公开(公告)号：US08659326B1

公开(公告)日：2014-02-25

申请号：US13630122

申请日：2012-09-28

Applicant: General Electric Company

Inventor： Glenn Claydon ,  Christopher Fred Keimel ,  John Norton Park ,  Bo Li

IPC: H03K3/00

CPC classification number: H01H59/0009

Abstract: A switching apparatus, as may be configured to actuate stacked MEMS switches, may include a switching circuitry (34) including a MEMS switch (36) having a beam (16) made up of a first movable actuator (17) and a second movable actuator (19) electrically connected by a common connector (20) and arranged to selectively establish an electrical current path through the first and second movable actuators in response to a gate control signal applied to the gates of the switch to actuate the movable actuators. The apparatus may further include a gating circuitry (32) to generate the gate control signal applied to gates of the switch. The gating circuitry may include a driver channel (40) electrically coupled to the common connector and may be adapted to electrically float with respect to a varying beam voltage, and may be electrically referenced between the varying beam voltage and a local electrical ground of the gating circuitry.

Abstract translation: 可以被配置为致动堆叠的MEMS开关的开关设备可以包括开关电路（34），其包括具有由第一可移动致动器（17）和第二可移动致动器（17）构成的梁（16）的MEMS开关（36） （19），其通过公共连接器（20）电连接并且布置成响应于施加到开关的栅极的门控制信号选择性地建立穿过第一和第二可动致动器的电流路径，以致动可动致动器。 该装置还可以包括门控电路（32），用于产生施加到开关的栅极的栅极控制信号。 门控电路可以包括电耦合到公共连接器的驱动器通道（40），并且可以适于相对于变化的电压电电动浮动，并且可以在变化的电压电压和门控的局部电接地 电路。

公开(公告)号：US10602950B2

公开(公告)日：2020-03-31

申请号：US15377696

申请日：2016-12-13

Applicant: General Electric Company ,  Brigham Young University

Inventor： Jeffrey M. Ashe ,  Kaustubh Ravindra Nagarkar ,  Christopher Michael Puleo ,  Christopher Fred Keimel ,  Craig Patrick Galligan ,  Yizhen Lin ,  Nancy Cecelia Stoffel ,  Richard Vanfleet ,  Robert Davis ,  Guohai Chen

IPC: A61B5/0478 ,  A61B5/1473 ,  A61B5/145 ,  A61B7/02 ,  A61N1/05 ,  A61B5/11 ,  A61B17/00

Abstract: The present approach relates to the fabrication and use of a probe array having multiple individual probes. In one embodiment, the probes of the probe array may be functionalized such that certain of the probes are suitable for electrical sensing (e.g., recording) or stimulation, non-electrical sensing or stimulation (e.g., chemical sensing and/or release of biomolecules when activated), or a combination of electrical and non-electrical sensing or stimulation.

公开(公告)号：US20200011667A1

公开(公告)日：2020-01-09

申请号：US16549760

申请日：2019-08-23

Applicant: General Electric Company

Inventor： Sergey Alexandrovich Zotov ,  Christopher Fred Keimel ,  Todd Frederick Miller ,  Yizhen Lin

IPC: G01C19/5684 ,  G01P15/02

Abstract: A gyroscope includes at least one anchor and a plurality of gyroscope spring elements coupled to the at least one anchor. The gyroscope also includes a plurality of concentric rings coupled to the plurality of gyroscope spring elements and configured to encircle the plurality of gyroscope spring elements. The gyroscope further includes an excitation/detection/tuning unit electrostatically coupled to the plurality of concentric rings.

公开(公告)号：US10083811B2

公开(公告)日：2018-09-25

申请号：US14919769

申请日：2015-10-22

Applicant: General Electric Company

Inventor： Yanfei Liu ,  Glenn Scott Claydon ,  Christopher Fred Keimel ,  Christian Michael Giovanniello, Jr.

IPC: H01H47/02 ,  H01H59/00 ,  H01H9/54 ,  H01H71/00

CPC classification number: H01H47/02 ,  H01H9/542 ,  H01H59/0009 ,  H01H2071/008

Abstract: A switching system includes a MEMS switching circuit having a MEMS switch and a driver circuit. An auxiliary circuit is coupled in parallel with the MEMS switching circuit, the auxiliary circuit comprising first and second connections that connect the auxiliary circuit to the MEMS switching circuit on opposing sides of the MEMS switch, first and second solid state switches connected in parallel, and a resonant circuit connected between the first and second solid state switches. A control circuit controls selective switching of a load current towards the MEMS switching circuit and the auxiliary circuit by selectively activating the first and second solid state switches and the resonant circuit so as to limit a voltage across the MEMS switch by diverting at least a portion of the load current away from the MEMS switch to flow to the auxiliary circuit prior to the MEMS switch changing state.

公开(公告)号：US09997317B2

公开(公告)日：2018-06-12

申请号：US14919833

申请日：2015-10-22

Applicant: General Electric Company

Inventor： Yanfei Liu ,  Glenn Scott Claydon ,  Christopher Fred Keimel ,  Christian Michael Giovanniello, Jr.

IPC: H01H47/02 ,  G01R23/15 ,  H01H9/54 ,  H01H59/00 ,  H01H71/00

CPC classification number: H01H47/02 ,  G01R23/15 ,  H01H9/542 ,  H01H59/0009 ,  H01H2071/008 ,  H03K2217/0063 ,  H03K2217/009

Abstract: A switching system includes a control circuit that receives On-Off signals indicative of a desired operating state of a switch. The control circuit includes an oscillator that generates a first electrical pulse responsive having a first signal characteristic or a second signal characteristic that is determined by the received On-Off signal, which may be related to a frequency or duty cycle of the pulse. A pulse transformer connected to the oscillator receives the first electrical pulse and outputs a second electrical pulse having the same one of the first signal characteristic and the second signal characteristic as the first electrical pulse. A pulse detection circuit in the control circuit receives the second electrical pulse, determines whether the second electrical pulse has the first signal characteristic or the second signal characteristic, and controls transmission of power and control signals to the switch based on this determination.

公开(公告)号：US09814419B2

公开(公告)日：2017-11-14

申请号：US15092655

申请日：2016-04-07

Applicant: General Electric Company

Inventor： Jason Harris Karp ,  Christopher James Kapusta ,  Paul Jeffrey Gillespie ,  Christopher Fred Keimel ,  Jeffrey Michael Ashe ,  James Enrico Sabatini

IPC: A61B5/1455 ,  A61B5/00 ,  A61B5/029 ,  A61B5/08 ,  H01L25/075 ,  H05K1/18 ,  H01L33/62

CPC classification number: A61B5/14552 ,  A61B5/0002 ,  A61B5/029 ,  A61B5/0816 ,  A61B5/6826 ,  A61B5/742 ,  A61B2562/0238 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/222 ,  A61B2562/227 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/181 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10151 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.

公开(公告)号：US09806390B2

公开(公告)日：2017-10-31

申请号：US15429227

申请日：2017-02-10

Applicant: General Electric Company

Inventor： Yongjae Lee ,  Joseph Alfred Iannotti ,  Christopher Fred Keimel ,  Christopher James Kapusta

IPC: H01P1/15 ,  H01H57/00 ,  H01L21/48 ,  H01L21/52 ,  H01L21/54 ,  H01L21/56 ,  H01H59/00 ,  H01H61/01 ,  H01H55/00 ,  H01H61/00

CPC classification number: H01P1/15 ,  H01H55/00 ,  H01H57/00 ,  H01H59/0009 ,  H01H61/01 ,  H01H2057/006 ,  H01H2061/006 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/54 ,  H01L21/56 ,  H01L2224/16225 ,  H01L2924/16195 ,  H01P1/127 ,  H01P3/084

Abstract: A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line. An inverted ground plane assembly is coupled to the plurality of conductive mounting pads such that an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.

公开(公告)号：US20170117111A1

公开(公告)日：2017-04-27

申请号：US14919833

申请日：2015-10-22

Applicant: General Electric Company

Inventor： Yanfei Liu ,  Glenn Scott Claydon ,  Christopher Fred Keimel ,  Christian Michael Giovanniello, JR.

IPC: H01H47/02 ,  G01R23/15

CPC classification number: H01H47/02 ,  G01R23/15 ,  H01H9/542 ,  H01H59/0009 ,  H01H2071/008 ,  H03K2217/0063 ,  H03K2217/009

Abstract: A switching system includes a control circuit that receives On-Off signals indicative of a desired operating state of a switch. The control circuit includes an oscillator that generates a first electrical pulse responsive having a first signal characteristic or a second signal characteristic that is determined by the received On-Off signal, which may be related to a frequency or duty cycle of the pulse. A pulse transformer connected to the oscillator receives the first electrical pulse and outputs a second electrical pulse having the same one of the first signal characteristic and the second signal characteristic as the first electrical pulse. A pulse detection circuit in the control circuit receives the second electrical pulse, determines whether the second electrical pulse has the first signal characteristic or the second signal characteristic, and controls transmission of power and control signals to the switch based on this determination.

公开(公告)号：US20160220158A1

公开(公告)日：2016-08-04

申请号：US15092655

申请日：2016-04-07

Applicant: General Electric Company

Inventor： Jason Harris Karp ,  Christopher James Kapusta ,  Paul Jeffrey Gillespie ,  Christopher Fred Keimel ,  Jeffrey Michael Ashe ,  James Enrico Sabatini

IPC: A61B5/1455 ,  A61B5/00

CPC classification number: A61B5/14552 ,  A61B5/0002 ,  A61B5/029 ,  A61B5/0816 ,  A61B5/6826 ,  A61B5/742 ,  A61B2562/0238 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/222 ,  A61B2562/227 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/181 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10151 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.

Abstract translation: 发射体阵列包括具有第一和第二侧的器件衬底，设置在器件衬底的第一侧上的导热层和布置在器件衬底的第二侧的第一多个部分上的互连层。 发射器的阵列还包括设置在器件衬底的第二多个部分中的多个发射器，其中多个发射极电耦合到导热层和导电层。 此外，发射器的阵列包括多个引线键合触点，其被配置为将互连层的一部分电耦合到多个发射体中的对应的发射极，以及多个封装，其中多个封装的一个或多个封装是 设置在所述多个引线接触件的对应的引线接合的至少一部分上。

公开(公告)号：US20150133753A1

公开(公告)日：2015-05-14

申请号：US14079660

申请日：2013-11-14

Applicant: General Electric Company

Inventor： Jason Harris Karp ,  Christopher James Kapusta ,  Paul Jeffrey Gillespie ,  Christopher Fred Keimel ,  Jeffrey Michael Ashe ,  James Enrico Sabatini

IPC: A61B5/1455 ,  H05K3/32

CPC classification number: A61B5/14552 ,  A61B5/0002 ,  A61B5/029 ,  A61B5/0816 ,  A61B5/6826 ,  A61B5/742 ,  A61B2562/0238 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/222 ,  A61B2562/227 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/181 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10151 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.

Abstract translation: 发射体阵列包括具有第一和第二侧的器件衬底，设置在器件衬底的第一侧上的导热层和布置在器件衬底的第二侧的第一多个部分上的互连层。 发射器的阵列还包括设置在器件衬底的第二多个部分中的多个发射器，其中多个发射极电耦合到导热层和导电层。 此外，发射器的阵列包括多个引线键合触点，其被配置为将互连层的一部分电耦合到多个发射体中的对应的发射极，以及多个封装，其中多个封装的一个或多个封装是 设置在所述多个引线接触件的对应的引线接合的至少一部分上。