摘要:
A method for producing a storage cell includes forming a polycrystalline silicon layer on a semiconductor body having at least one selection transistor disposed in a first plane. An interspace is formed between two adjacent structures of the layer and one of the adjacent structures of the layer is placed on a surface of a first silicon plug. A cell plate electrode is formed in the interspace and a trench is formed in the layer. The trench reaches as far as the first plug surface and is filled with an insulating layer. The-layer is removed. A storage capacitor having a high-epsilon or ferroelectric dielectric and a storage node electrode is formed. The capacitor is disposed in a second plane in and above the body. The insulating layer is replaced with silicon to form a second silicon plug directly connected to the first plug. The second plug is electrically connected to the storage node electrode, and the first plane is electrically connected to the second plane through the first and second plugs.
摘要:
A memory cell arrangement, and method for producing same, which includes vertical MOS transistors as memory cells wherein the information is stored by means of at least three different threshold voltage values of the transistors by multi-level programming. One threshold voltage value is obtained by the thickness of the gate dielectric in the sense of a thick oxide transistor and the other threshold voltage values are obtained by different channel dopings. The arrangement can be produced with an area requirement for each memory cell of 2 F2 (F: minimum structure size).
摘要:
A first structure of a circuit configuration and a first alignment structure are produced in the region of a surface of a first substrate. The first alignment structure scatters electron beams differently than its surroundings. A second substrate, which is more transmissive to electron beams than the first alignment structure, is connected to the first substrate in such a way that the second substrate is disposed above the surface of the first substrate. In order to align a mask with respect to the first structure, a position of the first alignment structure is determined with the aid of electron beams. With the aid of the mask, at least one second structure of the circuit configuration is produced in the region of an uncovered upper surface of the second substrate. The first structure may be a metallic line encapsulated by insulating material. A contact may connect the first structure to the second structure. With the aid of electron beam lithography, at least one second alignment structure may be produced in the region of the upper surface of the second substrate, using which the mask is aligned.
摘要:
Embodiments of the present invention relate generally to integrated circuits and methods for manufacturing an integrated circuit. In an embodiment of the invention, an integrated circuit having a memory cell is provided. The memory cell may include a trench in a carrier, a charge trapping layer structure in the trench, the charge trapping layer structure comprising at least two separate charge trapping regions, electrically conductive material at least partially filled in the trench, and source/drain regions next to the trench.
摘要:
A depression extends from a main surface of the substrate to the inside of said substrate and has an upper area and an adjacent lower area. A cross-section of the upper area, parallel to the main surface, is provided with at least one corner. A cross-section of the lower area, parallel to the main surface, matches the cross-section of the upper area, particularly in the vicinity the upper area, with the following difference: each corner is rounded, whereby the cross section of the lower area is smaller than the cross-section of the upper area. In order to produce the indentation, the upper area is provided with an auxiliary spacer that is rounded by isotropic etching. The lower area is produced by selectively etching the substrate to form an auxiliary spacer.
摘要:
The invention relates to an SOI substrate which is provided with a recess that cuts through the silicon layer and the SiO2 layer (O). An upper part of said recess (V) which is located in the range of the silicon layer (S) has cylindrical shape with a horizontal first cross-section. A lower part of the recess (V) which is located in the range of the SiO2 layer (O), compared with the upper part of the recess (V), is bulged to such an extent that it has a cylindrical shape with a horizontal second cross-section that is larger than the first cross-section. A cylinder (Z) of an insulating material is provided in the recess (V). The horizontal cross-section of said cylinder corresponds to the first cross-section and the lower part thereof is located in the lower part of the recess (V). The dent laterally surrounds the lower part of the cylinder (Z). A conducting structure (L) is located in the dent and adjoins the silicon layer (S) and the silicon substrate (1) so that the channel zone of the MOS transistors is electrically connected to the silicon substrate.
摘要:
Parallel lines, for example bit lines in a memory cell configuration formed of doped regions in a semiconductor substrate, are driven by electrically connecting a number of the lines to one another and to a common node. A number of selection lines extend transversely to the lines. MOS transistors are arranged at the points of intersection and are connected in series along one of the lines. The gate electrode of the MOS transistors is formed by the corresponding selection line. At least one MOS transistor in each of the parallel lines has a higher threshold voltage than the others.
摘要:
In an embodiment of the invention, an integrated circuit having a cell is provided. The cell may include a field effect transistor structure which includes a gate stack and a resistivity changing material structure disposed above the gate stack, wherein the resistivity changing material structure includes a resistivity changing material which is configured to change its resistivity in response to the application of an electrical voltage to the resistivity changing material structure.
摘要:
A dynamic random access memory includes memory cells arranged in rows and columns on the substrate and a plurality of connecting pillars, each associated with a memory cell. A bit line extends above the main area of the substrate and connects to each memory cell of a column. A first word line connects a first set of alternate memory cells of a row by a first subset of the plurality of connecting pillars. The first word line includes first parts arranged offset relative to the first subset of connecting pillars. A strip-shaped second part extends above the main area and adjoins the first parts of the first word line. A second word line connects to a second set of alternate memory cells of the row by a second subset of the connecting pillars. The second word line includes first parts arranged between mutually adjacent first word lines and offset from the second subset of the connecting pillars. Both the first and second word lines thus overlap but do not cover the connecting pillars. A strip-shaped second part extends above the main area in the first direction and adjoins the first parts of the second word line. The second part is above the first word line and the bit line.
摘要:
The memory cells each have a capacitor and a transistor. A storage node of the capacitor is arranged in a first depression formed in a substrate. A gate electrode of the transistor is arranged in a second depression at a first lateral surface of the second depression. The second depression is spaced apart from the first depression. An upper source/drain region of the transistor adjoins the storage node and the second depression. A lower source/drain region of the transistor is formed deeper in the substrate than the upper source/drain region and it adjoins the second depression.