Abstract:
Methods of manufacturing lead frame connectors for use in connecting optical sub-assemblies to printed circuit boards in optical transceiver modules are disclosed. The lead frame connectors are formed by first stamping a selected configuration of conductors in a conductive ribbon. Each of the conductors can then be secured in a fixed position with respect to each other. A casing having a first part and a second part can then be molded about the conductors such that each of the conductors forms an electrical contact restrained in a fixed position with respect to the first part and a contact point extending from the second part. The conductors can be bent into any desired position to allow the electrical contacts to be connected to the optical sub assembly and the contact points to be connected to the printed circuit board.
Abstract:
A transceiver module is provided that includes an optical subassembly having an extension with traces corresponding to traces defined on an associated transceiver substrate. A connector element including a flexible, non-electrically conductive substrate within which is disposed an array of conductors is placed between overlapping portions of the extension and the transceiver substrate so that upper ends of some of the conductors contact the traces of the extension, while lower ends of those same conductors contact the corresponding traces of the transceiver substrate. In this way, the connector element provides electrical communication between the optical subassembly and transceiver substrate, while also accommodating misalignment that may be present, or develop, in the transceiver module components.
Abstract:
A flexible circuit comprises a flexible substrate having first and second opposing surfaces. The flexible substrate can include multiple layers. A plurality of electrical traces can be mounted on either or both surfaces of the flexible substrate. A plurality of electrical components can also be mounted on either or both surfaces of the flexible substrate. A plurality of tooling cutouts is recessed in the sides of the flexible circuit. The tooling cutouts can have various shapes, such as, but not limited to, semi-circular, multiple straight edges, a single or multiple curved edges, etc. The cutouts are used to position and hold the flexible circuit in at least one other device.
Abstract:
An optical transceiver module having improved heat dissipation characteristics is disclosed. The transceiver includes a transmitter optical subassembly (“TOSA”), comprising a hermetically sealed housing penetrated by a component platform that includes interior and exterior platform portions. The interior portion of the component platform supports a laser that produces optical signals for emission by the TOSA. A heat tongue is attached to the both the interior and exterior portions of the component platform and is configured to absorb heat that is produced by the laser and absorbed by the component platform. A heat spreader is positioned within the transceiver shell and includes a cavity defined adjacent the heat tongue. A slug is received into the cavity and is positioned to contact both the heat tongue and the heat spreader body. The slug enables heat from the tongue to be transmitted to the heat spreader and eventually to the transceiver shell.