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公开(公告)号：US10561837B2
公开(公告)日：2020-02-18
申请号：US16391801
申请日：2019-04-23
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Thomas Marzano , Keith W. Seitz , Marc Gregory Martino
IPC: A61N1/08 , H01G4/005 , H01G4/30 , H01G4/35 , A61N1/375 , H01G4/12 , H03H1/00 , A61N1/37 , H01G4/236
Abstract: A filtered feedthrough assembly for an active implantable medical device (AIMD) includes an insulator hermetically sealed to an opening of an electrically conductive ferrule. A ceramic reinforced metal composite of platinum and alumina (CRMC) material is disposed in an insulator via hole surrounding a substantially pure platinum fill. A capacitor disposed on the insulator device side has a capacitor dielectric with a dielectric constant k that is greater than 0 and less than 1000. Coming from the body fluid side to the device side of the AIMD, the capacitor is the first filter capacitor electrically connected to the substantially pure platinum fill. An active electrical connection electrically connects the substantially pure platinum fill to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and subsequently to the housing of the AIMD.
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22.发明申请公开(公告)号：US20190214605A1
公开(公告)日：2019-07-11
申请号：US16240173
申请日：2019-01-04
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Robert S. Rubino , Gary Freitag , David Dianetti , Todd C. Sutay , Ho-Chul Yun , Thomas Marzano , Brian P. Hohl
IPC: H01M2/02 , H01M2/04 , H01M4/131 , H01M10/0525
CPC classification number: H01M2/021 , H01M2/026 , H01M2/0277 , H01M2/0426 , H01M2/065
Abstract: A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are metal feedthroughs, such as of gold, and are formed by brazing gold into openings machined into one or both ceramic casing halves. The two ceramic casing halves are separated from each other by a metal interlayer, such as of gold, bonded to a thin film metallization adhesion layer, such as of titanium, that contacts an edge periphery of each ceramic casing half. A solid electrolyte (LixPOyNz) is used to activate the electrode assembly.
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公开(公告)号：US20190192862A1
公开(公告)日：2019-06-27
申请号：US16291356
申请日：2019-03-04
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel , Marc Gregory Martino
CPC classification number: A61N1/3754 , H01G4/012 , H01G4/018 , H01G4/224 , H01G4/236 , H01G4/35 , H01G4/40 , H05K1/181 , H05K2201/10015
Abstract: A feedthrough separates a body fluid side from a device side. A passageway is disposed through the feedthrough. A body fluid side leadwire extends from a first end disposed inside the passageway to a second end on the body fluid side. A device side leadwire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side leadwire is hermetically sealed to the feedthrough body and is not of the same material as the device side leadwire. A circuit board has an active via hole with a second end of the second leadwire residing therein. The circuit board has an active circuit trace that is electrically connectable to electronic circuits housed in an AIMD, and a circuit board ground metallization. An active electrical path extends from the first leadwire to the second leadwire to an MLCC chip capacitor mounted on the circuit board and to the circuit board active circuit trace, and a ground electrical path extends from the MLCC chip capacitor to the circuit board ground metallization and then to the ferrule.
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24.发明授权公开(公告)号：US09993650B2
公开(公告)日：2018-06-12
申请号：US15368722
申请日：2016-12-05
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Robert A. Stevenson , Christine A. Frysz , Thomas Marzano
IPC: A61N1/00 , A61N1/375 , A61N1/05 , H01G4/35 , H01G2/10 , C22C29/12 , H01R43/00 , A61N1/08 , H01G4/005 , H01G4/12 , H01G4/40 , H02G3/22 , B23K35/30 , H01G4/30 , A61N1/372
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: A filter feedthrough is described. The filter feedthrough includes a conductive ferrule supporting a dielectric substrate having a body fluid side and a device side. At least one via hole provided with a conductive fill is disposed through the dielectric substrate from the body fluid side to the device side. At least one MLCC-type capacitor is supported by the dielectric substrate. A first circuit trace couples from an active metallization connected to the active electrode plates of the capacitor to conductive fill in the via hole. A second circuit trace couples from the ground electrode plate of the capacitor to a metallization contacting an outer surface of the dielectric substrate. Then, a conductive material couples from the ground metallization to the ferrule to thereby electrically couple the capacitor to the ferrule.
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25.发明申请公开(公告)号：US20180126176A1
公开(公告)日：2018-05-10
申请号：US15797278
申请日：2017-10-30
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel
CPC classification number: A61N1/3754 , H01B17/303
Abstract: A feedthrough subassembly is attachable to an active implantable medical device. A via hole is disposed through an electrically insulative and biocompatible feedthrough body extending from a body fluid side to a device side. A composite fill partially disposed within the via hole extends between a first and a second composite fill end. The first composite fill end is disposed at or near the device side of the feedthrough body. The second composite fill end is disposed within the via hole recessed from the body fluid side. The composite fill includes a first portion of a ceramic reinforced metal composite including alumina and platinum and a second portion of a substantially pure platinum fill and/or a platinum wire. A via hole metallization covers a portion of the second composite fill end. A metallic leadwire is at least partially disposed within the via hole and gold brazed via hole metallization.
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Patent Agency Ranking
公开(公告)号：US20180126175A1
公开(公告)日：2018-05-10
申请号：US15603521
申请日：2017-05-24
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel , Marc Gregory Martino
CPC classification number: A61N1/3754 , H01G4/012 , H01G4/018 , H01G4/224 , H01G4/236 , H01G4/35 , H05K1/181 , H05K2201/10015
Abstract: An insulative feedthrough attachable to an active implantable medical device includes a feedthrough body having a material which is both electrically insulative, biocompatible and separates a body fluid side from a device side. A passageway is disposed through the feedthrough body. A composite conductor is disposed within the passageway and has a body fluid side metallic wire electrically conductive to a device side metallic wire. The body fluid side metallic wire extends from a first end disposed inside the passageway to a second end on the body fluid side. The device side metallic wire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side metallic wire is hermetically sealed to the feedthrough body. The body fluid side metallic wire is biocompatible and is not the same material as the device side metallic wire.
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公开(公告)号：US20180008822A1
公开(公告)日：2018-01-11
申请号：US15704657
申请日：2017-09-14
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Robert Shawn Johnson , Warren S. Dabney , Thomas Marzano , Richard L. Brendel , Christopher Michael Williams , Holly Noelle Moschiano , Keith W. Seitz , John E. Roberts
CPC classification number: A61N1/08 , A61N1/086 , A61N1/3718 , A61N1/3754 , A61N1/3758 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H03H1/0007
Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.
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公开(公告)号：US09764129B2
公开(公告)日：2017-09-19
申请号：US15163241
申请日：2016-05-24
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Robert Shawn Johnson , Warren S. Dabney , Thomas Marzano , Richard L. Brendel , Christopher Michael Williams , Holly Noelle Moschiano , Keith W. Seitz , John E. Roberts
CPC classification number: A61N1/08 , A61N1/086 , A61N1/3718 , A61N1/3754 , A61N1/3758 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H03H1/0007
Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.
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29.发明申请公开(公告)号：US20170080239A1
公开(公告)日：2017-03-23
申请号：US15368722
申请日：2016-12-05
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Robert A. Stevenson , Christine A. Frysz , Thomas Marzano
IPC: A61N1/375 , A61N1/05 , C22C29/12 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , A61N1/08 , B23K35/30
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: A filter feedthrough is described. The filter feedthrough includes a conductive ferrule supporting a dielectric substrate having a body fluid side and a device side. At least one via hole provided with a conductive fill is disposed through the dielectric substrate from the body fluid side to the device side. At least one MLCC-type capacitor is supported by the dielectric substrate. A first circuit trace couples from an active metallization connected to the active electrode plates of the capacitor to conductive fill in the via hole. A second circuit trace couples from the ground electrode plate of the capacitor to a metallization contacting an outer surface of the dielectric substrate. Then, a conductive material couples from the ground metallization to the ferrule to thereby electrically couple the capacitor to the ferrule.
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公开(公告)号：US09511220B2
公开(公告)日：2016-12-06
申请号：US14600401
申请日：2015-01-20
Applicant: Greatbatch Ltd.
Inventor： Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Richard L. Brendel , Jason Woods , Steven W. Winn , Dominick J. Frustaci , Bruehl E. Truex , Donald H. Hickel, Jr.
IPC: A61N1/00 , A61N1/08 , A61N1/05 , H01G4/35 , H01G2/10 , H01R43/00 , H01G4/005 , H01G4/12 , H01G4/40 , H02G3/22 , A61N1/372 , A61N1/375 , C22C29/12
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
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