公开(公告)号：US07138900B2

公开(公告)日：2006-11-21

申请号：US10853617

申请日：2004-05-25

申请人： Wen-Lung Liu ,  Chi-Hao Chiu ,  Kang-Neng Hsu ,  Szu-Lung Sun

发明人： Wen-Lung Liu ,  Chi-Hao Chiu ,  Kang-Neng Hsu ,  Szu-Lung Sun

IPC分类号： H01C7/10

CPC分类号： H01C17/006 ,  H01C1/142 ,  H01C7/13

摘要： The present invention relates to a resetable over-current protection device. The device is characterized in that: disconnected areas are maintained at end faces of formed cutting regions of the protection device, wherein one or two of the end faces of the formed cutting regions are partly formed with electrically conductive layers so as to increase the lifespan of the device and allows easy manufacturing of the device. The present invention also provides a method of manufacturing the resetable over-current protection device. The method is characterized in that a polymer-based sheet is divided into a plurality of components from which resetable over-current protection devices are subsequently manufactured into the resetable over-current protection devices to save the cost of material.

摘要翻译： 本发明涉及一种可重置的过电流保护装置。 该装置的特征在于：在保护装置的成形切割区域的端面处保持断开的区域，其中形成的切割区域的一个或两个端面部分地形成有导电层，以便增加寿命 该设备并且允许容易地制造该设备。 本发明还提供一种制造可重置过电流保护装置的方法。 该方法的特征在于，聚合物基片材被分成多个部件，随后将可复位的过电流保护装置制造成可复位的过电流保护装置，以节省材料成本。

公开(公告)号：US06929980B2

公开(公告)日：2005-08-16

申请号：US10874273

申请日：2004-06-24

申请人： Chi-Hao Chiu ,  Yu-Wen Chen ,  Chi-Ta Chuang ,  Chi-Sheng Chao

发明人： Chi-Hao Chiu ,  Yu-Wen Chen ,  Chi-Ta Chuang ,  Chi-Sheng Chao

IPC分类号： H01L21/56 ,  H01L21/44

CPC分类号： H01L21/563 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599

摘要： A manufacturing method of a flip chip package mainly comprises the following steps. Initially, a chip having an active surface with a plurality of bumps formed thereon is provided. Next, the active surface of the chip is faced to and disposed on an upper surface of a substrate. In such manner, the chip will be electrically connected to the substrate and a gap between the chip and the substrate will be formed. Afterwards, an underfill is filled in the gap and then a first curing process is performed to have the underfill partially hardened to have the underfill transformed into a partially hardened underfill. Finally, the combination of the chip, the substrate and the partially hardened underfill is flipped over to have the substrate located above the chip, then a second curing process is performed to have the partially hardened underfill into a fully hardened underfill, and then flipping over the combination of the chip, the substrate and the fully hardened underfill.

摘要翻译： 倒装芯片封装的制造方法主要包括以下步骤。 首先，提供具有形成有多个凸块的活性表面的芯片。 接下来，芯片的有源表面面向并设置在基板的上表面上。 以这种方式，芯片将电连接到基板，并且将形成芯片和基板之间的间隙。 之后，在该间隙中填充底部填充物，然后执行第一固化过程以将底部填充部分硬化以将底部填充物转化为部分硬化的底部填充物。 最后，将芯片，基板和部分硬化的底部填充物的组合翻转以使基板位于芯片上方，然后执行第二固化工艺以使部分硬化的底部填充物成为完全硬化的底部填充物，然后翻转 芯片，基板和完全硬化的底部填充物的组合。

公开(公告)号：US08787002B2

公开(公告)日：2014-07-22

申请号：US13612816

申请日：2012-09-12

申请人： Ching-Feng Lin ,  Chi-Hao Chiu ,  Kun-Huang Chang

发明人： Ching-Feng Lin ,  Chi-Hao Chiu ,  Kun-Huang Chang

IPC分类号： H01G4/32

CPC分类号： H01G9/151 ,  H01G9/012 ,  H01G9/08

摘要： A winding-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a winding-type capacitor having a first conductive pin and a second conductive pin. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal electrically connected to the first conductive pin and a second conductive terminal electrically connected to the second conductive pin. The first conductive terminal has a first embedded portion contacting the first conductive pin and enclosed by the package body and a first exposed portion connected to the first embedded portion and exposed from the package body. The second conductive terminal has a second embedded portion contacting the second conductive pin and enclosed by the package body and a second exposed portion connected to the second embedded portion and exposed from the package body.

摘要翻译： 卷绕式固体电解电容器封装结构包括电容器单元，封装单元和导电单元。 导电单元包括具有第一导电引脚和第二导电引脚的绕组型电容器。 封装单元包括用于封闭电容器单元的封装体。 导电单元包括电连接到第一导电引脚的第一导电端子和电连接到第二导电引脚的第二导电端子。 所述第一导电端子具有接触所述第一导电针并被所述封装主体封闭的第一嵌入部分，以及连接到所述第一嵌入部分并从所述封装主体露出的第一暴露部分。 第二导电端子具有接触第二导电引脚并被封装体包围的第二嵌入部分，以及连接到第二嵌入部分并从封装主体露出的第二暴露部分。

公开(公告)号：US08755171B2

公开(公告)日：2014-06-17

申请号：US13613098

申请日：2012-09-13

申请人： Ching-Feng Lin ,  Chi-Hao Chiu ,  Kun-Huang Chang

发明人： Ching-Feng Lin ,  Chi-Hao Chiu ,  Kun-Huang Chang

IPC分类号： H01G2/10 ,  H01G9/08

CPC分类号： H01G9/012 ,  H01G9/08 ,  H01G9/15

摘要： A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of capacitors stacked on top of one another. The package unit includes a package body enclosing the capacitors. The package body has a top surface defining a package length, a package width and an effective package, and the package width is substantially between 85% and 95% of the package length. The conductive unit includes a first conductive terminal electrically connected to the positive portion of the capacitor and a second conductive terminal electrically connected to the negative portion of the capacitor. One part of the first conductive terminal and one part of the second conductive terminal are enclosed by the package body, and another part of the first conductive terminal and another part of the second conductive terminal are exposed from the package body.

摘要翻译： 叠层型固体电解电容器封装结构包括电容器单元，封装单元和导电单元。 电容器单元包括堆叠在彼此顶部的多个电容器。 封装单元包括封装电容器的封装体。 包装体具有限定包装长度，包装宽度和有效包装的顶表面，并且包装宽度基本上在包装长度的85％至95％之间。 导电单元包括电连接到电容器的正部分的第一导电端子和电连接到电容器的负极部分的第二导电端子。 第一导电端子的一部分和第二导电端子的一部分被封装体包围，并且第一导电端子的另一部分和第二导电端子的另一部分从封装体露出。

公开(公告)号：US08654511B2

公开(公告)日：2014-02-18

申请号：US13178464

申请日：2011-07-07

申请人： Chi-Hao Chiu ,  Ching-Feng Lin ,  Kun-Huang Chang

发明人： Chi-Hao Chiu ,  Ching-Feng Lin ,  Kun-Huang Chang

IPC分类号： H01G5/38

CPC分类号： H01G9/012 ,  H01G9/10 ,  H01G9/14 ,  H01G9/15

摘要： A capacitance unit includes an anode portion, an insulating portion, a cathode portion and a colloid portion. The front end of the anode portion extends to from an anode terminal. The insulating portion surrounds the anode portion and covers a first partial surface of the anode portion. The cathode portion is disposed next to the insulating portion, and the cathode portion covers a second partial surface of the anode portion. The colloid portion is disposed next to the insulating portion, and the colloid portion surrounds the cathode portion and covers a partial surface of the cathode portion.

摘要翻译： 电容单元包括阳极部分，绝缘部分，阴极部分和胶体部分。 阳极部分的前端从阳极端子延伸。 绝缘部分包围阳极部分并且覆盖阳极部分的第一部分表面。 阴极部分靠近绝缘部分设置，阴极部分覆盖阳极部分的第二部分表面。 胶体部分靠近绝缘部分设置，胶体部分包围阴极部分并覆盖阴极部分的部分表面。

公开(公告)号：US08373972B2

公开(公告)日：2013-02-12

申请号：US12908129

申请日：2010-10-20

申请人： Ching-Feng Lin ,  Chi-Hao Chiu ,  Wen-Yen Huang ,  Chun-Chia Huang

发明人： Ching-Feng Lin ,  Chi-Hao Chiu ,  Wen-Yen Huang ,  Chun-Chia Huang

IPC分类号： H01G9/00

CPC分类号： H01G9/08 ,  H01G9/15 ,  Y10T29/417

摘要： A solid electrolytic capacitor with a protective structure, which includes stacked capacitor elements electrically connected to the positive and negative terminal. A packaging material such as synthetic resin is used to encapsulate the capacitor elements, the positive terminal, and the negative terminal. Before packaging, a protective layer is formed by a colloid material, which covers the main body of the capacitor that includes the capacitor elements, the positive terminal, and the negative terminal. The protective layer provides a better seal and relieves the external pressure exerting on the capacitor during the packaging process. The protection prevents structural damage to the capacitor's main body while reducing the risk of short-circuits and excessive current leakage.

摘要翻译： 具有保护结构的固体电解电容器，其包括电连接到正端子和负极端子的堆叠电容器元件。 使用诸如合成树脂的包装材料来封装电容器元件，正极端子和负极端子。 在包装之前，通过胶体材料形成保护层，该胶体覆盖包括电容器元件，正极端子和负极端子的电容器的主体。 保护层提供更好的密封，并减轻包装过程中对电容器施加的外部压力。 该保护可防止电容器主体的结构损坏，同时降低短路和过大电流泄漏的风险。

公开(公告)号：US08305734B2

公开(公告)日：2012-11-06

申请号：US12907158

申请日：2010-10-19

申请人： Chi-Hao Chiu ,  Ming-Tsung Chen ,  Chiao-Yinms Yang

发明人： Chi-Hao Chiu ,  Ming-Tsung Chen ,  Chiao-Yinms Yang

IPC分类号： H01G9/08

CPC分类号： H01G9/15 ,  H01G9/08

摘要： An insulating encapsulation structure is applied to a chip type solid electrolytic capacitor that includes an aluminum metallic body having an aluminum core layer. An upper oxide film and a lower oxide film respectively having fine holes on their surfaces are respectively formed on the top and the bottom of the aluminum core layer. On side surfaces of the metallic body is a plurality of cut burrs. The upper oxide film and the lower oxide film of the metallic body are respectively separated by a separating layer to form an anode and a cathode. The insulating encapsulation structure includes an insulating cover layer enclosing an outer surface of the metallic body to cover the cut burrs. Thereby, the required chemical conversion process is reduced along with current leakage, the overall manufacturing cost is lowered, and the mechanical strength for the edge of the metallic body is reinforced.

摘要翻译： 绝缘封装结构被应用于包括具有铝芯层的铝金属体的芯片型固体电解电容器。 在铝芯层的顶部和底部分别形成表面上分别具有细孔的上氧化膜和低氧化膜。 金属体的侧面是多个切割毛刺。 金属体的上部氧化物膜和下部氧化物膜分别通过分离层分离以形成阳极和阴极。 绝缘封装结构包括封闭金属体的外表面以覆盖切割毛刺的绝缘覆盖层。 因此，随着电流泄漏，所需的化学转化过程减少，整体制造成本降低，并且增强了金属体边缘的机械强度。

公开(公告)号：US20110007452A1

公开(公告)日：2011-01-13

申请号：US12713398

申请日：2010-02-26

申请人： Ching-Feng Lin ,  Yui-Hsin Fran ,  Chi-Hao Chiu ,  Ming-Tsung Chen ,  Cheng-Wei Lai ,  Chun-Chia Huang

发明人： Ching-Feng Lin ,  Yui-Hsin Fran ,  Chi-Hao Chiu ,  Ming-Tsung Chen ,  Cheng-Wei Lai ,  Chun-Chia Huang

IPC分类号： H01G9/15

CPC分类号： H01G9/012 ,  H01G2/06 ,  H01G9/15

摘要： A lamellar stacked solid electrolytic capacitor includes a plurality of capacitor units, a substrate unit and a package unit. Each capacitor unit is composed of a negative foil, an isolation paper with conductive polymer substance, a positive foil, an isolation paper with conductive polymer substance and a negative foil that are stacked onto each other in sequence, the positive foils of the capacitor units are electrically connected to each other, the negative foils of the capacitor units are electrically connected to each other, and the positive foils and the negative foils are insulated from each other. The substrate unit has a positive guiding substrate electrically connected to the positive foils of the capacitor units and a negative guiding substrate electrically connected to the negative foils of the capacitor units. The package unit covers the capacitor units and one part of the substrate unit.

摘要翻译： 片状堆叠固体电解电容器包括多个电容器单元，基板单元和封装单元。 每个电容器单元由负箔，具有导电聚合物物质的隔离纸，正箔，具有导电聚合物物质的隔离纸和负箔依次堆叠组成，电容器单元的正箔是 彼此电连接，电容器单元的负箔彼此电连接，并且正箔和负箔彼此绝缘。 基板单元具有电连接到电容器单元的正箔的正引导基板和电连接到电容器单元的负箔的负引导基板。 封装单元覆盖电容器单元和衬底单元的一部分。

公开(公告)号：US20060227544A1

公开(公告)日：2006-10-12

申请号：US11102300

申请日：2005-04-08

申请人： Chi-Hao Chiu ,  Ping-Fu Wang

发明人： Chi-Hao Chiu ,  Ping-Fu Wang

IPC分类号： F21V23/02 ,  F21V7/00

CPC分类号： G02F1/133604 ,  F21V25/00 ,  G02F1/133611 ,  Y10S385/901

摘要： A backlight module is suitable for use in a liquid crystal display. The backlight module includes a back plate, and a lamp, over the back plate by a distance. The back plate has a hole under the lamp. The hole can be a hole under the lamp corresponding to an electrode of a high voltage end of the lamp. The hole or a certain number of the holes can be replaced by an indentation, which can also effectively increase the separation distance between the lamp and the back plate. Actually, the hole and the indentation can be used together to form a desired pattern corresponding to the lamp. The lamp can be a plurality of lamp.

摘要翻译： 背光模块适用于液晶显示器。 背光模块包括背板和灯，在背板上方一段距离。 背板在灯下有一个孔。 孔可以是与灯的高压端的电极相对应的灯下的孔。 孔或一定数量的孔可以通过凹口替代，这也可以有效地增加灯和背板之间的间隔距离。 实际上，孔和凹陷可以一起使用以形成对应于灯的期望图案。 灯可以是多个灯。

公开(公告)号：US20050146050A1

公开(公告)日：2005-07-07

申请号：US10904512

申请日：2004-11-14

申请人： Yu-Wen Chen ,  Chi-Hao Chiu ,  Chung-Yao Kao ,  Ming-Chieh Kao

发明人： Yu-Wen Chen ,  Chi-Hao Chiu ,  Chung-Yao Kao ,  Ming-Chieh Kao

IPC分类号： H01L21/44 ,  H01L21/60 ,  H01L23/00 ,  H01L23/28 ,  H01L23/50

CPC分类号： H01L23/562 ,  H01L23/50 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00

摘要： The present invention provides a flip chip package structure comprising a substrate, a chip and a plurality ofbumps. A plurality of contacts is disposed on the carrying surface and the chip is disposed on the carrying surface of the substrate. The chip includes an active surface and a plurality of bonding pads. The active surface of the chip comprises a bumping region and a plurality of non-bumping regions at corners of the chip, while the bonding pads are disposed within the bumping region of the active surface of the chip. The bumps, respectively disposed on the bonding pads, electrically and mechanically connect the contacts and the bonding pads.

摘要翻译： 本发明提供了一种倒装芯片封装结构，其包括基板，芯片和多个凸点。 多个触点设置在承载表面上，并且芯片设置在基板的承载表面上。 芯片包括有源表面和多个接合焊盘。 芯片的有源表面包括在芯片的拐角处的凸起区域和多个非凸起区域，而焊盘设置在芯片的有源表面的凸起区域内。 分别设置在接合焊盘上的凸块电连接和机械连接触点和接合焊盘。