摘要:
A semiconductor laser drive apparatus comprises a bias current setting section (232) which sets a bias current value on the basis of the drive temperature so that the temperature characteristic of the bias current value with respect to the drive temperature may be a linear function having a slope except zero and a drive current setting section (233) for setting the drive current value on the basis of the drive temperature so that the temperature characteristic of the drive current value with respect to the drive temperature may be a function having a slope except zero. The temperature characteristic of the bias current and that of the drive current are functions different from each other. With this, low cost, space-saving, and power-saving of a semiconductor laser are achieved, and a semiconductor laser drive apparatus enabling a good transmission characteristic on the reception side and a high optical output over the whole drive temperature range when driving the semiconductor laser can be provided.
摘要:
It is possible to reduce a noise component mixed in an analog signal while suppressing increase of power consumption. An amplification unit amplifies the inputted analog signal and converts the amplified signal into a digital signal of a predetermined format for output. The amplification unit includes: an analog circuit unit for processing an analog signal; and a digital circuit unit for processing a digital signal; wherein the circuits are arranged on a substrate. The analog circuit unit includes: an amplification circuit for amplifying the inputted analog signal; and an LPF for cutting off a high frequency component of the amplified analog signal. The digital circuit unit includes: a rectification circuit which rectifies a waveform of the signal whose high-frequency component is cut off; and digital output circuit which converts the waveform-rectified signal into a digital signal of a predetermined format for output.
摘要:
An integrally molding die for manufacturing a package includes a supporting portion for supporting at least one end including an incident/exit port of a light signal in a light transmission path, and a lead frame for mounting an optical element. The integrally molding die includes a recess for forming the supporting portion, a first projection, which comes into contact with an optical element mounting surface of the lead frame, and a second projection, which comes into contact with a back surface of the optical element mounting surface.
摘要:
An organic device has a substrate made of polymer, and a polymer layer adhered on the substrate. A crystallization degree of an adhesive surface with the polymer layer in the substrate is smaller than a crystallization degree of an interior of the substrate. In a manufacturing method for manufacturing an organic device including a substrate made of polymer; and having a polymer layer adhered on the substrate, the manufacturing method includes performing a low crystallization process on an adhesive surface with the polymer layer in the substrate to have a crystallization degree lower than a crystallization degree of an interior of the substrate.
摘要:
A connection member electrically connects an optical element configured to convert an electric signal to an optical signal or to convert an optical signal to an electric signal, a first substrate including an incident/releasing port of an optical transmission path for an optical signal at least one end portion thereof, and a second substrate to each other. The optical transmission path is optically coupled with the optical element to transmit the optical the connection. The connection member includes a connection unit connected to the second substrate and a holding unit having elasticity and holding the first substrate. The holding unit is provided with an electrode at a connecting position to the first substrate, and the holding unit holds the first substrate by connecting the first substrate to the electrode.
摘要:
In a package (5) formed by a supporting portion (5a) for supporting a light emitting portion (7) or a light receiving portion (9) for emitting or receiving an optical signal, and a lid (5b) for covering the supporting portion (5a); the supporting portion (5a) or the lid (5b) includes a light guide mounting surface (22) for supporting at least one end including an incident/exit port of the optical signal in a film light guide (4) for optically coupling with the light emitting portion (7) or the light receiving portion (9) and transmitting the optical signal; and a length (D) in a Z-direction serving as a perpendicular direction with respect to the light guide mounting surface (22) from the light guide mounting surface (22) of the supporting portion (5a) or the lid (5b) to the lid (5b) or the supporting portion (5a) facing the light guide mounting surface (22) is longer than a length (d) in the Z-direction in a region of the film light guide (4) supported by the light guide mounting surface (22). The light guide package having a structure in which the deformation and the damage of the core are less likely to occur even when subjected to impact by vibration and the like is thereby provided.
摘要:
An integrally molding die for manufacturing a package includes a supporting portion for supporting at least one end including an incident/exit port of a light signal in a light transmission path, and a lead frame for mounting an optical element. The integrally molding die includes a recess for forming the supporting portion, a first projection, which comes into contact with an optical element mounting surface of the lead frame, and a second projection, which comes into contact with a back surface of the optical element mounting surface.
摘要:
An optical module has an optical element which transmits or receives an optical signal, an optical transmission line optically coupled to the optical element to transmit the optical signal, and a board to which at least one end portion including an incident and outgoing port of the optical signal in the optical transmission line and the optical element are fixed. A wall facing a side surface of the optical transmission line is provided in the board. A first space is provided between the board and the optical transmission line, and a second space is provided between the side surface of the optical transmission line and the wall. The first and second spaces are filled with a bonding agent.
摘要:
A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.
摘要:
An optical read/write head for a magnetic-optic recording and reproducing unit having a beam splitter placed between a collimator lens and an objective lens. The optical path of the beam reflected by a recording disk is bent by the beam splitter and the beam strikes a polarizing beam splitter. The polarizing beam splitter splits the reflected beam into P and S polarized components whose optical axes form n angel of less than 90.degree.. The rays of the P and S polarized components strike respective light detecting elements and which are co-arranged on substantially the same surface.