摘要:
An integrated circuit contains a planar first transistor and a diode. The diode is connected between a first source/drain region of the first transistor and a gate electrode of the first transistor such that a charge is impeded from discharging from the gate electrode to the first source/drain region. A diode layer that is part of the diode is disposed on a portion of the first source/drain region. A conductive structure that is an additional part of the diode is disposed above a portion of the gate electrode and is disposed on the diode layer. The diode can be configured as a tunnel diode. The diode layer can be produced by thermal oxidation. Only one mask is required for producing the diode. A capacitor can be disposed above the diode. The first capacitor electrode of the capacitor is connected to the conductive structure.
摘要:
A depression extends from a main surface of the substrate to the inside of said substrate and has an upper area and an adjacent lower area. A cross-section of the upper area, parallel to the main surface, is provided with at least one corner. A cross-section of the lower area, parallel to the main surface, matches the cross-section of the upper area, particularly in the vicinity the upper area, with the following difference: each corner is rounded, whereby the cross section of the lower area is smaller than the cross-section of the upper area. In order to produce the indentation, the upper area is provided with an auxiliary spacer that is rounded by isotropic etching. The lower area is produced by selectively etching the substrate to form an auxiliary spacer.
摘要:
A method for producing a storage cell includes forming a polycrystalline silicon layer on a semiconductor body having at least one selection transistor disposed in a first plane. An interspace is formed between two adjacent structures of the layer and one of the adjacent structures of the layer is placed on a surface of a first silicon plug. A cell plate electrode is formed in the interspace and a trench is formed in the layer. The trench reaches as far as the first plug surface and is filled with an insulating layer. The-layer is removed. A storage capacitor having a high-epsilon or ferroelectric dielectric and a storage node electrode is formed. The capacitor is disposed in a second plane in and above the body. The insulating layer is replaced with silicon to form a second silicon plug directly connected to the first plug. The second plug is electrically connected to the storage node electrode, and the first plane is electrically connected to the second plane through the first and second plugs.
摘要:
The memory cells each have a capacitor and a transistor. A storage node of the capacitor is arranged in a first depression formed in a substrate. A gate electrode of the transistor is arranged in a second depression at a first lateral surface of the second depression. The second depression is spaced apart from the first depression. An upper source/drain region of the transistor adjoins the storage node and the second depression. A lower source/drain region of the transistor is formed deeper in the substrate than the upper source/drain region and it adjoins the second depression.
摘要:
Each memory cell of a cell configuration includes at least one memory transistor. To write first or second information on the memory cell, a gate electrode of the memory transistor is charged such that a first voltage or a second voltage is applied in the memory transistor. A reading voltage is applied in a second source/drain area of the memory transistor to read first information and second information respectively. The first voltage is applied between the second voltage and the reading voltage. The reading voltage is applied between the first voltage less a threshold voltage of the memory transistor and the second voltage less the threshold voltage of the memory transistor.
摘要:
A DRAM memory cell is provided with a selection transistor, which is arranged horizontally at a semiconductor substrate surface and has a first source/drain electrode, a second source/drain electrode, a channel layer arranged between the first and the second source/drain electrode in the semiconductor substrate, and a gate electrode, which is arranged along the channel layer and is electrically insulated from the channel layer, a storage capacitor, which has a first capacitor electrode and a second capacitor electrode, insulated from the first capacitor electrode, one of the capacitor electrodes of the storage capacitor being electrically conductively connected to one of the source/drain electrodes of the selection transistor, and a semiconductor substrate electrode on the rear side, the gate electrode enclosing the channel layer at at least two opposite sides.
摘要:
The process first forms trench capacitors in a substrate, which are filled with a trench fill and in which a first insulating layer is disposed over the conductive trench fill. The first insulating layer is then overgrown laterally by a selectively grown epitaxial layer. The selective epitaxial layer is so structured that a ridge is formed from it. Next, the ridge is partially undercut, whereby the etch selectivity of the ridge relative to the first insulating layer is utilized for a wet-chemical etching procedure. Next, a contact layer is arranged in the undercut region, which connects the ridge and a transistor that has been formed in the ridge to the conductive trench fill. Lateral margin ridges are then formed next to the ridge as a gate, and a doped region is incorporated into the ridge as a source/drain zone of the transistor.
摘要:
An integrated dynamic memory cell having a small area of extent on a semiconductor substrate is described. The memory cell has a selection MOSFET with a gate connection area that is connected to a word line, a source connection doping area which is connected to a bit line, and a drain connection doping area. A memory MOSFET has a gate connection area which is connected via a thin dielectric layer to a connection doping region which connects a source connection doping area of the memory MOSFET to the drain connection doping area of the selection MOSFET. The memory MOSFET further has a drain connection doping area that is connected to a supply voltage. The selection and memory MOSFETs are disposed on opposite sidewalls of a trench, which is etched in the substrate, and the connection doping region forms a bottom of the trench.
摘要:
A memory cell configuration with many ferroelectric or dynamic memory cells provided in a semiconductor substrate. Alternating trenches and lands extend parallel in a longitudinal direction of a main face of the semiconductor substrate. A channel stop layer is buried in the lands and divides the semiconductor substrate into a lower region that includes the trench bottoms and an upper region that includes the land ridges. First planar selection transistors with intervening trench channel stop regions are disposed along the trench bottoms. Second planar selection transistors with intervening land channel stop regions are disposed along the land ridges. The first and second selection transistors have respective source, gate, channel and drain regions, which are offset longitudinally from one another such that source and drain regions of the first and second selection transistors alternate in the transverse direction in the main face of the semiconductor substrate. Isolated word lines are provided which extend in the transverse direction along the main face for triggering the first and second selection transistors in the respective gate regions. Isolated bit lines are provided which extend in an oblique direction along the main face for connecting the first and second selection transistors in the respective source regions. And preferably ferroelectric capacitors are each connected to the drain regions of applicable selection transistors via capacitor contacts.
摘要:
The memory cells of a memory cell configuration each have a selection transistor, a memory transistor and a ferroelectric capacitor. The selection transistor and the memory transistor are connected in series. The ferroelectric capacitor is connected between a control electrode of the memory transistor and a first terminal of the selection transistor.