Abstract:
A semiconductor memory device of the single-chip MOS/LSI one-transistor dynamic RAM cell array type stores both data and address in rows of the array and uses a high speed serial access shift register as its data input/output system. The serial shift register has a number of stages equal to the number of columns in the memory cell array, and data in the shift register is transferred into or out of the columns of the array when a comparator indicates that an address input matches the stored row address. The rows are sequentially activated by a commutator, so no row or column decoders are needed. The device may be made fault tolerant by use of an electrically programmable floating gate transistor connected to each row, and programming this transistor to blank input or output if the row includes bad cells. The fault tolerant feature is transparent to the computer system using the memory.
Abstract:
An SRAM memory cell structure utilizing a read driver transistor and a column select write transistor, and a method of operating the same. The SRAM memory cell comprises first and second cross-coupled inverters, having a first and second latch nodes, respectively. The cell further comprises a first write pass transistor connected between the first latch node of the first inverter and a first pass node, and a first wordline pass transistor connected between the first pass node and a first bitline. The cell also includes a first read driver connected between the first pass node and a source potential, and a control terminal of the first read driver connected to the second latch node of the second inverter.
Abstract:
A circuit for producing a power up detection signal for use in, and being integrated onto the same semiconductor substrate as a dynamic memory device is disclosed. The circuit has a first node and a circuit to promote a low voltage on the first node when a voltage obtained from a supply voltage applied to the dynamic memory is below a predetermined level. It has a second node from which the power up detection signal can be removed. Included is a circuit to promote the obtained voltage on said second node when the obtained voltage is below the predetermined level, whereby the power up detection signal can be used to isolate the obtained voltage from the dynamic memory device. Included is a circuit to maintain a high voltage on the first node when the obtained voltage exceeds the predetermined level. Also included is a circuit to maintain the voltage on the second node at a low state when the high voltage appears on the first node, whereby the power up detection signal can be used to apply to obtained voltage to said dynamic memory device.
Abstract:
A power MOSFET device formed in a face of a semiconductor layer of a first conductivity type is provided. A first, second and third source region of a second conductivity type are formed in the face of the semiconductor layer within a moat and adjacent to its edges. A source conductor is insulatively disposed adjacent the face of the semiconductor layer and contacts the first, second and third source regions at a plurality of locations. A first and second drain region of a second conductivity type is also formed in the face of the semiconductor layer disposed spaced from and between the first and second source regions and the second and third source regions, respectively. A drain conductor is insulatively disposed adjacent the face of the semiconductor layer and contacts the first and second drain regions at a plurality of locations. A first and second field plate are insulatively disposed adjacent the face of the semiconductor layer and substantially adjacent and surrounding the first and second drain regions respectively. A first, second, third and fourth prongs forming gates of the device are insulatively disposed adjacent the face of the semiconductor layer and between the first field plate and the first and second source regions and between the second field plate and the second and third source regions. A portion of each of the gate prongs is disposed substantially above a portion of the first and second field plates. Conductive contacts connect the first and second field plates and the first and second drain regions.
Abstract:
A dynamic random access memory cell array is disclosed which has storage capacitors and access transistors formed on the sidewalls of pillars created by trenches etched into the face of a semiconductor bar. A storage capacitor for a cell uses the sidewalls of the pillar as one plate and a polysilicon plug or web as the other plate. The channel of each access transistor is formed in the upper part of the sidewall of only a portion of the pillar, using an upper edge of the capacitor region as the source region of the transistor and having an N+ drain region at the top of the pillar. A cross-point array is made possible by merging two adjacent wordlines as a pair of overlying conductor strips extending along the face over the trenches, between pillars, and forming the transistor gates by alternate protrusions from these strips, extending down into the trenches at the channel area.
Abstract:
A dynamic random access memory cell array is disclosed which has storage capacitors and access transistors formed on the sidewalls of pillars created by trenches etched into the face of a semiconductor bar. A storage capacitor for a cell uses the sidewalls of the pillar as one plate and a polysilicon plug or web as the other plate. The channel of each access transistor is formed in the upper part of the sidewall of only a portion of the pillar, using an upper edge of the capacitor region as the source region of the transistor and having an N+ drain region at the top of the pillar. A cross-point array is made possible by merging two adjacent wordlines as a pair of overlying conductor strips extending along the face over the trenches, between pillars, and forming the transistor gates by alternate protrusions from these strips, extending down into the trenches at the channel area.
Abstract:
In video computer system having a dual-port bit-mapped RAM unit incorporating a shift register, provision is made for coupling data between column lines and the shift register, and for simultaneously preventing any column line from being coupled with the random data output terminal of the RAM unit. Accordingly, this prevents two or more different data bits from appearing simultaneously from the RAM unit and causing confusion as to which is the valid signal and which is a spurious signal.
Abstract:
In a video-type computer system and the like, an improved memory circuit is provided for adapting the system to CRT screens having different resolutions. The memory circuit includes a bit-mapped RAM unit or chip having sufficient cells to accommodate any CRT screen sought to be used, and also a shift register having taps at a plurality of different locations corresponding to different columns of cells in the RAM unit. When the RAM unit is in serial mode, column address to the RAM unit is also used to instruct and actuate a suitable decoder circuit to select the tap appropriate to unload the portion of the shift register containing only the data bits of interest.
Abstract:
A semiconductor device of the MOS/LSI type uses a high speed serial shift register in its input/output system. In a memory device, the serial shift register has a number of stages equal to the number of columns in the memory cell array and is split into two half registers connected to opposite sides of the columns by transfer gates. The bits in the register may be loaded into the columns of the array and thus to an addressed row of cells, or data in one entire addressed row of cells may be loaded into the shift register stages via the columns and transfer gates. For a write operation, data from external is loaded serially into the shift register, alternating bit by bit between the two half registers. For a read operation, data is serially shifted out of the register to external, again alternating between the half registers. The data register can be advanced at twice the clock frequency.
Abstract:
A clock generator for producing internal waveforms for an MOS dynamic RAM or the like provides a preselected delay period between input and output clocks. A pair-delay circuit including two transistor stages produces the desired delay, a driver circuit provides the necessary high level output. A pair of series transistors in the output of the pair-delay, with the node between the series transistors being precharged, provides precise control of the delay over a wide range. Power dissipation is reduced in the driver circuit by avoiding the possibility of d.c. current paths when the reset clock goes high.