公开(公告)号：US09999352B2

公开(公告)日：2018-06-19

申请号：US14039497

申请日：2013-09-27

Applicant: General Electric Company

Inventor： James Enrico Sabatini ,  Jeffrey Michael Ashe ,  Xiaohui Chen ,  Tzu-Jen Kao

IPC: A61B5/00 ,  A61B5/053

CPC classification number: A61B5/0053 ,  A61B5/0537 ,  A61B5/4875 ,  A61B5/4878

Abstract: In accordance with one aspect of the present technique, a method is disclosed. The method includes applying a mechanical perturbation to a tissue region using a displacement device. The method further includes calculating a compression impedance of the tissue region in response to applying the mechanical perturbation. The method further includes retracting the displacement device and calculating a retraction impedance of the tissue region in response to retracting the displacement device. The method also includes determining a hydration level of the tissue region based on at least one of the compression impedance and the retraction impedances.

公开(公告)号：US11944490B2

公开(公告)日：2024-04-02

申请号：US16517289

申请日：2019-07-19

Applicant: General Electric Company

Inventor： Christopher Michael Puleo ,  Jeffrey Michael Ashe ,  David Andrew Shoudy ,  Victoria Eugenia Cotero ,  James Enrico Sabatini

IPC: A61B8/00 ,  A61N7/00

CPC classification number: A61B8/4236 ,  A61B8/4281 ,  A61N7/00 ,  A61N2007/0026

Abstract: Techniques for accurate positioning of an energy application device for neuromodulation treatment protocols are provided. A neuromodulation positioning patch is applied to a patient's skin. The energy application device is coupled to a frame of the neuromodulation positioning patch to position a transducer of the energy application device within an opening at a treatment position within the opening. The frame is also coupled to a removable dock for an imaging probe. When the frame is coupled to the removable dock the frame of the neuromodulation positioning patch, acquires image data through the opening to identify or verify the treatment position.

公开(公告)号：US11826197B2

公开(公告)日：2023-11-28

申请号：US17319741

申请日：2021-05-13

Applicant: General Electric Company

Inventor： David Andrew Shoudy ,  Craig Patrick Galligan ,  Weston Blaine Griffin ,  Jeffrey Michael Ashe ,  Warren Lee ,  James Enrico Sabatini

IPC: A61B8/00 ,  A61N7/00

CPC classification number: A61B8/4227 ,  A61B8/4254 ,  A61N7/00 ,  A61N2007/0026 ,  A61N2007/0052 ,  A61N2007/0078

Abstract: The present discussion relates to structures and devices to facilitate application of an ultrasound therapy beam to a target anatomic region in a replicable manner. In certain aspects, adjustable positioning structures are described that allow a general probe positioning structure to be configured for a specific patient in a manner that allows the device to be used repeatedly to target the anatomic region, even when in non-clinical settings. In other aspects, a probe positioning structure is fabricated that is specific to a respective patient anatomy, such that use of the probe positioning structure provides repeatable targeting of the target anatomic region, even when in non-clinical settings.

公开(公告)号：US20220361844A1

公开(公告)日：2022-11-17

申请号：US17319741

申请日：2021-05-13

Applicant: General Electric Company

Inventor： David Andrew Shoudy ,  Craig Patrick Galligan ,  Weston Blaine Griffin ,  Jeffrey Michael Ashe ,  Warren Lee ,  James Enrico Sabatini

IPC: A61B8/00 ,  A61N7/00

Abstract: The present discussion relates to structures and devices to facilitate application of an ultrasound therapy beam to a target anatomic region in a replicable manner. In certain aspects, adjustable positioning structures are described that allow a general probe positioning structure to be configured for a specific patient in a manner that allows the device to be used repeatedly to target the anatomic region, even when in non-clinical settings. In other aspects, a probe positioning structure is fabricated that is specific to a respective patient anatomy, such that use of the probe positioning structure provides repeatable targeting of the target anatomic region, even when in non-clinical settings.

公开(公告)号：US20210015454A1

公开(公告)日：2021-01-21

申请号：US16517289

申请日：2019-07-19

Applicant: General Electric Company

Inventor： Christopher Michael Puleo ,  Jeffrey Michael Ashe ,  David Andrew Shoudy ,  Victoria Eugenia Cotero ,  James Enrico Sabatini

IPC: A61B8/00 ,  A61N7/00

Abstract: Embodiments of the present disclosure relate to techniques for accurate positioning of an energy application device for neuromodulation treatment protocols. In one embodiment, a neuromodulation positioning patch is applied to a patient's skin. The energy application device is configured to couple to a frame of the neuromodulation positioning patch to position a transducer of the energy application device within an opening at a treatment position within the opening. In one embodiment, the frame is also configured to couple to a removable dock for an imaging probe that, when coupled to the removable dock and, in turn, the frame of the neuromodulation positioning patch, is configured to acquire image data through the opening to identify or verify a treatment position.

公开(公告)号：US20150094548A1

公开(公告)日：2015-04-02

申请号：US14039497

申请日：2013-09-27

Applicant: General Electric Company

Inventor： James Enrico Sabatini ,  Jeffrey Michael Ashe ,  Xiaohui Chen ,  Tzu-Jen Kao

IPC: A61B5/00 ,  A61B5/053

CPC classification number: A61B5/0053 ,  A61B5/0537 ,  A61B5/4875 ,  A61B5/4878

Abstract: In accordance with one aspect of the present technique, a method is disclosed. The method includes applying a mechanical perturbation to a tissue region using a displacement device. The method further includes calculating a compression impedance of the tissue region in response to applying the mechanical perturbation. The method further includes retracting the displacement device and calculating a retraction impedance of the tissue region in response to retracting the displacement device. The method also includes determining a hydration level of the tissue region based on at least one of the compression impedance and the retraction impedances.

Abstract translation: 根据本技术的一个方面，公开了一种方法。 该方法包括使用位移装置将机械扰动施加到组织区域。 该方法还包括响应于施加机械扰动来计算组织区域的压缩阻抗。 该方法还包括回缩位移装置并响应于缩回位移装置计算组织区域的缩回阻抗。 该方法还包括基于压缩阻抗和回缩阻抗中的至少一个来确定组织区域的水化水平。

公开(公告)号：US09814419B2

公开(公告)日：2017-11-14

申请号：US15092655

申请日：2016-04-07

Applicant: General Electric Company

Inventor： Jason Harris Karp ,  Christopher James Kapusta ,  Paul Jeffrey Gillespie ,  Christopher Fred Keimel ,  Jeffrey Michael Ashe ,  James Enrico Sabatini

IPC: A61B5/1455 ,  A61B5/00 ,  A61B5/029 ,  A61B5/08 ,  H01L25/075 ,  H05K1/18 ,  H01L33/62

CPC classification number: A61B5/14552 ,  A61B5/0002 ,  A61B5/029 ,  A61B5/0816 ,  A61B5/6826 ,  A61B5/742 ,  A61B2562/0238 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/222 ,  A61B2562/227 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/181 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10151 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.

公开(公告)号：US20160220158A1

公开(公告)日：2016-08-04

申请号：US15092655

申请日：2016-04-07

Applicant: General Electric Company

Inventor： Jason Harris Karp ,  Christopher James Kapusta ,  Paul Jeffrey Gillespie ,  Christopher Fred Keimel ,  Jeffrey Michael Ashe ,  James Enrico Sabatini

IPC: A61B5/1455 ,  A61B5/00

CPC classification number: A61B5/14552 ,  A61B5/0002 ,  A61B5/029 ,  A61B5/0816 ,  A61B5/6826 ,  A61B5/742 ,  A61B2562/0238 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/222 ,  A61B2562/227 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/181 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10151 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.

Abstract translation: 发射体阵列包括具有第一和第二侧的器件衬底，设置在器件衬底的第一侧上的导热层和布置在器件衬底的第二侧的第一多个部分上的互连层。 发射器的阵列还包括设置在器件衬底的第二多个部分中的多个发射器，其中多个发射极电耦合到导热层和导电层。 此外，发射器的阵列包括多个引线键合触点，其被配置为将互连层的一部分电耦合到多个发射体中的对应的发射极，以及多个封装，其中多个封装的一个或多个封装是 设置在所述多个引线接触件的对应的引线接合的至少一部分上。

公开(公告)号：US20150133753A1

公开(公告)日：2015-05-14

申请号：US14079660

申请日：2013-11-14

Applicant: General Electric Company

Inventor： Jason Harris Karp ,  Christopher James Kapusta ,  Paul Jeffrey Gillespie ,  Christopher Fred Keimel ,  Jeffrey Michael Ashe ,  James Enrico Sabatini

IPC: A61B5/1455 ,  H05K3/32

CPC classification number: A61B5/14552 ,  A61B5/0002 ,  A61B5/029 ,  A61B5/0816 ,  A61B5/6826 ,  A61B5/742 ,  A61B2562/0238 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/222 ,  A61B2562/227 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/181 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10151 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.

Abstract translation: 发射体阵列包括具有第一和第二侧的器件衬底，设置在器件衬底的第一侧上的导热层和布置在器件衬底的第二侧的第一多个部分上的互连层。 发射器的阵列还包括设置在器件衬底的第二多个部分中的多个发射器，其中多个发射极电耦合到导热层和导电层。 此外，发射器的阵列包括多个引线键合触点，其被配置为将互连层的一部分电耦合到多个发射体中的对应的发射极，以及多个封装，其中多个封装的一个或多个封装是 设置在所述多个引线接触件的对应的引线接合的至少一部分上。