公开(公告)号：US10510576B2

公开(公告)日：2019-12-17

申请号：US14511411

申请日：2014-10-10

Applicant: Corning Incorporated

Inventor： Darwin Gene Enicks ,  John Tyler Keech ,  Aric Bruce Shorey ,  Windsor Pipes Thomas, III

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/15 ,  H01L21/683 ,  H01L23/498

Abstract: A thin sheet (20) disposed on a carrier (10) via a surface modification layer (30) to form an article (2), wherein the article may be subjected to high temperature processing, as in FEOL semiconductor processing, not outgas and have the thin sheet maintained on the carrier without separation therefrom during the processing, yet be separated therefrom upon room temperature peeling force that leaves the thinner one of the thin sheet and carrier intact. Interposers (56) having arrays (50) of vias (60) may be formed on the thin sheet, and devices (66) formed on the interposers. Alternatively, the thin sheet may be a substrate on which semiconductor circuits are formed during FEOL processing.

公开(公告)号：US20170341975A1

公开(公告)日：2017-11-30

申请号：US15603150

申请日：2017-05-23

Applicant: Corning Incorporated

Inventor： Timothy Michael Gross ,  John Tyler Keech ,  Jeffrey Glenn Lynn ,  Jinlin Peng

IPC: C03C10/00 ,  C12N15/10 ,  C07K1/14 ,  G01N33/50 ,  A61K47/02

CPC classification number: C03C10/0054 ,  A61K47/02 ,  C03C10/0081 ,  C03C2214/20 ,  C03C2214/30 ,  C07K1/14 ,  C12N15/1006 ,  G01N33/5091 ,  H01F1/37

Abstract: A magnetizable glass ceramic composition including: a continuous first glass phase including SiO2, B2O3, P2O5, and R2O; a discontinuous second glass phase including at least one of SiO2, B2O3, P2O5, R2O, or mixtures thereof; and a discrete magnetizable crystalline phase dispersed in the discontinuous second glass phase, where R2O is selected from at least one of K2O, Li2O, Na2O, or mixtures thereof. Also disclosed are a method of making and a method of using the magnetizable glass ceramic composition.

公开(公告)号：US20170335466A1

公开(公告)日：2017-11-23

申请号：US15672599

申请日：2017-08-09

Applicant: CORNING INCORPORATED

Inventor： Jeffrey John Domey ,  John Tyler Keech ,  Xinghua Li ,  Garrett Andrew Piech ,  Arie Bruce Shorey ,  Paul John Shustack ,  John Christopher Thomas

IPC: C23F4/04 ,  C03B33/10 ,  C03B33/02 ,  B23K26/386 ,  B23K26/18 ,  B23K26/0622 ,  B23K26/382 ,  H05K3/00 ,  B23K26/40 ,  B23K103/00

CPC classification number: C23F4/04 ,  B23K26/0622 ,  B23K26/18 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/54 ,  C03B33/0222 ,  C03B33/102 ,  H05K3/0026 ,  Y10T428/24322

Abstract: A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

公开(公告)号：US20160035587A1

公开(公告)日：2016-02-04

申请号：US14810967

申请日：2015-07-28

Applicant: CORNING INCORPORATED

Inventor： John Tyler Keech ,  Stephen Kuo-Rui Liu

IPC: H01L21/48 ,  C03C15/00

CPC classification number: H01L21/4803 ,  B06B1/02 ,  C03C15/00 ,  H01L21/67086 ,  H05K3/002 ,  H05K2203/0285

Abstract: In some embodiments, an ultrasonic tank includes a container, an etching solution tank comprising a working area disposed within the container, and a plurality of ultrasonic transducers arranged about a perimeter of the etching solution tank in a configuration that provides a standard deviation of ultrasonic power within the working area of less than about 0.35.

Abstract translation: 在一些实施例中，超声波箱包括容器，包括设置在容器内的工作区域的蚀刻溶液罐以及提供超声波功率的标准偏差的构造的围绕蚀刻溶液罐的周边布置的多个超声换能器 在工作区内小于0.35左右。

公开(公告)号：US20140147623A1

公开(公告)日：2014-05-29

申请号：US14092536

申请日：2013-11-27

Applicant: CORNING INCORPORATED

Inventor： Aric Bruce Shorey ,  Garrett Andrew Piech ,  Xinghua Li ,  John Christopher Thomas ,  John Tyler Keech ,  Jeffrey John Domey ,  Paul John Shustack

IPC: B23K26/38 ,  C23F4/04

CPC classification number: C23F4/04 ,  B23K26/0622 ,  B23K26/18 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/50 ,  B23K2103/54 ,  C03B33/0222 ,  C03B33/102 ,  H05K3/0026 ,  Y10T428/24322

Abstract: A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

Abstract translation: 一种用于通过钻孔在基板中形成多个精密孔的方法，包括将牺牲覆盖层固定到基板的表面，将激光束相对于基板定位在预定位置，并且对应于 多个精密孔，通过在预定位置重复地激励激光束在牺牲覆盖层中形成通孔，并将激光束脉冲到形成在牺牲覆盖层中的通孔中。 一种具有精密孔的工件，包括其中形成有精密孔的基板，其中每个精密孔的纵轴在基板的厚度方向上延伸，并且牺牲盖层可拆卸地固定到基板的表面，使得 牺牲覆盖层减少精密孔的不规则性。