摘要:
A fan rotation speed control circuit comprises an AC power source, a coil electrically connected with the AC power source, a sensing module having a first resistor and a sensing device in parallel connection with mentioned first resistor, a capacitor, a DIAC, and a TRIAC having a first terminal, a second terminal and a gate terminal, wherein mentioned coil electrically connected with the first resistor and the sensing device, mentioned capacitor electrically connected with the first resistor and the sensing device, mentioned DIAC electrically connected with the first resistor, the sensing device and the capacitor, mentioned first terminal electrically connected with the first resistor, the sensing device and the coil, mentioned second terminal electrically connected with the capacitor and the AC power source, and mentioned gate terminal electrically connected with the DIAC.
摘要:
A fan motor speed control circuit and a voltage-regulating module thereof are disclosed. The fan motor speed control circuit includes the voltage-regulating module and a driving module electrically connected to the voltage-regulating module. The driving module includes a pulse signal generating unit, a speed control unit, and a drive unit. The speed control unit compares a high frequency pulse signal generated by the pulse signal generating unit with a variable reference voltage signal output by the voltage-regulating module, and then outputs a control signal to the drive unit to proceed the speed control of the fan motor. In application, the voltage-regulating module and the driving module are electrically connected to a voltage source in parallel.
摘要:
An apparatus and a method for off-line pre-conditioning a conditioning disc that is used in a chemical mechanical polishing process are provided. In the apparatus, an upper platform for mounting a conditioning disc thereto and a lower platform for mounting a polishing pad thereto are engaged together under a pre-set pressure and rotated in opposite directions for a pre-set length of time. The apparatus is effective in removing loose particles from the surface of the conditioning disc such that the possibility of any such particles causing scratches on a wafer surface during a subsequently conducted chemical mechanical polishing process is eliminated. The present invention novel apparatus can be used off-line for pre-conditioning a conditioning disc such that valuable machine time of a chemical mechanical polishing apparatus is not wasted.
摘要:
A method for cleaning or recycling a polishing pad conditioning disk used in a chemical mechanical polishing apparatus is disclosed. In the method, a conditioning disk that has a top surface formed of diamond particles and covered by a layer of polishing debris such as silicon oxide is first provided. A water jet that has a pressure of at least 1,500 psi, or preferably, 3,000 psi is directed toward the top surface of the conditioning disk for at least 5 min., and preferably, for at least 10 min. to substantially remove the polishing debris. The conditioning disk is then positioned on a heated surface and heated to a temperature of at least 40° C. while simultaneously being blown by a flow of inert gas or CO2 maintained at 0° C. or below on the top surface to remove any residual polishing debris by causing a thermal shock in the silicon oxide films and a separation from the conditioning disk.
摘要:
A chemical mechanical polishing (CMP) device for processing a wafer is provided which includes a plate for supporting the wafer to be processed in a face-up orientation, a polishing head opposing the plate, wherein the polishing head includes a rotatable polishing pad operable to contact the wafer while the polishing pad is rotating, and a slurry coating system providing a slurry to the polishing pad for polishing the wafer.
摘要:
A rapid cooling system for a rapid thermal processing chamber includes a rapid thermal processing chamber having a wafer support for supporting a wafer. A tank having a supply of cooling liquid is provided in fluid communication with the chamber. A pump is provided in fluid communication with the rapid thermal processing chamber and the tank for pumping the cooling liquid from the tank to the chamber and cooling the wafer during the cooling phase of rapid thermal processing.
摘要:
A driving apparatus for fan motors, electrically connected between a pulse width modulation (PWM) signal generator and a controller, includes a converter electrically connected to the PWM signal generator, generating a first reference voltage according to the duty cycle of a PWM signal generated by the PWM signal generator; a reference voltage generator electrically connected to an external power source, generating a second reference voltage according to the external power source; and a comparator having a first and second input terminal and an output terminal; wherein the first input terminal is electrically connected to the converter, the second input terminal is connected to the reference voltage generator and the output terminal is connected to the controller, and when the first reference voltage is greater than the second reference voltage, a driving signal is output from the output terminal to the controller to control the rotation speed of the fan motor.
摘要:
A circuit board adapted to a fan comprises a circuit region and a heat-dissipative film. The circuit region is provided on a first surface of the circuit board and comprises at least one heat-generating component thereon. The heat-dissipative film is coated on an edge portion of the first surface and is in contact with the heat-generating component. A plurality of openings through the heat-dissipative film, a protrusion of the circuit board, a cutout in the protrusion to expose the heat-generating component to airflow, etc., have been disclosed and claimed for enhancing the efficiency in heat dissipation. A heat sink may also be provided on a second surface opposite to the first surface of the circuit board. The heat sink is connected to the heat-dissipative film to help dissipate the heat generated by the operation of the fan.
摘要:
A thermoelectric wafer chuck is disclosed. The thermoelectric wafer chuck includes a wafer support surface for supporting a wafer; and a thermoelectric module provided in thermal contact with the wafer support surface for heating and/or cooling the wafer support surface and wafer.