公开(公告)号：US20180200861A1

公开(公告)日：2018-07-19

申请号：US15744460

申请日：2016-05-18

Applicant: FUJIMI INCORPORATED

Inventor： Hitoshi MORINAGA ,  Kazusei TAMAI ,  Muneaki TAHARA ,  Maiko ASAI ,  Yuuichi ITO

IPC: B24B29/02 ,  B24B37/22 ,  B24B37/24 ,  B32B5/12 ,  B32B5/24 ,  B32B27/36

CPC classification number: B24B29/02 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B32B5/12 ,  B32B5/245 ,  B32B27/36 ,  B32B2305/22 ,  B32B2307/72 ,  B32B2307/732

Abstract: To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion (1) in which a plurality of fibers (12) having a length of 2 mm or more are raised on the surface of a base (11), in which the mass of the fibers (12) is 250 g/m2 or more. The polishing pad is used for polishing an object to be polished (2) containing metal, an alloy, or a metal oxide material and having at least one of a projection portion (21) and a recessed portion (22) on the surface.

公开(公告)号：US20160236314A1

公开(公告)日：2016-08-18

申请号：US15026089

申请日：2014-10-02

Applicant: FUJIMI INCORPORATED

Inventor： Hitoshi MORINAGA ,  Hiroshi ASANO ,  Shingo OTSUKI ,  Kazusei TAMAI

IPC: B24B19/08 ,  B24B41/00

Abstract: A polishing device includes a motor movement mechanism and a second motor that rotates a workpiece. The motor movement mechanism moves the workpiece in a direction tangential to a radially outer circumferential surface of a polishing member and moves the workpiece in a direction orthogonal to a rotational axis of the polishing member.

Abstract translation: 抛光装置包括马达运动机构和使工件旋转的第二马达。 马达运动机构沿着与研磨部件的径向外周面切线的方向移动工件，并使工件沿与抛光部件的旋转轴线正交的方向移动。

公开(公告)号：US20150360340A1

公开(公告)日：2015-12-17

申请号：US14758411

申请日：2013-12-26

Applicant: FUJIMI INCORPORATED

Inventor： Kazusei TAMAI ,  Maiko ASAI ,  Hitoshi MORINAGA

IPC: B24B37/04 ,  C22C21/08 ,  C09G1/02 ,  C23F1/20

CPC classification number: B24B37/044 ,  C09G1/02 ,  C09K3/1463 ,  C22C21/08 ,  C23F1/20

Abstract: An alloy material polishing method of the present invention is a method for polishing an alloy material containing a main component and 0.5% by mass or more of an accessory component element having a Vickers hardness (HV) different from that of the main component by 5 or more. The polishing method is characterized by polishing a surface of the alloy material using a polishing composition containing abrasive grains and an oxoacid-based oxidizing agent. The main component of the alloy material is preferably at least one selected from aluminum, titanium, iron, nickel, and copper. The main component of the alloy material is preferably aluminum, and the accessory component element is preferably at least one selected from silicon, magnesium, iron, copper, and zinc. The polishing method preferably includes preliminarily polishing the alloy material using a preliminary polishing composition before the polishing of the alloy material using the polishing composition.

Abstract translation: 本发明的合金材料研磨方法是将含有主要成分的合金材料和0.5质量％以上的维氏硬度（HV）与主成分的维氏硬度（HV）不同的附加成分元素研磨5以上的方法， 更多。 抛光方法的特征在于使用包含磨料颗粒和含氧酸的氧化剂的抛光组合物来研磨合金材料的表面。 合金材料的主要成分优选为选自铝，钛，铁，镍，铜中的至少一种。 合金材料的主要成分优选为铝，辅助成分元素优选为选自硅，镁，铁，铜，锌中的至少一种。 抛光方法优选包括在使用抛光组合物研磨合金材料之前，使用预备抛光组合物预先研磨合金材料。