公开(公告)号：US6053688A

公开(公告)日：2000-04-25

申请号：US920210

申请日：1997-08-25

Applicant: David Cheng

Inventor： David Cheng

IPC: B65G49/07 ,  H01L21/677

CPC classification number: H01L21/67772 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/141 ,  Y10T29/53022

Abstract: A wafer handling apparatus and method includes a wafer carrier station for supporting a wafer carrier, such as an enclosed pod, that holds one or more wafers. A grounded interface panel is provided between the carrier station and a clean testing or processing environment. A z-movement mechanism moves the carrier station and the wafer carrier in a z-direction. A door opening mechanism removes a door from said carrier through a door opening in the interface panel. A handler mechanism includes a wafer holding device, such as a flat end effector, that moves into the wafer carrier at a separate access opening to load or unload a wafer to or from the wafer carrier. Wafer carriers holding different amounts of wafers can be used with no major structural changes to the apparatus.

Abstract translation: 晶片处理装置和方法包括用于支撑保持一个或多个晶片的晶片载体（例如封闭的盒）的晶片载体台。 在承载站和干净的测试或处理环境之间提供接地接口面板。 z移动机构使载体台和晶片载体沿z方向移动。 门打开机构通过接口面板中的门开口从所述托架移除门。 处理机构包括诸如扁平末端执行器的晶片保持装置，其在单独的进入开口处移动到晶片载体中，以将晶片加载或从晶片载体卸载晶片。 可以使用保持不同数量的晶片的晶片载体，而不会对装置造成重大的结构变化。

公开(公告)号：US5546179A

公开(公告)日：1996-08-13

申请号：US319531

申请日：1994-10-07

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B11/255 ,  G01B11/30 ,  G01B11/24

CPC classification number: G01B11/255 ,  G01B11/306

Abstract: A method and apparatus for mapping the edge and other characteristics of a wafer. A method for mapping the edge of a wafer includes steps of providing a sensor device over a surface of a wafer on a testing chuck. A beam of electromagnetic energy emitted by the sensor device is reflected from the surface of the wafer and its intensity is measured by the sensor device. The sensor device is focussed and is then positioned at the edge of the wafer by measuring the intensity of the reflected beam as the sensor device is moved. A changed intensity signifies that the sensor device is located at the edge of the wafer. The wafer is incrementally rotated and the intensity of the reflected beam is measured at multiple locations on the edge of the wafer to provide datapoints used in the edge mapping. The height of the wafer is mapped by moving the sensor device in a z direction perpendicular to the surface of the wafer. A focal distance is found where the reflected beam is at a maximum intensity. Multiple focal distances taken from different locations on the wafer are compared to map the height of the wafer. The reflectivity of the wafer is also detected at the focal distance.

Abstract translation: 用于映射晶片的边缘和其它特性的方法和装置。 用于映射晶片边缘的方法包括在测试卡盘上的晶片表面上提供传感器装置的步骤。 由传感器装置发射的电磁能束从晶片的表面反射，其强度由传感器装置测量。 传感器装置被聚焦，然后通过在传感器装置移动时测量反射光束的强度来定位在晶片的边缘。 改变的强度表示传感器装置位于晶片的边缘。 晶片被递增地旋转，并且在晶片边缘上的多个位置处测量反射光束的强度，以提供在边缘映射中使用的数据点。 通过在垂直于晶片表面的z方向移动传感器装置来映射晶片的高度。 发现焦距在反射光束处于最大强度。 将取自晶片上不同位置的多个焦距进行比较，以绘制晶片的高度。 在焦距处也检测到晶片的反射率。

公开(公告)号：US5479108A

公开(公告)日：1995-12-26

申请号：US981801

申请日：1992-11-25

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B7/06 ,  G01R31/26 ,  H01L21/68 ,  H01L21/683 ,  G01R1/04

CPC classification number: G01R31/2648 ,  G01B7/06 ,  H01L21/681 ,  H01L21/6838 ,  Y10S414/137 ,  Y10S414/141

Abstract: A method and apparatus for handling wafers. A wafer pick moves along a horizontal x-axis to unload a wafer from a cassette and position the wafer over a chuck. The chuck moves upwardly along a z-axis perpendicular to the surface of the wafer and lifts the wafer off the pick. The pick retracts through a slot in the chuck and a test probe moves along the x-axis to position itself over the wafer and chuck with reference to a calculated wafer center. The chuck then moves upwardly to engage the surface of the wafer with the probe. Wafer characteristics are tested at several test points located on a circle on the surface of the wafer by repeatedly lowering the chuck, rotating the chuck by a small amount, and raising the chuck to engage the wafer with the probe. The probe is then positioned to test another circle of points.

Abstract translation: 一种处理晶片的方法和装置。 晶片拾取器沿水平x轴移动以从盒子卸载晶片并将晶片定位在卡盘上。 卡盘沿垂直于晶片表面的z轴向上移动，并将晶片从拾取器上提起。 拾取器通过卡盘中的槽缩回，并且测试探针沿x轴移动，以参考计算的晶片中心自身位于晶片和卡盘上。 然后，卡盘向上移动以与探针接合晶片的表面。 通过重复地降低卡盘，使卡盘旋转少量，并且提升卡盘以使晶片与探针接合，在晶圆表面上圆的几个测试点上测试晶片特性。 然后定位探针以测试另一个圆圈。

公开(公告)号：US5452078A

公开(公告)日：1995-09-19

申请号：US78416

申请日：1993-06-17

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B11/27 ,  H01L21/677 ,  H01L21/68 ,  G01N21/86 ,  G01B11/00

CPC classification number: G01B11/272 ,  H01L21/67793 ,  H01L21/681

Abstract: A method and apparatus for finding wafer index marks and centers. A wafer having a flat or notch along its edge is placed on a rotatable platform so that a portion of the wafer's edge is positioned within a sensor assembly. The wafer is rotated, and the sensor reads the distance from the center of rotation to the edge of the wafer. This distance is measured at several angles of the wafer and the data is stored in a digital computer as a series of datapoints including an angle and a distance. A computer-implemented process calculates various geometries concerning the wafer including the location of the index mark and the center of the wafer.

Abstract translation: 一种用于寻找晶片索引标记和中心的方法和装置。 沿其边缘具有平坦或凹口的晶片被放置在可旋转的平台上，使得晶片的边缘的一部分定位在传感器组件内。 晶片旋转，传感器读取从旋转中心到晶片边缘的距离。 该距离在晶片的几个角度测量，数据作为包括角度和距离的一系列数据点存储在数字计算机中。 计算机实现的过程计算关于晶片的各种几何，包括索引标记的位置和晶片的中心。

公开(公告)号：US5280983A

公开(公告)日：1994-01-25

申请号：US963006

申请日：1992-10-19

Applicant: Dan Maydan ,  Sasson R. Somekh ,  Charles Ryan-Harris ,  Richard A. Seilheimer ,  David Cheng ,  Edward M. Abolnikov ,  Lance S. Reinke ,  J. Christopher Moran ,  Richard M. Catlin, Jr. ,  Robert B. Lowrance ,  Gregory W. Ridgeway

Inventor： Dan Maydan ,  Sasson R. Somekh ,  Charles Ryan-Harris ,  Richard A. Seilheimer ,  David Cheng ,  Edward M. Abolnikov ,  Lance S. Reinke ,  J. Christopher Moran ,  Richard M. Catlin, Jr. ,  Robert B. Lowrance ,  Gregory W. Ridgeway

IPC: H01L21/67 ,  H02H9/00 ,  H05K13/02 ,  B66C1/42

CPC classification number: H05K13/021 ,  H01L21/67 ,  H02H9/005 ,  Y10S294/902

Abstract: A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.

Abstract translation: 晶片处理系统包括安装在负载锁中的自动装载机，用于在半导体处理室和装载锁之间的卸载位置之间提供批处理，盒到盒自动晶片传送。 该系统提供快速，无污染的半导体晶片装载和卸载。

公开(公告)号：US5270560A

公开(公告)日：1993-12-14

申请号：US876576

申请日：1992-04-30

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B11/16 ,  G01B11/255 ,  G01B11/30 ,  H01L21/00 ,  G01V9/04

CPC classification number: H01L21/67288 ,  G01B11/16 ,  G01B11/255 ,  G01B11/306

Abstract: A method for measuring surface topography characterized by making multiple scans of the surface with a laser scanning unit and utilizing the multiple scans to create representations of the surface's topography. The surface topography data can also be used to calculate the compressive or tensile stress caused by a thin film applied to the surface of a semiconductor wafer. The apparatus of the present invention scans a laser beam across a surface in an x direction, and detects displacements of a reflected portion of the laser beam in a z direction. A pair of photodetectors are used to translate z direction displacements of the reflected beam into analog signals which are digitized and input into a microcomputer for analysis. The multiple scans of the surface are preferably accomplished by placing the workpiece on a pedestal which can be rotated to various angular positions.

Abstract translation: 一种用于测量表面形貌的方法，其特征在于用激光扫描单元对表面进行多次扫描，并利用多次扫描来创建表面的地形图。 表面形貌数据也可用于计算由施加到半导体晶片表面的薄膜引起的压缩或拉伸应力。 本发明的装置沿x方向扫描激光束的表面，并且检测激光束在z方向上的反射部分的位移。 一对光电探测器用于将反射光束的z方向位移转换为模拟信号，并将其数字化并输入微型计算机进行分析。 表面的多次扫描优选通过将工件放置在可旋转到各种角度位置的基座上来实现。

公开(公告)号：US5233201A

公开(公告)日：1993-08-03

申请号：US822910

申请日：1992-01-21

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B11/16 ,  G01B11/255 ,  G01B11/30 ,  H01L21/00

CPC classification number: H01L21/67288 ,  G01B11/16 ,  G01B11/255 ,  G01B11/306

Abstract: A system for measuring topological features, such curvatures and profiles, of surfaces such as semiconductor wafer surfaces. The system includes a) laser means and lens means for directing a beam of weakly-convergent light for incidence on a surface which is to be measured, b) photodetector means for detecting the position of the laser light beam reflected from the surface, c) first translation means for providing relative movement between the laser means and the surface in a direction which is normal to the direction of the incident beam, so that the incident beam is caused to scan across the surface, e) position sensing means connected to the photodetector means for detecting the location on the photodetector means at which the reflected beam is incident.

Abstract translation: 用于测量诸如半导体晶片表面的表面的拓扑特征，诸如曲率和轮廓的系统。 该系统包括：a）激光装置和透镜装置，用于引导一束弱聚光用于入射到待测表面上; b）光检测器装置，用于检测从表面反射的激光束的位置，c） 第一平移装置，用于在垂直于入射光束方向的方向上提供激光装置和表面之间的相对运动，使得入射光束穿过该表面扫描; e）连接到光电检测器的位置检测装置 用于检测反射光束入射的光电检测器装置上的位置的装置。

公开(公告)号：US5224809A

公开(公告)日：1993-07-06

申请号：US816525

申请日：1991-12-30

Applicant: Dan Maydan ,  Sasson R. Somekh ,  Charles Ryan-Harris ,  Richard A. Seilheimer ,  David Cheng ,  Edward M. Abolnikov ,  Lance S. Reinke ,  J. Christopher Moran ,  Richard M. Catlin, Jr. ,  Robert B. Lowrance ,  Gregory W. Ridgeway

Inventor： Dan Maydan ,  Sasson R. Somekh ,  Charles Ryan-Harris ,  Richard A. Seilheimer ,  David Cheng ,  Edward M. Abolnikov ,  Lance S. Reinke ,  J. Christopher Moran ,  Richard M. Catlin, Jr. ,  Robert B. Lowrance ,  Gregory W. Ridgeway

IPC: B65G49/07 ,  H01L21/67 ,  H05K13/02

CPC classification number: H01L21/67 ,  H05K13/021 ,  Y10S414/13

Abstract: A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.

Abstract translation: 晶片处理系统包括安装在负载锁中的自动装载机，用于在半导体处理室和装载锁之间的卸载位置之间提供批处理，盒到盒自动晶片传送。 该系统提供快速，无污染的半导体晶片装载和卸载。

公开(公告)号：US5186594A

公开(公告)日：1993-02-16

申请号：US511481

申请日：1990-04-19

Applicant: Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall ,  David Cheng

Inventor： Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall ,  David Cheng

IPC: H01L21/02 ,  B65G49/05 ,  B65G49/07 ,  B65G65/00 ,  H01L21/205 ,  H01L21/285 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/677

CPC classification number: H01L21/67754 ,  H01L21/67201 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

Abstract: A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.

公开(公告)号：US5118955A

公开(公告)日：1992-06-02

申请号：US357403

申请日：1989-05-26

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B11/16 ,  G01B11/255 ,  G01B11/30 ,  H01L21/00

CPC classification number: H01L21/67288 ,  G01B11/16 ,  G01B11/255 ,  G01B11/306

Abstract: A system for measuring the curvature of a surface includes a laser for emitting a beam of light to be incident upon the surface; a photodetector for detecting light reflected by the surface; a first stage for selectively moving the surface in a direction normal to the direction of the incident beam; a second stage for selectively moving the photodetector in a direction normal to the reflected beam; a sensor connected to the photodetector for detecting the displacement of the reflected beam relative to the photodetector.

Abstract translation: 用于测量表面曲率的系统包括用于发射入射到表面上的光束的激光器; 用于检测由所述表面反射的光的光电检测器; 用于在垂直于入射光束的方向的方向选择性地移动表面的第一阶段; 第二级，用于沿垂直于反射光束的方向选择性地移动光电探测器; 连接到光电检测器的传感器，用于检测反射光束相对于光电检测器的位移。