Abstract:
A method of operating a memory circuit to reduce standby current is disclosed. The method includes applying a first voltage (Vdd) to a power terminal (224) of a memory cell having a first (612) and a second (614) data terminal. A data bit is stored in a memory cell (600,602,604,606). A second voltage (VDA) different from the first voltage is applied to the power terminal. A third voltage (Ground) is applied to the first and second data terminals. The first voltage is applied to the power terminal.
Abstract:
In a video computer system having a dual-port bit-mapped RAM unit incorporating a shift register, provision is made for coupling data between column lines and the shift register, and for simultaneously preventing any column line from being coupled with the random data output terminal of the RAM unit. Accordingly, this prevents two or more different data bits from appearing simultaneously from the RAM unit and causing confusion as to which is the valid signal and which is a spurious signal.
Abstract:
In a video-type computer system and the like, an improved memory circuit is provided for adapting the system to CRT screens having different resolutions. The memory circuit includes a bit-mapped RAM unit or chip having sufficient cells to accommodate any CRT screen sought to be used, and also a serial shift register having taps at a plurality of different locations corresponding to different columns of cells in the RAM unit. When the RAM unit is in serial mode, a row of data is transferred into the serial shift register. Then the column address applied to the RAM unit is used to instruct and actuate a suitable decoder circuit to select the tap appropriate to unload the portion of the serial shift register containing the data bits of interest.
Abstract:
A random access memory device of the MOS integrated circuit type employs an array of rows and columns of one-transistor storage cells with bistable sense amplifier circuits at the center of each column. The load transistors in each bistable circuit have clock voltages applied to their gates after an initial sensing period, so the initial sensing is done without loads for the bistable circuit. After this initial period, the load transistors are turned on by boosting capacitors. Then, fixed biased transistors shunting the gates of the load device to the digit lines function to turn off the load device on the zero logic level side.
Abstract:
In video computer system having a dual-port bit-mapped RAM unit incorporating a shift register, provision is made for coupling data between column lines and the shift register, and for simultaneously preventing any column line from being coupled with the random data output terminal of the RAM unit. Accordingly, this prevents two or more different data bits from appearing simultaneously from the RAM unit and causing confusion as to which is the valid signal and which is a spurious signal.
Abstract:
In a computer system, an improved memory circuit is provided for accomodating video display circuits with CRT screens having different resolutions. The memory circuit includes a bit-mapped RAM unit or chip having sufficient cells to accomodate any CRT screen intended to be used, and it further includes a serial shift register having a plurality of taps at locations corresponding to different preselected columns of cells in the chip. In the system, provision is included for selecting taps to unload only the portion of the shift register containing the bits of interest, whereby unused portions of the chip may be effectively excluded and the time for transferring data of interest to the CRT screen is reduced.
Abstract:
A semiconductor memory device of the MOS/LSI type using an array of dynamic one-transistor cells has a high speed serial input/output system. A serial shift register having a number of stages equal to the number of columns in the memory cell array is split into two half registers connected to opposite sides of the columns by transfer gates. The bits in the register may be loaded into the columns of the array and thus to an addressed row of cells, or data in one entire addressed row of cells may be loaded into the shift register stages via the columns and transfer gates. For a write operation, data from external is loaded serially into the shift register, alternating bit by bit between the two half registers. For a read operation, data is serially shifted out of the register to external, again alternating between the half registers. The data register can be advanced at twice the clock frequency. The cell array can be addressed for refresh during the time that data is being shifted into or out of the serial register.
Abstract:
A high speed address buffer circuit for use in MOS/LSI semiconductor memories or the like. An unbalanced, dynamic cross-coupled pair of MOS driver transistors is used to sense an address input during a short time window, and internal address signals are generated from the state of the sense circuit. Sensing nodes are precharged and equalized prior to the time window, and the node which is to stay at the logic "1" level is held at a high level by boosting capacitors to which a delayed clock signal is applied. The state of the sense circuit is sampled at a time after the delayed clock and high level addresses are generated.
Abstract:
A power MOSFET device formed in a face of a semiconductor layer of a first conductivity type is provided. A first, second and third source region of a second conductivity type are formed in the face of the semiconductor layer within a moat and adjacent to its edges. A source conductor is insulatively disposed adjacent the face of the semiconductor layer and contacts the first, second and third source regions at a plurality of locations. A first and second drain region of a second conductivity type is also formed in the face of the semiconductor layer disposed spaced from and between the first and second source regions and the second and third source regions, respectively. A drain conductor is insulatively disposed adjacent the face of the semiconductor layer and contacts the first and second drain regions at a plurality of locations. A first and second field plate are insulatively disposed adjacent the face of the semiconductor layer and substantially adjacent and surrounding the first and second drain regions respectively. A first, second, third and fourth prongs forming gates of the device are insulatively disposed adjacent the face of the semiconductor layer and between the first field plate and the first and second source regions and between the second field plate and the second and third source regions. A portion of each of the gate prongs is disposed substantially above a portion of the first and second field plates. Conductive contacts connect the first and second field plates and the first and second drain regions.
Abstract:
A transistor device 10 formed in a semiconductor layer 12 is disclosed herein. A first source/drain region 14 is formed in the semiconductor layer 12. A second source/drain region 16 is also formed in the semiconductor layer 12 and is spaced from the first source/drain region 14 by a channel region 18. The second source/drain region 16 includes (1) a lightly doped portion 16b adjacent the channel region 18 and abutting the top surface, (2) a main portion 16a abutting the top surface and spaced from the channel region 18 by the lightly doped portion 16b, and (3) a deep portion 16c formed within the layer 12 and spaced from the top surface by the lightly doped portion 16b and the main portion 16a. A gate electrode 20 is formed over at least a portion of the channel region 18 and insulated therefrom.