公开(公告)号：US07148626B2

公开(公告)日：2006-12-12

申请号：US10604588

申请日：2003-07-31

申请人： Yui-Shin Fran ,  Lai-Cheng Chen ,  Cheng-Yi Chang ,  Chien-Chung Wu ,  Jui-Hsia Chen ,  Jer-Shien Yang

发明人： Yui-Shin Fran ,  Lai-Cheng Chen ,  Cheng-Yi Chang ,  Chien-Chung Wu ,  Jui-Hsia Chen ,  Jer-Shien Yang

IPC分类号： H01J1/62

CPC分类号： H01J65/046 ,  H01J61/305

摘要： A flat lamp structure is disclosed. The flat lamp structure includes a gas discharge chamber, a fluorescence substance, a discharge gas, and a plurality of electrodes. The fluorescence substance is disposed on the inner wall of the gas discharge chamber, and the discharge gas is disposed in the gas discharge chamber. The electrodes are disposed on the outer wall of the gas discharge chamber, wherein the gas discharge chamber comprises a dielectric substrate, a plate, and a plurality of rods, and the plate is disposed on the upper portion of the dielectric substrate and the rods are disposed between the plate and the dielectric substrate, and the plate and the edge of dielectric are connected. Additionally, the gas discharge chamber, for example, can dispose with at least a spacer to enhance the strength of the gas discharge chamber.

摘要翻译： 公开了一种平板灯结构。 扁平灯结构包括气体放电室，荧光物质，放电气体和多个电极。 荧光物质设置在气体放电室的内壁上，放电气体设置在气体放电室中。 电极设置在气体放电室的外壁上，其中气体放电室包括电介质基板，板和多个杆，并且该板设置在电介质基板的上部，并且棒是 设置在板和电介质基板之间，并且板和电介质的边缘连接。 此外，气体放电室例如可以配置至少一个间隔件，以增强气体放电室的强度。

公开(公告)号：US08496047B2

公开(公告)日：2013-07-30

申请号：US12345956

申请日：2008-12-30

申请人： Cheng-Yi Chang

发明人： Cheng-Yi Chang

IPC分类号： F28F7/00 ,  F28D15/00 ,  H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28F1/32 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating apparatus includes a thermal conducting base and heat pipes connected to the thermal conducting base. Each heat pipe includes a heated section and a heat dissipating section. The portion connected to the thermal conducting base is the heated section, and the heat dissipating section is extended outward from the thermal conducting base. In the heat pipes, at least one heat dissipating section of the heat pipe is extended outward from a lateral side of the thermal conducting base, and the heat dissipating section of the heat pipe is situated at a position higher than the heated section, and fins are disposed on the heat dissipating section of the heat pipe. Therefore, the heat pipe guides the heat absorbed by thermal conducting base to a lateral side to dissipate heat from a nearby heat source.

摘要翻译： 散热装置包括导热基座和连接到导热基座的热管。 每个热管包括加热部分和散热部分。 连接到导热基座的部分是加热部分，并且散热部分从导热基底向外延伸。 在热管中，热管的至少一个散热部从导热基体的侧面向外侧延伸，热管的散热部位于比加热部高的位置，散热片 设置在热管的散热部上。 因此，热管将导热基底吸收的热量引导到侧面，以从附近的热源散发热量。

公开(公告)号：US08278562B2

公开(公告)日：2012-10-02

申请号：US11960107

申请日：2007-12-19

申请人： Chih-Kuang Yang ,  Cheng-Yi Chang

发明人： Chih-Kuang Yang ,  Cheng-Yi Chang

IPC分类号： H05K1/02

CPC分类号： H05K3/28 ,  H05K3/0058 ,  H05K3/381 ,  H05K3/4682 ,  H05K2201/0154 ,  H05K2203/016 ,  H05K2203/065 ,  H05K2203/0759 ,  H05K2203/095 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein.

摘要翻译： 公开了多层基板的多层基板和多层基板的制造方法。 通过使用载体交替地在其上形成介电层和金属结构层。 每个电介质层与相邻的电介质层粘合以将金属结构层嵌入与其对应的电介质层中。 与现有技术相比，当热压和粘附不同材料的不同层时，必须使用预浸料，本发明采用较少的工艺，因此在不使用预浸料的情况下，材料种类较少。 因此，本发明可以提高制造多层基板的整体质量和产率，以满足多层基板的机械特性匹配并降低整个制造工艺的成本。 重要的是，根据本发明的具有薄介电层的多层基板因此可以满足阻抗匹配的关注，并且可以减少串扰影响以保持良好的信号完整性。

公开(公告)号：US07939846B2

公开(公告)日：2011-05-10

申请号：US12404350

申请日：2009-03-16

申请人： Chin-Ching Chen ,  Cheng-Yi Chang ,  Ming-Kuei Lin

发明人： Chin-Ching Chen ,  Cheng-Yi Chang ,  Ming-Kuei Lin

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED is bonded to a circuit board. The circuit board comprises a chip mounting area, a bonding pad, and a connecting portion. The LED is mounted on the chip mounting area with an adhesive, and the bonding pad is connected with an electrode of the LED. Moreover, the connecting portion is positioned between the chip mounting area and the bonding pad. One side of the connecting portion is connected with the chip mounting area and another side is connected with the bonding pad. With a hollow portion of the connecting portion, the adhesive will be prevented from flowing to the bonding pad.

摘要翻译： LED连接到电路板。 电路板包括芯片安装区域，焊盘和连接部分。 LED用粘合剂安装在芯片安装区域，焊盘与LED的电极连接。 此外，连接部位于芯片安装区域和焊盘之间。 连接部的一侧与芯片安装区域连接，另一侧与接合焊盘连接。 通过连接部分的中空部分，防止粘合剂流到接合焊盘。

公开(公告)号：US20100123157A1

公开(公告)日：2010-05-20

申请号：US12404350

申请日：2009-03-16

申请人： Chin-Ching Chen ,  Cheng-Yi Chang ,  Ming-Kuei Lin

发明人： Chin-Ching Chen ,  Cheng-Yi Chang ,  Ming-Kuei Lin

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED is bonded to a circuit board. The circuit board comprises a chip mounting area, a bonding pad, and a connecting portion. The LED is mounted on the chip mounting area with an adhesive, and the bonding pad is connected with an electrode of the LED. Moreover, the connecting portion is positioned between the chip mounting area and the bonding pad. One side of the connecting portion is connected with the chip mounting area and another side is connected with the bonding pad. With a hollow portion of the connecting portion, the adhesive will be prevented from flowing to the bonding pad.

摘要翻译： LED连接到电路板。 电路板包括芯片安装区域，焊盘和连接部分。 LED用粘合剂安装在芯片安装区域，焊盘与LED的电极连接。 此外，连接部位于芯片安装区域和焊盘之间。 连接部的一侧与芯片安装区域连接，另一侧与接合焊盘连接。 通过连接部分的中空部分，防止粘合剂流到接合焊盘。

公开(公告)号：USD582359S1

公开(公告)日：2008-12-09

申请号：US29320657

申请日：2008-07-01

申请人： Cheng-Yi Chang

设计人： Cheng-Yi Chang

公开(公告)号：US08266797B2

公开(公告)日：2012-09-18

申请号：US13092319

申请日：2011-04-22

申请人： Chih-Kuang Yang ,  Cheng-Yi Chang

发明人： Chih-Kuang Yang ,  Cheng-Yi Chang

IPC分类号： H01K3/10

CPC分类号： H05K3/28 ,  H05K3/0058 ,  H05K3/381 ,  H05K3/4682 ,  H05K2201/0154 ,  H05K2203/016 ,  H05K2203/065 ,  H05K2203/0759 ,  H05K2203/095 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein.

摘要翻译： 公开了多层基板的多层基板和多层基板的制造方法。 通过使用载体交替地在其上形成介电层和金属结构层。 每个电介质层与相邻的电介质层粘合以将金属结构层嵌入与其对应的电介质层中。 与现有技术相比，当热压和粘附不同材料的不同层时，必须使用预浸料，本发明采用较少的工艺，因此在不使用预浸料的情况下，材料种类较少。 因此，本发明可以提高制造多层基板的整体质量和产率，以满足多层基板的机械特性匹配并降低整个制造工艺的成本。 重要的是，根据本发明的具有薄介电层的多层基板因此可以满足阻抗匹配的关注，并且可以减少串扰影响以保持良好的信号完整性。

公开(公告)号：US08008100B2

公开(公告)日：2011-08-30

申请号：US12398174

申请日：2009-03-04

申请人： Chih-Chia Tsai ,  Cheng-Yi Chang ,  Ming-Kuei Lin

发明人： Chih-Chia Tsai ,  Cheng-Yi Chang ,  Ming-Kuei Lin

IPC分类号： H01L21/00

CPC分类号： H01L33/483 ,  H01L23/3121 ,  H01L23/49506 ,  H01L23/49861 ,  H01L24/48 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A light emitting diode (LED) package and a manufacturing method therefore are disclosed. The LED package comprises: a transparent substrate, a transparent LED chip, a transparent adhesive for bonding the transparent LED chip, a lead frame, conductive wires, and an encapsulant. In the manufacturing method, a heating step is first performed to heat a first transparent plastic material to be a sticky member. Thereafter a connecting step is performed to connect the lead frame to the sticky member. Then a chip-bonding step is performed to bond the LED chips on the sticky member. Thereafter a wire-bonding step is performed to electrically connect the transparent LED chip to the lead frame. Then an encapsulating step is performed to encapsulate the transparent LED chips with a second transparent plastic material. Thereafter a drying step is performed to form the shapes of the sticky member and the second transparent plastic material.

摘要翻译： 因此，公开了一种发光二极管（LED）封装及其制造方法。 LED封装包括：透明基板，透明LED芯片，用于粘合透明LED芯片的透明粘合剂，引线框架，导电线和密封剂。 在制造方法中，首先进行加热工序，以加热作为粘性部件的第一透明塑料材料。 此后，执行连接步骤以将引线框架连接到粘性部件。 然后进行芯片接合步骤以将LED芯片粘合在粘性构件上。 然后，进行引线键合步骤以将透明LED芯片电连接到引线框架。 然后执行封装步骤以用第二透明塑料材料封装透明LED芯片。 此后，进行干燥步骤以形成粘性构件和第二透明塑料材料的形状。

公开(公告)号：US20090224280A1

公开(公告)日：2009-09-10

申请号：US12398174

申请日：2009-03-04

申请人： Chih-Chia Tsai ,  Cheng-Yi Chang ,  Ming-Kuei Lin

发明人： Chih-Chia Tsai ,  Cheng-Yi Chang ,  Ming-Kuei Lin

IPC分类号： H01L33/00 ,  H01L21/56

CPC分类号： H01L33/483 ,  H01L23/3121 ,  H01L23/49506 ,  H01L23/49861 ,  H01L24/48 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A light emitting diode (LED) package and a manufacturing method therefore are disclosed. The LED package comprises: a transparent substrate, a transparent LED chip, a transparent adhesive for bonding the transparent LED chip, a lead frame, conductive wires, and an encapsulant. In the manufacturing method, a heating step is first performed to heat a first transparent plastic material to be a sticky member. Thereafter a connecting step is performed to connect the lead frame to the sticky member. Then a chip-bounding step is performed to bond the LED chips on the sticky member. Thereafter a wire-bonding step is performed to electrically connect the transparent LED chip to the lead frame. Then an encapsulating step is performed to encapsulate the transparent LED chips with a second transparent plastic material. Thereafter a drying step is performed to form the shapes of the sticky member and the second transparent plastic material.

摘要翻译： 因此，公开了一种发光二极管（LED）封装及其制造方法。 LED封装包括：透明基板，透明LED芯片，用于粘合透明LED芯片的透明粘合剂，引线框架，导电线和密封剂。 在制造方法中，首先进行加热工序，以加热作为粘性部件的第一透明塑料材料。 此后，执行连接步骤以将引线框架连接到粘性部件。 然后执行芯片边界步骤以将LED芯片粘合在粘性构件上。 然后，进行引线键合步骤以将透明LED芯片电连接到引线框架。 然后执行封装步骤以用第二透明塑料材料封装透明LED芯片。 此后，进行干燥步骤以形成粘性构件和第二透明塑料材料的形状。

公开(公告)号：US20090151899A1

公开(公告)日：2009-06-18

申请号：US12000689

申请日：2007-12-17

申请人： Cheng-Yi Chang

发明人： Cheng-Yi Chang

IPC分类号： F28F7/00

CPC分类号： F28D15/0275 ,  H01L21/4882 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling apparatus includes a base, a plurality of first heat pipes, a plurality of second heat pipes, a plurality of first heat conducting columns and a plurality of second heat conducting columns. Each of the first heat pipes and the second heat pipes respectively has a heat-absorbing terminal. The heat-absorbing terminals of the first heat pipes are disposed on the base spaced at intervals. The heat-absorbing terminals of the second heat pipes are stacked above the heat-absorbing terminals of the first heat pipes spaced at intervals. Each of the first heat conducting columns is installed between the heat-absorbing terminals of the two adjacent first heat pipes. Each of the second heat conducting columns is installed between the heat-absorbing terminals of the two adjacent second heat pipes. Thereby, the heat conducting area is increased within the base, and the cooling efficiency of the cooling apparatus is enhanced.

摘要翻译： 冷却装置包括基座，多个第一热管，多个第二热管，多个第一导热柱和多个第二导热柱。 第一热管和第二热管中的每一个分别具有吸热端子。 第一热管的吸热端子间隔设置在基座上。 第二热管的吸热端子间隔开地堆叠在第一热管的吸热端子的上方。 每个第一导热柱安装在两个相邻的第一热管的吸热端子之间。 每个第二导热柱安装在两个相邻的第二热管的吸热端子之间。 由此，在基座内增加导热面积，提高冷却装置的冷却效率。