摘要:
In a layout structure of a plurality of metal oxide semiconductor (MOS) transistors, the layout structure may include a first group of MOS transistors having first drain regions and first source regions that are individually allocated to a group active region that is isolated from all sides by a trench isolation, and a second group of MOS transistors having second drain regions and second source regions allocated to the group active region. The second group is disposed between the first group and an edge of the group active region. One or both of the first drain regions and first source regions are not in contact with an edge of the trench isolation in a length direction of a finger-type gate electrode.
摘要:
In a layout structure of a plurality of metal oxide semiconductor (MOS) transistors, the layout structure may include a first group of MOS transistors having first drain regions and first source regions that are individually allocated to a group active region that is isolated from all sides by a trench isolation, and a second group of MOS transistors having second drain regions and second source regions allocated to the group active region. The second group is disposed between the first group and an edge of the group active region. One or both of the first drain regions and first source regions are not in contact with an edge of the trench isolation in a length direction of a finger-type gate electrode.
摘要:
A stacked memory cell for use in a high-density static random access memory is provided that includes first and second pull-down transistors formed in a first layer, a pass transistor connected between a gate of the second pull-down transistor and a bit line and formed in the first layer and a first and second pull-up transistors formed in a second layer located above the first layer and connected with the first and second pull-down transistors respectively to form an inverter latch. With the construction of a stacked memory cell having a lone pass transistor, cell size is reduced compared to a conventional six-transistor cell, and driving performance of the pass transistor can be improved.
摘要:
A stacked memory cell for use in a high-density static random access memory is provided that includes first and second pull-down transistors formed in a first layer, a pass transistor connected between a gate of the second pull-down transistor and a bit line and formed in the first layer and a first and second pull-up transistors formed in a second layer located above the first layer and connected with the first and second pull-down transistors respectively to form an inverter latch. With the construction of a stacked memory cell having a lone pass transistor, cell size is reduced compared to a conventional six-transistor cell, and driving performance of the pass transistor can be improved.
摘要:
An optical proximity correction (OPC) verifying method including checking a first location of a first pattern in a layout of a stacked memory device, calculating a shift value of the first pattern according to the first location, obtaining a difference value between the first location and a second location of a second pattern formed through an OPC with respect to the first pattern, and determining whether the OPC is to be performed again, based on the shift value and the difference value.
摘要:
A sub-word line driver includes a substrate, a plurality of gate lines and at least one gate tab. The substrate includes a plurality of isolation areas and a plurality of active areas, where the two active areas are separated by each isolation area, and the isolation areas and the active areas are extended in a first direction and are arranged in a second direction perpendicular to the first direction. The plurality of gate lines are formed on the substrate, where the gate lines are extended in a second direction and are arranged in the first direction. The at least one gate tab is formed on the substrate, where the at least one gate tab is extended in the first direction to cover the isolation area. Incorrect operation of the sub-word line driver may be prevented, and a power consumption of the sub-word line driver may be reduced.
摘要:
Example embodiments relate to a semiconductor memory device, for example, a semiconductor memory device including an efficient layout circuit and method thereof. The method may include sharing a first active area between a first precharger and a second precharger and sharing a second active area between a third precharger and a fourth precharger. The semiconductor memory device may include a level shifter configured to receive a first precharge control signal and boost a logic high level of the first precharge control signal to an external power supply voltage level to output a boosted first precharge control signal. The semiconductor memory device may further include first, second, third and fourth prechargers. The first and third prechargers may be configured to precharge data signals transmitted to a first and second pair of local input/output data lines to the first precharge voltage in response to the boosted first precharge control signal during a data read operation.
摘要:
A line layout structure of semiconductor memory device comprises first metal wire lines forming a bit line coupled to a memory cell, second metal wire lines disposed substantially orthogonal to the first metal wire lines and over the first metal wire lines, the second metal wire lines forming a section word line electrically coupled to the memory cell, and third metal wire lines disposed substantially parallel to the second metal wire lines and over the second metal wire lines, the third metal wire lines forming a first power line or signal line.
摘要:
The layout structure of a dual port SRAM (Static Random Access Memory) includes a read bit line adjacently positioned to a complementary read bit line, and a write bit line positioned adjacent to a complementary write bit line, to provide a shield between the read and write lines for preventing cross-talk caused during read and write operations.
摘要:
The layout structure of a dual port SRAM (Static Random Access Memory) includes a read bit line adjacently positioned to a complementary read bit line, and a write bit line positioned adjacent to a complementary write bit line, to provide a shield between the read and write lines for preventing cross-talk caused during read and write operations.