公开(公告)号：US20100285723A1

公开(公告)日：2010-11-11

申请号：US12437315

申请日：2009-05-07

申请人： Yu-Liang Lin ,  Chien Ling Hwang ,  Jean Wang ,  Chen-Hua Yu

发明人： Yu-Liang Lin ,  Chien Ling Hwang ,  Jean Wang ,  Chen-Hua Yu

IPC分类号： B24B49/16 ,  B24B7/22 ,  B24B49/08 ,  B24B53/02 ,  B24B57/02

CPC分类号： B24B57/02 ,  B24B37/107 ,  B24B53/017 ,  H01L21/02052

摘要： A chemical mechanical polishing (CMP) device for processing a wafer is provided which includes a plate for supporting the wafer to be processed in a face-up orientation, a polishing head opposing the plate, wherein the polishing head includes a rotatable polishing pad operable to contact the wafer while the polishing pad is rotating, and a slurry coating system providing a slurry to the polishing pad for polishing the wafer.

摘要翻译： 提供了一种用于处理晶片的化学机械抛光（CMP）装置，其包括用于以面朝上的方向支撑待加工的晶片的板，与该板相对的抛光头，其中抛光头包括可旋转的抛光垫， 在抛光垫旋转的同时接触晶片;以及浆料涂覆系统，其向抛光垫提供浆料以抛光晶片。

公开(公告)号：US08133097B2

公开(公告)日：2012-03-13

申请号：US12437315

申请日：2009-05-07

申请人： Yu-Liang Lin ,  Chien Ling Hwang ,  Jean Wang ,  Chen-Hua Yu

发明人： Yu-Liang Lin ,  Chien Ling Hwang ,  Jean Wang ,  Chen-Hua Yu

IPC分类号： B24B7/22 ,  B24B57/02

CPC分类号： B24B57/02 ,  B24B37/107 ,  B24B53/017 ,  H01L21/02052

摘要： A chemical mechanical polishing (CMP) device for processing a wafer is provided which includes a plate for supporting the wafer to be processed in a face-up orientation, a polishing head opposing the plate, wherein the polishing head includes a rotatable polishing pad operable to contact the wafer while the polishing pad is rotating, and a slurry coating system providing a slurry to the polishing pad for polishing the wafer.

摘要翻译： 提供了一种用于处理晶片的化学机械抛光（CMP）装置，其包括用于以面朝上的方向支撑待加工的晶片的板，与该板相对的抛光头，其中抛光头包括可旋转的抛光垫， 在抛光垫旋转的同时接触晶片;以及浆料涂覆系统，其向抛光垫提供浆料以抛光晶片。

公开(公告)号：US20070032180A1

公开(公告)日：2007-02-08

申请号：US11199607

申请日：2005-08-08

申请人： Chien Hwang ,  Yu-Liang Lin ,  Chia-Ming Yang ,  Cheng Chan ,  Jean Wang ,  Chen-Hua Yu

发明人： Chien Hwang ,  Yu-Liang Lin ,  Chia-Ming Yang ,  Cheng Chan ,  Jean Wang ,  Chen-Hua Yu

IPC分类号： B24B29/00

CPC分类号： B24B57/02 ,  B24B37/04

摘要： A slurry residence time enhancement system for a chemical mechanical polishing apparatus having a base, a platen on the base, a polishing pad on the platen and a polishing head over the polishing pad is disclosed. The system includes at least one slurry distribution unit having a slurry distribution member for positioning on the polishing pad. In operation of the CMP apparatus, the slurry distribution member redirects polishing slurry on the polishing pad to the polishing head. The system may alternatively or additionally include a rim for upward extension from the base and a seal for insertion between the platen and the polishing pad adjacent to the rim.

摘要翻译： 公开了一种用于化学机械抛光设备的浆料停留时间增强系统，其具有底座，底座上的压板，压板上的抛光垫和抛光垫上的抛光头。 该系统包括至少一个浆料分配单元，其具有用于定位在抛光垫上的浆料分配构件。 在CMP装置的操作中，浆料分配构件将抛光垫上的抛光浆料重新定向到抛光头。 系统可以可选地或另外地包括用于从基座向上延伸的边缘和用于插入在压板和与边缘相邻的抛光垫之间的密封件。

公开(公告)号：US07905109B2

公开(公告)日：2011-03-15

申请号：US11226721

申请日：2005-09-14

申请人： Chien Ling Hwang ,  Yu-Liang Lin ,  Fu-Kang Tien ,  Jyh-Chemg Sheu

发明人： Chien Ling Hwang ,  Yu-Liang Lin ,  Fu-Kang Tien ,  Jyh-Chemg Sheu

IPC分类号： F25D17/02

CPC分类号： H01L21/67109

摘要： A rapid cooling system for a rapid thermal processing chamber includes a rapid thermal processing chamber having a wafer support for supporting a wafer. A tank having a supply of cooling liquid is provided in fluid communication with the chamber. A pump is provided in fluid communication with the rapid thermal processing chamber and the tank for pumping the cooling liquid from the tank to the chamber and cooling the wafer during the cooling phase of rapid thermal processing.

摘要翻译： 用于快速热处理室的快速冷却系统包括具有用于支撑晶片的晶片支撑件的快速热处理室。 提供具有冷却液供应的罐与腔室流体连通。 提供与快速热处理室和储罐流体连通的泵，用于将冷却液体从罐中泵送到室，并在快速热处理的冷却阶段期间冷却晶片。

公开(公告)号：US09390949B2

公开(公告)日：2016-07-12

申请号：US13306625

申请日：2011-11-29

申请人： Wen-Chih Chiou ,  Yu-Liang Lin ,  Hung-Jung Tu

发明人： Wen-Chih Chiou ,  Yu-Liang Lin ,  Hung-Jung Tu

IPC分类号： H01L21/02 ,  H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67173 ,  H01L21/02057 ,  H01L21/67207

摘要： This description relates to a wafer debonding and cleaning apparatus including an automatic wafer handling module. The automatic wafer handling module loads a semiconductor wafer into a wafer debonding module for a debonding process. The automatic wafer handling module removes the semiconductor wafer from the debonding module and loads the semiconductor wafer into a wafer cleaning module for a cleaning process.

摘要翻译： 本说明书涉及包括自动晶片处理模块的晶片剥离和清洁设备。 自动晶片处理模块将半导体晶片加载到用于脱粘工艺的晶片剥离模块中。 自动晶片处理模块从剥离模块中移除半导体晶片，并将半导体晶片装载到用于清洁过程的晶片清洁模块中。

公开(公告)号：US09153462B2

公开(公告)日：2015-10-06

申请号：US12964097

申请日：2010-12-09

申请人： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou

发明人： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou

IPC分类号： H01L21/687 ,  H01L21/67

CPC分类号： H01L21/67051 ,  H01L21/68728

摘要： A device and system for thin wafer cleaning is disclosed. A preferred embodiment comprises a spin chuck having at least three holding clamps. A thin wafer with a wafer frame is mounted on the spin chuck through a tape layer. When the holding clamps are unlocked, there is no interference with the removal and placement of the wafer frame. On the other hand, when the holding clamps are locked, the holding clamps are brought into contact with the outer edge of the wafer frame so as to prevent the wafer frame from moving laterally. Furthermore, the shape of the holding clamps in a locked position is capable of preventing the wafer frame from moving vertically.

摘要翻译： 公开了用于薄晶片清洁的装置和系统。 优选实施例包括具有至少三个保持夹具的旋转卡盘。 具有晶片框架的薄晶片通过带层安装在旋转卡盘上。 当保持夹具解锁时，不会干扰晶片框架的移除和放置。 另一方面，当保持夹具被锁定时，保持夹具与晶片框架的外边缘接触，以防止晶片框架横向移动。 此外，保持夹具处于锁定位置的形状能够防止晶片框架垂直移动。

公开(公告)号：US08722540B2

公开(公告)日：2014-05-13

申请号：US12841874

申请日：2010-07-22

申请人： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin

发明人： Yu-Liang Lin ,  Weng-Jin Wu ,  Jing-Cheng Lin

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834

摘要： A method includes bonding a wafer on a carrier through an adhesive, and performing a thinning process on the wafer. After the step of performing the thinning process, a portion of the adhesive not covered by the wafer is removed, while the portion of the adhesive covered by the wafer is not removed.

摘要翻译： 一种方法包括通过粘合剂将晶片接合在载体上，并在晶片上进行稀化处理。 在进行稀化处理的步骤之后，去除未被晶片覆盖的粘合剂的一部分，同时由晶片覆盖的粘合剂部分未被除去。

公开(公告)号：US08278857B2

公开(公告)日：2012-10-02

申请号：US12578835

申请日：2009-10-14

申请人： Yu-Liang Lin ,  Ming-Yen Lin ,  Chia-Wen Kuo ,  Kuan-Ting Lee

发明人： Yu-Liang Lin ,  Ming-Yen Lin ,  Chia-Wen Kuo ,  Kuan-Ting Lee

IPC分类号： H02P6/14

CPC分类号： H02P6/14

摘要： A motor control device is electrically connected with a motor. The motor control device includes a controller and a driving circuit. The controller has a default value of time and generates a first driving signal and a second driving signal. The driving circuit includes a first switching element and a second switching element, the first switching element and the second switching element receive the first driving signal and the second driving signal respectively, and the first switching element and the second switching element are switched on or switched off alternately according to the first driving signal and the second driving signal respectively, so as to drive the motor to operate. The controller switches off the first switching element by the first driving signal the default value of time before the controller switches on the second switching element by the second driving signal, and the controller switches off the second switching element by the second driving signal the default value of time before the controller switches on the first switching element by the first driving signal.

摘要翻译： 电动机控制装置与电动机电连接。 电动机控制装置包括控制器和驱动电路。 控制器具有默认的时间值，并且产生第一驱动信号和第二驱动信号。 驱动电路包括第一开关元件和第二开关元件，第一开关元件和第二开关元件分别接收第一驱动信号和第二驱动信号，并且第一开关元件和第二开关元件被接通或切换 分别根据第一驱动信号和第二驱动信号交替地切断，以驱动马达运行。 控制器通过第一驱动信号将第一开关元件切断为控制器通过第二驱动信号接通第二开关元件之前的默认值，并且控制器通过第二驱动信号将第二开关元件断开，该默认值 在控制器通过第一驱动信号接通第一开关元件之前的时间。

公开(公告)号：US20120194123A1

公开(公告)日：2012-08-02

申请号：US13332572

申请日：2011-12-21

申请人： Yu-Liang Lin ,  Chun-Hsueh Lee

发明人： Yu-Liang Lin ,  Chun-Hsueh Lee

IPC分类号： H02P23/08

CPC分类号： F04D27/004

摘要： A fan rotation speed control circuit comprises an AC power source, a coil electrically connected with the AC power source, a sensing module having a first resistor and a sensing device in parallel connection with mentioned first resistor, a capacitor, a DIAC, and a TRIAC having a first terminal, a second terminal and a gate terminal, wherein mentioned coil electrically connected with the first resistor and the sensing device, mentioned capacitor electrically connected with the first resistor and the sensing device, mentioned DIAC electrically connected with the first resistor, the sensing device and the capacitor, mentioned first terminal electrically connected with the first resistor, the sensing device and the coil, mentioned second terminal electrically connected with the capacitor and the AC power source, and mentioned gate terminal electrically connected with the DIAC.

摘要翻译： 风扇转速控制电路包括AC电源，与AC电源电连接的线圈，具有第一电阻器和与所述第一电阻器并联连接的感测装置的感测模块，电容器，DIAC和TRIAC 具有第一端子，第二端子和栅极端子，其中所述线圈与第一电阻器和感测装置电连接，所述电容器与第一电阻器和感测装置电连接，提及与第一电阻器电连接的DIAC， 所述第一端子与第一电阻器，感测装置和线圈电连接，所述第二端子与电容器和AC电源电连接，并且所述栅极端子与DIAC电连接。

公开(公告)号：US20060043950A1

公开(公告)日：2006-03-02

申请号：US11111807

申请日：2005-04-22

申请人： Yu-Liang Lin ,  Yu-Lung Dung ,  Yueh-Lung Huang ,  Ming-Shi Tsai

发明人： Yu-Liang Lin ,  Yu-Lung Dung ,  Yueh-Lung Huang ,  Ming-Shi Tsai

IPC分类号： G05F1/40

CPC分类号： H02P7/29 ,  G06F1/206 ,  H02M2001/0025 ,  Y02D10/16

摘要： A fan motor speed control circuit and a voltage-regulating module thereof are disclosed. The fan motor speed control circuit includes the voltage-regulating module and a driving module electrically connected to the voltage-regulating module. The driving module includes a pulse signal generating unit, a speed control unit, and a drive unit. The speed control unit compares a high frequency pulse signal generated by the pulse signal generating unit with a variable reference voltage signal output by the voltage-regulating module, and then outputs a control signal to the drive unit to proceed the speed control of the fan motor. In application, the voltage-regulating module and the driving module are electrically connected to a voltage source in parallel.

摘要翻译： 公开了一种风扇电动机速度控制电路及其电压调节模块。 风扇电动机速度控制电路包括电压调节模块和电连接到电压调节模块的驱动模块。 驱动模块包括脉冲信号发生单元，速度控制单元和驱动单元。 速度控制单元将由脉冲信号生成单元生成的高频脉冲信号与由电压调节模块输出的可变参考电压信号进行比较，然后向驱动单元输出控制信号，以进行风扇电动机的速度控制 。 在应用中，电压调节模块和驱动模块并联电连接到电压源。