IMMERSION COOLED MOTOR CONTROLLER
    23.
    发明申请
    IMMERSION COOLED MOTOR CONTROLLER 有权
    倾斜冷却电机控制器

    公开(公告)号:US20140355212A1

    公开(公告)日:2014-12-04

    申请号:US13903127

    申请日:2013-05-28

    CPC classification number: H05K7/20236 H05K7/203 H05K7/20936

    Abstract: An immersion cooled motor controller assembly is disclosed that includes a sealed housing, a fluorocarbon cooling liquid contained in the sealed housing, and an AC/AC motor controller disposed in the sealed housing and submerged in the fluorocarbon cooling liquid, wherein the AC/AC motor controller includes a power board module adapted and configured to operate at power levels greater than 30 kW.

    Abstract translation: 公开了一种浸没冷却电动机控制器组件,其包括密封壳体,容纳在密封壳体中的碳氟化合物冷却液体和设置在密封壳体中并浸没在碳氟化合物冷却液体中的AC / AC电动机控制器,其中AC / AC电动机 控制器包括适于和配置为在功率水平大于30kW的情况下工作的电源板模块。

    Immersion cooling systems and methods
    24.
    发明授权

    公开(公告)号:US10674641B2

    公开(公告)日:2020-06-02

    申请号:US15090049

    申请日:2016-04-04

    Abstract: An electronics cooling arrangement includes a housing, an electronic device disposed within the housing, and a solid-liquid phase change material disposed within the housing and is in thermal communication with the electronic device to absorb heat generated by the electronic device. A method of cooling an electronic device and a vehicular electronics cooling system are also described.

    Immersion cooling systems and methods

    公开(公告)号:US10130008B2

    公开(公告)日:2018-11-13

    申请号:US15090236

    申请日:2016-04-04

    Abstract: An immersion cooled electronic arrangement includes a sealed housing, a coolant contained within the housing, and an electronic device submerged within the coolant. An agitator is disposed within the housing to control passive heat transfer between the electronic device and the coolant. An immersion cooling system and related method are also described.

    THERMAL MANAGEMENT SYSTEMS FOR ELECTRONICS
    28.
    发明申请

    公开(公告)号:US20180020573A1

    公开(公告)日:2018-01-18

    申请号:US15213212

    申请日:2016-07-18

    Abstract: A refrigeration system for electronics includes a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system and a condenser disposed downstream of the compressor on the main line. An evaporator line is in fluid communication with the main line downstream of the condenser and has an evaporator configured to receive heat into the refrigerant from an external heat source. The system also includes an immersion line in fluid communication with main line downstream of the condenser. The immersion line includes an immersion cooling container that is configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.

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