公开(公告)号：US12064639B2

公开(公告)日：2024-08-20

申请号：US17165500

申请日：2021-02-02

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Brian P Hohl ,  Marc Gregory Martino

IPC: A61N1/375 ,  H01G4/008 ,  H01G4/12 ,  H01G4/236 ,  H01G4/35

CPC classification number: A61N1/3754 ,  H01G4/008 ,  H01G4/1209 ,  H01G4/236 ,  H01G4/35

Abstract: A feedthrough for an AIMD includes a ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A circuit board disposed adjacent to the insulator device side has a ground plate or ground trace electrically connected to a circuit board ground conductive pathway disposed in a circuit board ground via hole. An anisotropic conductive layer disposed between the circuit board and the insulator device side has an electrically insulative matrix supporting a plurality of electrically conductive particles. The anisotropic conductive layer has a first thickness where at least one first electrically conductive particle is longitudinally aligned and in electrical contact with the ferrule and the circuit board ground conductive pathway electrically connected to the at least one circuit board ground plate or ground trace. The anisotropic conductive layer has a second, greater thickness where the ferrule and the circuit board ground conductive pathway are not longitudinally aligned, and no electrically conductive particles are in electrical contact with the ferrule and the circuit board ground conductive pathway.

公开(公告)号：US20240039206A1

公开(公告)日：2024-02-01

申请号：US18376687

申请日：2023-10-04

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Keith W. Seitz ,  Christine A. Frysz ,  Robert A. Stevenson

IPC: H01R13/52 ,  H01R13/719 ,  H01R13/426 ,  H01G4/35 ,  A61N1/375

CPC classification number: H01R13/5224 ,  H01R13/719 ,  H01R13/426 ,  H01G4/35 ,  H01R13/521 ,  A61N1/3754 ,  Y10T29/49204

Abstract: A circuit board for an active implantable medical device (AIMD) has a circuit board land connected to at least one electrical circuit. A hermetic feedthrough terminal pin connector for the AIMD includes an electrical insulator hermetically sealed to an opening of an electrically conductive ferrule. A terminal pin of the feedthrough extends outwardly beyond the insulator. A terminal pin connector has an electrically conductive connector housing that is connected to the circuit board land by an electrical connection material. At least one electrically conductive prong supported by the connector housing contacts and compresses against the feedthrough terminal pin to thereby make a removable electrical connection between the circuit board and the terminal pin. An insulative material loaded with electrically insulative nanoparticles coats at least a portion of the sidewall of the connector housing and the electrical connection material connecting the connector housing to the circuit board land.

公开(公告)号：US11202916B2

公开(公告)日：2021-12-21

申请号：US16656775

申请日：2019-10-18

Applicant: Greatbatch Ltd.

Inventor： Dominick J. Frustaci ,  Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods

IPC: A61N1/375 ,  H01G4/35 ,  H01R13/7195 ,  H01G2/22 ,  H01G2/10 ,  A61N1/08 ,  H01G4/40 ,  A61N1/05 ,  H05K1/02

Abstract: A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway. The circuit board further comprises a ground electrode plate that is connected to the ground termination of the chip capacitor and to the ferrule.

公开(公告)号：US10561837B2

公开(公告)日：2020-02-18

申请号：US16391801

申请日：2019-04-23

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Keith W. Seitz ,  Marc Gregory Martino

IPC: A61N1/08 ,  H01G4/005 ,  H01G4/30 ,  H01G4/35 ,  A61N1/375 ,  H01G4/12 ,  H03H1/00 ,  A61N1/37 ,  H01G4/236

Abstract: A filtered feedthrough assembly for an active implantable medical device (AIMD) includes an insulator hermetically sealed to an opening of an electrically conductive ferrule. A ceramic reinforced metal composite of platinum and alumina (CRMC) material is disposed in an insulator via hole surrounding a substantially pure platinum fill. A capacitor disposed on the insulator device side has a capacitor dielectric with a dielectric constant k that is greater than 0 and less than 1000. Coming from the body fluid side to the device side of the AIMD, the capacitor is the first filter capacitor electrically connected to the substantially pure platinum fill. An active electrical connection electrically connects the substantially pure platinum fill to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and subsequently to the housing of the AIMD.

公开(公告)号：US20190214605A1

公开(公告)日：2019-07-11

申请号：US16240173

申请日：2019-01-04

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Robert S. Rubino ,  Gary Freitag ,  David Dianetti ,  Todd C. Sutay ,  Ho-Chul Yun ,  Thomas Marzano ,  Brian P. Hohl

IPC: H01M2/02 ,  H01M2/04 ,  H01M4/131 ,  H01M10/0525

CPC classification number: H01M2/021 ,  H01M2/026 ,  H01M2/0277 ,  H01M2/0426 ,  H01M2/065

Abstract: A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are metal feedthroughs, such as of gold, and are formed by brazing gold into openings machined into one or both ceramic casing halves. The two ceramic casing halves are separated from each other by a metal interlayer, such as of gold, bonded to a thin film metallization adhesion layer, such as of titanium, that contacts an edge periphery of each ceramic casing half. A solid electrolyte (LixPOyNz) is used to activate the electrode assembly.

公开(公告)号：US20190192862A1

公开(公告)日：2019-06-27

申请号：US16291356

申请日：2019-03-04

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods ,  Richard L. Brendel ,  Marc Gregory Martino

IPC: A61N1/375 ,  H01G4/224 ,  H01G4/012 ,  H01G4/018 ,  H05K1/18 ,  H01G4/236 ,  H01G4/35

CPC classification number: A61N1/3754 ,  H01G4/012 ,  H01G4/018 ,  H01G4/224 ,  H01G4/236 ,  H01G4/35 ,  H01G4/40 ,  H05K1/181 ,  H05K2201/10015

Abstract: A feedthrough separates a body fluid side from a device side. A passageway is disposed through the feedthrough. A body fluid side leadwire extends from a first end disposed inside the passageway to a second end on the body fluid side. A device side leadwire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side leadwire is hermetically sealed to the feedthrough body and is not of the same material as the device side leadwire. A circuit board has an active via hole with a second end of the second leadwire residing therein. The circuit board has an active circuit trace that is electrically connectable to electronic circuits housed in an AIMD, and a circuit board ground metallization. An active electrical path extends from the first leadwire to the second leadwire to an MLCC chip capacitor mounted on the circuit board and to the circuit board active circuit trace, and a ground electrical path extends from the MLCC chip capacitor to the circuit board ground metallization and then to the ferrule.

公开(公告)号：US09993650B2

公开(公告)日：2018-06-12

申请号：US15368722

申请日：2016-12-05

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano

IPC: A61N1/00 ,  A61N1/375 ,  A61N1/05 ,  H01G4/35 ,  H01G2/10 ,  C22C29/12 ,  H01R43/00 ,  A61N1/08 ,  H01G4/005 ,  H01G4/12 ,  H01G4/40 ,  H02G3/22 ,  B23K35/30 ,  H01G4/30 ,  A61N1/372

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A filter feedthrough is described. The filter feedthrough includes a conductive ferrule supporting a dielectric substrate having a body fluid side and a device side. At least one via hole provided with a conductive fill is disposed through the dielectric substrate from the body fluid side to the device side. At least one MLCC-type capacitor is supported by the dielectric substrate. A first circuit trace couples from an active metallization connected to the active electrode plates of the capacitor to conductive fill in the via hole. A second circuit trace couples from the ground electrode plate of the capacitor to a metallization contacting an outer surface of the dielectric substrate. Then, a conductive material couples from the ground metallization to the ferrule to thereby electrically couple the capacitor to the ferrule.

公开(公告)号：US20180126176A1

公开(公告)日：2018-05-10

申请号：US15797278

申请日：2017-10-30

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods ,  Richard L. Brendel

IPC: A61N1/375 ,  H01B17/30

CPC classification number: A61N1/3754 ,  H01B17/303

Abstract: A feedthrough subassembly is attachable to an active implantable medical device. A via hole is disposed through an electrically insulative and biocompatible feedthrough body extending from a body fluid side to a device side. A composite fill partially disposed within the via hole extends between a first and a second composite fill end. The first composite fill end is disposed at or near the device side of the feedthrough body. The second composite fill end is disposed within the via hole recessed from the body fluid side. The composite fill includes a first portion of a ceramic reinforced metal composite including alumina and platinum and a second portion of a substantially pure platinum fill and/or a platinum wire. A via hole metallization covers a portion of the second composite fill end. A metallic leadwire is at least partially disposed within the via hole and gold brazed via hole metallization.

公开(公告)号：US20180126175A1

公开(公告)日：2018-05-10

申请号：US15603521

申请日：2017-05-24

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Thomas Marzano ,  Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods ,  Richard L. Brendel ,  Marc Gregory Martino

IPC: A61N1/375 ,  H01G4/35 ,  H01G4/018 ,  H01G4/236 ,  H01G4/012 ,  H01G4/224 ,  H05K1/18

CPC classification number: A61N1/3754 ,  H01G4/012 ,  H01G4/018 ,  H01G4/224 ,  H01G4/236 ,  H01G4/35 ,  H05K1/181 ,  H05K2201/10015

Abstract: An insulative feedthrough attachable to an active implantable medical device includes a feedthrough body having a material which is both electrically insulative, biocompatible and separates a body fluid side from a device side. A passageway is disposed through the feedthrough body. A composite conductor is disposed within the passageway and has a body fluid side metallic wire electrically conductive to a device side metallic wire. The body fluid side metallic wire extends from a first end disposed inside the passageway to a second end on the body fluid side. The device side metallic wire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side metallic wire is hermetically sealed to the feedthrough body. The body fluid side metallic wire is biocompatible and is not the same material as the device side metallic wire.

公开(公告)号：US20180008822A1

公开(公告)日：2018-01-11

申请号：US15704657

申请日：2017-09-14

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Robert Shawn Johnson ,  Warren S. Dabney ,  Thomas Marzano ,  Richard L. Brendel ,  Christopher Michael Williams ,  Holly Noelle Moschiano ,  Keith W. Seitz ,  John E. Roberts

IPC: A61N1/08 ,  A61N1/37 ,  H01G4/30 ,  H01G4/12 ,  A61N1/375 ,  H01G4/005 ,  H01G4/35 ,  H03H1/00

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/3754 ,  A61N1/3758 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H03H1/0007

Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.