摘要:
A positive electrode for a rechargeable lithium battery includes a first positive active material represented by LiaNibCOcMdO2, and a second positive active material represented by LieNifCOgMnhO2. M is selected from Al, B, Cr, Fe, Mg, Sr, and V, 0.95≦a≦1.1, 0.5≦b≦0.9, 0≦c≦0.3, 0≦d≦0.1, 0.95≦e≦1.1, 0.33≦f≦0.5, 0.15≦g≦0.33, and 0.3≦h≦0.35. A rechargeable lithium battery includes the positive electrode, a negative electrode and an electrolyte.
摘要:
Provided are a Vestigial Side Band (VSB) Digital Television (DTV) transmitter and receiver based on the Advanced Television System Committee (ATSC) A/53, and a method thereof. The present invention provides 8-VSB DTV transmitter and receiver that can improve reception performance of the receiver by transmitting and receiving robust data mixed with P-2VSB, E-4VSB, and/or E-8VSB. The DTV transmitter includes an input means for receiving a digital video data stream including normal data and robust data; an encoding means for coding the digital video data stream into data symbols; and a transmitting means for modulating and transmitting an output signal of the encoding means, wherein the encoding means performs trellis coding on the robust data by sequentially applying a plurality of trellis coding methods.
摘要:
In a layout structure of a plurality of metal oxide semiconductor (MOS) transistors, the layout structure may include a first group of MOS transistors having first drain regions and first source regions that are individually allocated to a group active region that is isolated from all sides by a trench isolation, and a second group of MOS transistors having second drain regions and second source regions allocated to the group active region. The second group is disposed between the first group and an edge of the group active region. One or both of the first drain regions and first source regions are not in contact with an edge of the trench isolation in a length direction of a finger-type gate electrode.
摘要:
A module for transferring a PCB including a first transfer body that is translatable along a first moving path to transfer a first PCB and a second transfer body that is translatable along a second moving path to transfer a second PCB with the second transfer body being formed with an aperture therein. Additionally the first transfer body is adjustable from a first position where the first transfer body does not fit through the aperture to a second position wherein the first transfer body can fit within the aperture.
摘要:
An HSDPA (High Speed Downlink Packet Access) communication system is disclosed. A Node B reduces a size of a field transmitting TBS (Transport Block Set) information for user data based on an MCS (Modulation and Coding Scheme) level assigned to the user data and the number of codes assigned to the user data, before transmission, instead of transmitting an intact size of the actually transmitted transport block for the user data, among TFRI (Transport Format Resource Information) transmitted to a UE (User Equipment) over a shared control channel.
摘要:
The present invention relates to emitting compounds for organic electroluminescent device, particularly to phenyl pyridine-iridium metal complex compounds represented by the following formula (1): wherein R1 to R8, A1 to A3, and Py are as defined in the specification. In addition, the present invention relates to an organic electroluminescent device comprising the above material which has high luminescence efficiency, enhanced operating life time, and high purity of red chromaticity.
摘要翻译:本发明涉及用于有机电致发光器件的发光化合物,特别涉及由下式(1)表示的苯基吡啶 - 铱金属络合物:其中R 1至R 8 - A 1,A 3,和Py如说明书中所定义。 此外,本发明涉及包含上述材料的有机电致发光器件,其具有高发光效率,增加的使用寿命和高纯度的红色度。
摘要:
A signature circuit in a semiconductor chip includes a signature program circuit configured to be programmed with signature information and to output a signature signal in response to the signature information; a signature output circuit configured to block the signature signal output by the signature program circuit during operation in a normal mode, and configured to pass the signature signal during operation in a test mode; and a pad-driving transistor directly coupled to the pad, configured to drive the pad during operation in the normal mode in response to an operation command, and configured to drive the pad during operation in the test mode in response to the signature signal output by the signature output circuit. The signature circuit outputs the signature information through a transistor for adjusting impedance to reduce a chip size by omitting an additional logic circuit for the signature circuit.
摘要:
Method and apparatus for use, e.g., with Synchronous Dynamic Random Access Memory (SDRAM) circuits are disclosed. In one described embodiment, three metal layers are deposited and patterned in turn overlying a memory array portion of an SDRAM. Relatively wide power conductors are routed on a third metal layer, allowing power conductors to be reduced in size, or in some cases eliminated, on first and second metal layers. The relatively wide power conductors thus can provide a more stable power supply to the memory array, and also free some space on first and/or second metal for routing of additional and/or more widely spaced signal conductors. Other embodiments are described and claimed.
摘要:
An address buffer circuit for a semiconductor memory device wherein an address buffer is enabled (to output an internal address signal) in response to a first level of a control signal and, but is disabled in response to a second level of the control signal. An address buffer control unit generates the control signal at the second level in ‘no operation’ state (NOP command) in which the semiconductor memory device does not perform data accessing operations and generates the control signal at the first level while the semiconductor memory device performs data accessing operations, thereby reducing or minimizing the output of an internal address buffered and output by the address buffer at and thus reducing power consumption during no-operation states of the semiconductor memory device.
摘要:
The present invention relates to a column redundancy circuit in semiconductor memories which improves yields by means of substituting defective cells with redundant memory cells provided that defective memory cells are detected. The present invention of a redundancy circuit in semiconductor memories having a first memory cell array and a second memory cell arrays with an Y-decoder includes a first row redundancy circuit receiving a row address signal wherein the first row redundancy circuit outputs a first MAT selection signal for repairing a word line in the first memory cell array, a second row redundancy circuit receiving the row address signal wherein the second row to redundancy circuit outputs a second MAT selection signal for repairing a word line in the second memory cell array, a redundancy circuit controller generating a first MAT selection enable signal and a second MAT selection enable signal wherein the first MAT selection enable signal and the second MAT selection enable signal are complementary each other, a MAT selection signal controller receiving the first MAT selection signal and the second MAT selection signal wherein the MAT selection signal controller outputs one of the first MAT selection signal and the second MAT selection signal in accordance with the first MAT selection enable signal and the second MAT selection enable signal, respectively, a column redundancy circuit receiving a column address signal and the MAT selection signal which is outputted from the MAT selection signal controller wherein the column redundancy circuit outputs a repairing decision signal, a first MAT redundant signal and a second MAT redundant signal, and an Y-decoder receiving the first MAT redundant signal and the second MAT redundant signal wherein the Y-decoder outputs a normal column selection signal or a redundant column selection signal under a condition of the repairing decision signal.