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公开(公告)号：US09707754B2
公开(公告)日：2017-07-18
申请号：US14650833
申请日：2012-12-20
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Rio Rivas
CPC classification number: B41J2/14201 , B41J2/1404 , B41J2/14145 , B41J2/1606 , B41J2002/14306
Abstract: In an embodiment, a fluid ejection device includes a thin-film layer formed over a substrate. A primer layer is formed over the thin-film layer, and a chamber layer is formed over the primer layer that defines a fluidic channel leading to a firing chamber. The fluid ejection device includes a slot that extends through the substrate and into the chamber layer through an ink feed hole in the thin-film layer. The fluid ejection device also includes a particle tolerant extension of the primer layer that protrudes into the slot. In some implementations, the particle tolerant primer layer extension extends across a full width of the slot.
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公开(公告)号：US20170120614A1
公开(公告)日：2017-05-04
申请号：US15404113
申请日：2017-01-11
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Rio Rivas , Ed Friesen
IPC: B41J2/175
CPC classification number: B41J2/17553 , B41J2/14137 , B41J2/14145 , B41J2/14201 , B41J2/1603 , B41J2/1607 , B41J2/1623 , B41J2/1631 , B41J2/1632 , B41J2/17559 , B41J2002/14362 , B41J2002/14387
Abstract: A fluid ejection cartridge may include a substrate including substrate ribs that define fluid feed slots extending from a first side to a second side of the substrate, fluid chambers having nozzle openings on a first side of the substrate, an ejection element within each of the fluid chambers and a substrate carrier on a second side of the substrate. The substrate carrier may include carrier ribs that define fluid passageways having oblique centerlines and internal widths that gradually increase from a first wid Attached Attached Attached Attached for your review Attached for your review th proximate the substrate to a second width, greater than the first width, distant the substrate. Concavely tapered adhesive bonds directly contact faces of the substrate ribs and the carrier ribs to adhere the substrate ribs to the carrier ribs.
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公开(公告)号：US20140285576A1
公开(公告)日：2014-09-25
申请号：US13849109
申请日：2013-03-22
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Rio Rivas , Kellie Susanne Jensen , T. Stafford Johnson
CPC classification number: B41J2/155 , B41J2/04541 , B41J2/0455 , B41J2/0457 , B41J2/04581 , B41J2/14024 , B41J2/1433 , B41J2002/14491 , B41J2202/20
Abstract: In one example, a printhead structure includes a cover covering an underlying structure. The cover and the underlying structure define multiple chambers from which fluid may be dispensed through nozzles in the cover and the cover has a stepped edge profile along at least part of the perimeter of the cover.
Abstract translation: 在一个示例中，打印头结构包括覆盖下面的结构的盖。 盖和下面的结构限定多个室，通过盖中的喷嘴可以从中分配流体，并且盖沿着盖的周边的至少一部分具有阶梯状边缘轮廓。
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公开(公告)号：US10118392B2
公开(公告)日：2018-11-06
申请号：US15947197
申请日：2018-04-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Ed Friesen , Rio Rivas , Kelly Ronk
IPC: B41J2/16 , B23K26/382 , B23K26/402 , B41J2/14 , B41J2/175 , B41J29/393 , B23K103/00 , B23K103/08 , B23K103/10 , B23K103/12 , B23K103/14
Abstract: A method of forming a substrate for a fluid ejection device includes forming an opening in the substrate from a second side toward a first side, and further forming the opening in the substrate to the first side, including increasing the opening to the first side and increasing the opening at the second side, and forming the opening with substantially parallel sidewalls intermediate the first side and the second side and converging sidewalls to the first side.
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公开(公告)号：US20180229502A1
公开(公告)日：2018-08-16
申请号：US15947197
申请日：2018-04-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Ed Friesen , Rio Rivas , Kelly Ronk
IPC: B41J2/16 , B41J29/393 , B23K26/402 , B23K26/382 , B41J2/14 , B41J2/175 , B23K103/08 , B23K103/12 , B23K103/00 , B23K103/14 , B23K103/10
CPC classification number: B41J2/162 , B23K26/382 , B23K26/402 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/14 , B23K2103/42 , B23K2103/50 , B23K2103/52 , B23K2103/54 , B23K2103/56 , B41J2/1433 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634 , B41J2/1753 , B41J29/393
Abstract: A method of forming a substrate for a fluid ejection device includes forming an opening in the substrate from a second side toward a first side, and further forming the opening in the substrate to the first side, including increasing the opening to the first side and increasing the opening at the second side, and forming the opening with substantially parallel sidewalls intermediate the first side and the second side and converging sidewalls to the first side.
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Patent Agency Ranking
公开(公告)号：US10005282B2
公开(公告)日：2018-06-26
申请号：US14958870
申请日：2015-12-03
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Rio Rivas , Ed Friesen , Kellie Susanne Jensen
CPC classification number: B41J2/14427 , B41J2/1404 , B41J2/14145 , B41J2/14201 , B41J2/1433 , B41J2002/14403 , B41J2002/14467 , B41J2202/12
Abstract: Fluid ejection devices with particle tolerant thin-film extensions are disclosed. An example apparatus includes a printer; a reservoir; and a printhead including: a firing chamber; a channel to receive fluid from the reservoir, the channel is coupled to the firing chamber, the channel having an opening; and a particle-tolerant film disposed adjacent the opening of the channel, the particle-tolerant film disposed between the channel and the reservoir, the particle-tolerant film to deter particles within the fluid from settling in an area adjacent the opening.
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公开(公告)号：US09895885B2
公开(公告)日：2018-02-20
申请号：US15616990
申请日：2017-06-08
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Rio Rivas
CPC classification number: B41J2/14201 , B41J2/1404 , B41J2/14145 , B41J2/1603 , B41J2/1606 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1645 , B41J2/1646 , B41J2002/14306 , B41J2002/14403 , B41J2002/14467 , B41J2202/12
Abstract: In an embodiment, a fluid ejection device includes a thin-film layer formed over a substrate. A primer layer is formed over the thin-film layer, and a chamber layer is formed over the primer layer that defines a fluidic channel leading to a firing chamber. The fluid ejection device includes a slot that extends through the substrate and into the chamber layer through an ink feed hole in the thin-film layer. The fluid ejection device also includes a particle tolerant extension of the primer layer that protrudes into the slot. In some implementations, the particle tolerant primer layer extension extends across a full width of the slot.
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公开(公告)号：US20160368267A1
公开(公告)日：2016-12-22
申请号：US15257625
申请日：2016-09-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Rio Rivas , Ed Friesen , Lawrence Thurber , Garrett E. Clark , Rosanna L. Bigford
CPC classification number: B41J2/1433 , B32B37/1284 , B32B37/18 , B32B38/0004 , B32B38/0008 , B41J2/01 , B41J2/14024 , B41J2/1603 , B41J2/1623 , B41J2/17503 , B41J2/1753 , Y10T156/1064
Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
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公开(公告)号：US10479080B2
公开(公告)日：2019-11-19
申请号：US16120262
申请日：2018-09-02
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Rio Rivas , Anthony M. Fuller , Ed Friesen
IPC: B41J2/14
Abstract: In an embodiment, a fluid ejection device includes a substrate with a fluid slot formed therein, a chamber layer formed on the substrate defining fluid chambers on both sides of the fluid slot, a thin-film layer between the substrate and chamber layer that defines an ink feedhole (IFH) between the fluid slot and the chamber layer, and a chamber layer extension that forms a bridge across the IFH between two chambers.
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公开(公告)号：US10369788B2
公开(公告)日：2019-08-06
申请号：US15379562
申请日：2016-12-15
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Rio Rivas , Ed Friesen , Terry McMahon , Donald W. Schulte , David Douglas Hall
Abstract: A fluid ejection device may include a substrate having front and back opposing surfaces and a slot extending through the substrate between the back and front surfaces and along an axis of the substrate. A recessed end region may be formed in the back surface at each end of the slot.
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