公开(公告)号：US20190212073A1

公开(公告)日：2019-07-11

申请号：US16358262

申请日：2019-03-19

Applicant: HAMILTON SUNDSTRAND CORPORATION

Inventor： Scott R. Bouras

IPC: F28D20/02 ,  F28F3/02

CPC classification number: F28D20/023 ,  F28F3/022 ,  F28F2215/04

Abstract: A pin fin heat sink includes a plurality of pin fins extending from a base plate, at least one of the plurality of pin fins defining a hollow portion therein. The pin fin heat sink also includes an annular ring of metal foam material disposed within the hollow portion, the annular ring of metal foam material having a radially outer surface in direct contact with an inner diameter of the pin fin, the annular ring of metal foam material defining a central cavity. The pin fin heat sink further includes a phase change material disposed within the central cavity.

公开(公告)号：US12144156B2

公开(公告)日：2024-11-12

申请号：US17744668

申请日：2022-05-14

Applicant: Hamilton Sundstrand Corporation

Inventor： Debabrata Pal ,  Eric A. Carter ,  Scott R. Bouras

IPC: H05K7/20 ,  H05K5/06

Abstract: In accordance with at least one aspect of this disclosure, a power distribution system having integrated cooling includes a chassis defining an interior cavity, an electronics bus structure housed within the interior cavity, and an electrical contactor operatively connected to the electronics bus structure to receive a voltage therefrom. One or more heat dissipation fins can be included extending away from the chassis and configured to dissipate heat from the electronics bus structure to an ambient environment external to the chassis. In embodiments, the electronics bus structure can be sealed within the interior cavity.

公开(公告)号：US20230371216A1

公开(公告)日：2023-11-16

申请号：US17744668

申请日：2022-05-14

Applicant: Hamilton Sundstrand Corporation

Inventor： Debabrata Pal ,  Eric A. Carter ,  Scott R. Bouras

IPC: H05K7/20 ,  H05K5/06

CPC classification number: H05K7/209 ,  H05K7/20409 ,  H05K5/06

Abstract: In accordance with at least one aspect of this disclosure, a power distribution system having integrated cooling includes a chassis defining an interior cavity, an electronics bus structure housed within the interior cavity, and an electrical contactor operatively connected to the electronics bus structure to receive a voltage therefrom. One or more heat dissipation fins can be included extending away from the chassis and configured to dissipate heat from the electronics bus structure to an ambient environment external to the chassis. In embodiments, the electronics bus structure can be sealed within the interior cavity.

公开(公告)号：US20190267683A1

公开(公告)日：2019-08-29

申请号：US16411928

申请日：2019-05-14

Applicant: Hamilton Sundstrand Corporation

Inventor： Charles Patrick Shepard ,  Kris H. Campbell ,  Scott R. Bouras ,  Shin Katsumata

IPC: H01M10/613 ,  H01M10/6569 ,  H01M10/6568 ,  H01M10/615 ,  H01M10/6567 ,  H01M10/63 ,  H01M10/6554

Abstract: An energy storage system includes a sealed housing defining an interior space and a plurality of cells arranged within the interior space of the housing. A cooling liquid submerges each of the cells. The cooling system is positioned within the sealed housing configured to actively and passively cool and heat each of the cells.

公开(公告)号：US20170321973A1

公开(公告)日：2017-11-09

申请号：US15149878

申请日：2016-05-09

Applicant: Hamilton Sundstrand Corporation

Inventor： Kris H. Campbell ,  Scott R. Bouras

IPC: F28F13/08

CPC classification number: F28F13/08 ,  F25B39/04 ,  F28D9/0031 ,  F28D2021/0021 ,  F28D2021/0028 ,  F28D2021/0063 ,  F28D2021/007 ,  F28F3/02 ,  F28F3/12 ,  F28F2215/04 ,  F28F2275/04 ,  H05K7/20318

Abstract: A condensing heat exchanger to exchange heat from a hot flow to a cold flow includes a hot flow side to receive the hot flow, the hot flow side including a hot flow inlet disposed on a hot flow inlet side and a hot flow outlet disposed on a hot flow outlet side, wherein a hot flow side cross section decreases from the hot flow inlet side to the hot flow outlet side, a cold flow side to receive the cold flow, and an interface disposed between the hot flow side and the cold flow side to allow thermal communication therebetween.

公开(公告)号：US09312202B2

公开(公告)日：2016-04-12

申请号：US14692174

申请日：2015-04-21

Applicant: Hamilton Sundstrand Corporation

Inventor： Scott R. Bouras

IPC: H01L21/302 ,  H01L23/34 ,  H01L23/473 ,  H01L23/367 ,  H01L25/16 ,  H01L25/00 ,  H01L23/50 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/473 ,  H01L21/302 ,  H01L21/4803 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/50 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/162 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00

Abstract: A semiconductor substrate for use in an integrated circuit, the semiconductor substrate including a channel defined on a surface of the substrate. The channel includes a first wall, a second wall, and a third wall. The first wall is recessed from the surface. The second wall extends from the surface to the first wall. The third wall extends from the surface to the first wall and faces the second wall across the channel. At least one of the second wall and the third wall includes a plurality of structures projecting into the channel from the second wall or the third wall.

Abstract translation: 一种用于集成电路的半导体衬底，所述半导体衬底包括限定在所述衬底的表面上的沟道。 通道包括第一壁，第二壁和第三壁。 第一个墙壁从表面凹陷。 第二壁从表面延伸到第一壁。 第三壁从表面延伸到第一壁并且穿过通道面向第二壁。 第二壁和第三壁中的至少一个包括从第二壁或第三壁突出到通道中的多个结构。

公开(公告)号：US10969177B2

公开(公告)日：2021-04-06

申请号：US16358262

申请日：2019-03-19

Applicant: HAMILTON SUNDSTRAND CORPORATION

Inventor： Scott R. Bouras

IPC: F28D20/02 ,  F28F3/02 ,  H01L23/373 ,  H01L23/427

Abstract: A pin fin heat sink includes a plurality of pin fins extending from a base plate, at least one of the plurality of pin fins defining a hollow portion therein. The pin fin heat sink also includes an annular ring of metal foam material disposed within the hollow portion, the annular ring of metal foam material having a radially outer surface in direct contact with an inner diameter of the pin fin, the annular ring of metal foam material defining a central cavity. The pin fin heat sink further includes a phase change material disposed within the central cavity.

公开(公告)号：US10098260B2

公开(公告)日：2018-10-09

申请号：US15213212

申请日：2016-07-18

Applicant: Hamilton Sundstrand Corporation

Inventor： Scott R. Bouras ,  Kris H. Campbell ,  Shin Katsumata ,  Charles Shepard

IPC: F25D23/12 ,  H05K7/20

Abstract: A refrigeration system for electronics includes a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system and a condenser disposed downstream of the compressor on the main line. An evaporator line is in fluid communication with the main line downstream of the condenser and has an evaporator configured to receive heat into the refrigerant from an external heat source. The system also includes an immersion line in fluid communication with main line downstream of the condenser. The immersion line includes an immersion cooling container that is configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.

公开(公告)号：US20180103560A1

公开(公告)日：2018-04-12

申请号：US15291160

申请日：2016-10-12

Applicant: Hamilton Sundstrand Corporation

Inventor： Scott R. Bouras

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20272 ,  H05K7/20281

Abstract: A method and system including an immersion cooled line replaceable unit (LRU) with jet impingement immersion cooling are provided. The LRU including an integrated circuit disposed in the immersion cooled LRU, and a synthetic jet ejector disposed in the immersion cooled LRU, wherein the synthetic jet ejector creates a submerged jet impingement flow of cooling fluid toward the integrated circuit.

公开(公告)号：US20150287662A1

公开(公告)日：2015-10-08

申请号：US14692174

申请日：2015-04-21

Applicant: Hamilton Sundstrand Corporation

Inventor： Scott R. Bouras

IPC: H01L23/473 ,  H01L23/367 ,  H01L21/48 ,  H01L21/302 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/473 ,  H01L21/302 ,  H01L21/4803 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/50 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/162 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00

Abstract: A semiconductor substrate for use in an integrated circuit, the semiconductor substrate including a channel defined on a surface of the substrate. The channel includes a first wall, a second wall, and a third wall. The first wall is recessed from the surface. The second wall extends from the surface to the first wall. The third wall extends from the surface to the first wall and faces the second wall across the channel. At least one of the second wall and the third wall includes a plurality of structures projecting into the channel from the second wall or the third wall.

Abstract translation: 一种用于集成电路的半导体衬底，所述半导体衬底包括限定在所述衬底的表面上的沟道。 通道包括第一壁，第二壁和第三壁。 第一个墙壁从表面凹陷。 第二壁从表面延伸到第一壁。 第三壁从表面延伸到第一壁并且穿过通道面向第二壁。 第二壁和第三壁中的至少一个包括从第二壁或第三壁突出到通道中的多个结构。