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    LOGIC CIRCUITRY PACKAGE
    25.
    发明申请
    LOGIC CIRCUITRY PACKAGE 有权

    公开(公告)号：US20210372840A1

    公开(公告)日：2021-12-02

    申请号：US16768650

    申请日：2019-10-25

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Michael W. CUMBIE ,  James Michael GARDNER ,  Scott A. LINN

    IPC: G01F23/24 ,  G01F23/00 ,  B41J2/175

    Abstract: A logic circuitry package includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit including at least one heater and a temperature sensor. The at least one logic circuit is configured to receive, via the interface, a heater command to address the at least one heater. The at least one logic circuit is configured to receive, via the interface, subsequent to the heater command, a sensor command corresponding to a sensor ID to address the temperature sensor. The at least one logic circuit is configured to transmit, via the interface, a digital value in response to the sensor command. The digital value corresponds to a print material level of a print material within a reservoir.

    DUAL DIRECTION DISPENSERS
    26.
    发明申请
    DUAL DIRECTION DISPENSERS 有权

    公开(公告)号：US20210245151A1

    公开(公告)日：2021-08-12

    申请号：US17049761

    申请日：2018-08-10

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Michael W. CUMBIE ,  Chien-Hua CHEN ,  Pavel KORNILOVICH

    IPC: B01L3/00

    Abstract: A dual direction dispenser may include a fluid channel, a first ejection orifice extending in a first direction from the fluid channel, a first fluid actuator to displace fluid through the first ejection orifice, a second ejection orifice extending in a second direction, different than the first direction, from the fluid channel and a second fluid actuator to displace fluid through the second ejection orifice.

    EMBEDDED MICROFLUIDIC DEVICES
    27.
    发明申请
    EMBEDDED MICROFLUIDIC DEVICES 有权

    公开(公告)号：US20210170401A1

    公开(公告)日：2021-06-10

    申请号：US16645200

    申请日：2017-10-12

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua CHEN ,  Michael W. CUMBIE

    IPC: B01L3/00 ,  G01N21/64

    Abstract: A microfluidic system includes, in an example, a substrate and at least two microfluidic devices embedded into the substrate, at least one of the microfluidic devices being different from a remaining number of microfluidic devices. A microfluidic apparatus includes at least two microfluidic devices embedded into a substrate, at least a first microfluidic device of the microfluidic devices being heterogenous to at least a second microfluidic device of the microfluidic devices and a microfluidic channel to fluidically couple the microfluidic devices to each other.

    IMAGING MEDIUM
    28.
    发明申请
    IMAGING MEDIUM 有权

    公开(公告)号：US20210039401A1

    公开(公告)日：2021-02-11

    申请号：US16607823

    申请日：2018-04-13

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Jayprakash C. BHATT ,  Michael W. CUMBIE

    IPC: B41J2/325 ,  B41J31/02

    Abstract: An example of an imaging medium includes an image-receiving substrate, a donor ribbon attached to the image-receiving substrate, and a registration mark. The donor ribbon includes a donor ribbon substrate, a release layer disposed on the donor ribbon substrate, and a color layer disposed on the release layer. The color layer includes a repeated pattern. A repeat of the pattern includes at least adjacent color stripes including a cyan stripe, a magenta stripe, and a yellow stripe, or a grid of four color sections including i) a colored section selected from the group consisting of black, cyan, light cyan, yellow, magenta, and light magenta, ii) a cyan section, iii) a magenta section, and iv) a yellow section. The color layer is in contact with the image-receiving substrate.

    CHIP TO CHIP FLUIDIC INTERCONNECT
    30.
    发明申请
    CHIP TO CHIP FLUIDIC INTERCONNECT 审中-公开

    公开(公告)号：US20200094247A1

    公开(公告)日：2020-03-26

    申请号：US16494856

    申请日：2017-04-21

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Michael W. CUMBIE ,  Viktor SHKOLNIKOV ,  Chien-Hua CHEN

    IPC: B01L3/00 ,  G01N35/00 ,  B01L7/00

    Abstract: A device may include a substrate, a first fluid processing chip, a second fluid processing chip, a tapered channel, and a fluid actuator. The first fluid processing chip may be disposed on the substrate and may process a micro-volume of fluid. The second fluid processing chip may be disposed on the substrate and co-planar with the first fluid processing chip. The second fluid processing chip may process at least a portion of the micro-volume of fluid. The tapered channel may be disposed between the first and second fluid processing chips to transport the at least the portion of the micro-volume of fluid from the first fluid processing chip to the second fluid processing chip. The fluid actuator may be disposed proximate to the tapered channel and may control movement of the at least the portion of the micro-volume of fluid within the tapered channel.

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