikrishnan Ramanan ,  Nitin Deshpande ,  Sabina J. Houle

IPC分类号： B23K31/02 ,  B23K37/06

CPC分类号： B23K3/082 ,  B05B5/032 ,  B05B5/0403 ,  B05B7/0861 ,  B05B12/36 ,  B05B14/30 ,  B05B15/65 ,  B05C5/02 ,  B23K35/0244 ,  Y10T137/2931

摘要： A solder-flux composition is sprayed onto a substrate by rotating the solder-flux composition inside a spray cap, and before the solder-flux liquid exits the spray cap, perturbing the flow thereof with a fluid.

摘要翻译： 通过使焊剂组合物在喷雾帽内旋转，并且在焊剂液体离开喷雾帽之前，通过流体扰动其流动，将焊剂组合物喷涂到基底上。

公开(公告)号：US07218000B2

公开(公告)日：2007-05-15

申请号：US10607782

申请日：2003-06-27

申请人： Sabina J. Houle

发明人： Sabina J. Houle

IPC分类号： H01L23/34

CPC分类号： H01L23/3675 ,  H01L23/04 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01037 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/1433 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2224/0401

摘要： In a process of making a container barrier upon a heat spreader, the heat spreader is augmented with a cold-formed o-ring, and thereafter, it is bonded to a die. A liquid solder is filled into the space created by the o-ring. The thermal interface material can also have one of several footprints to facilitate heat transfer.

摘要翻译： 在散热器上形成容器屏障的过程中，散热器用冷成形的O形环增强，之后与模具结合。 液体焊料填充到由O形圈产生的空间中。 热界面材料还可以具有几个足迹之一以促进热传递。

公开(公告)号：US07190585B2

公开(公告)日：2007-03-13

申请号：US10613418

申请日：2003-07-03

申请人： Sabina J. Houle

发明人： Sabina J. Houle

IPC分类号： H05K7/20 ,  H01L23/34

CPC分类号： H01L23/36 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/16195 ,  H01L2224/0401

摘要： A heat spreader, comprising a metal body with attached standoffs located approximately above the integrated circuit, is described. The standoffs should improve bond layer thickness control between the integrated circuit and the heat spreader, leading to a lower cost and lower mass package, as well as a more reliable device with increased thermal performance.

摘要翻译： 描述了一种散热器，其包括具有位于集成电路大概上方的附接支座的金属体。 对接应该能够提高集成电路和散热器之间的接合层厚度控制，从而降低成本，降低质量封装，并提供更可靠的热性能提高的设备。